A pressure sensing metal diaphragm configured for deforming according to a pressure is provided, including: a main body, extending flat, including a through hole and a go-through structure configured for insertion of a movable. A pressure sensing diaphragm assembly including the pressure sensing metal diaphragm and a pressure sensing non-metal diaphragm is further provided, wherein the pressure sensing non-metal diaphragm covers the go-through structure. A pressure gauge including the pressure sensing diaphragm assembly is further provided.

A sensor assembly includes a mounting portion arranged to support a sensing device, a thermal shunt portion extending from the mounting portion, and a housing portion. The housing portion extends from the thermal shunt portion and is arranged on a side of the thermal shunt portion opposite the mounting portion to limit temperature of a sensor connector fixed to the housing portion of the sensor assembly. Gas turbine engines having sensor assemblies and methods of making sensor assemblies are also described.

A differential MEMS pressure sensor includes a topping wafer with a top side and a bottom side, a diaphragm wafer having a top side connected to the bottom side of the topping wafer and a bottom side, and a backing wafer having a top side connected to the bottom side of the diaphragm wafer and a bottom side. The topping wafer includes a first cavity formed in the bottom side of the topping wafer. The diaphragm wafer includes a diaphragm, a second cavity formed in the bottom side of the diaphragm wafer underneath the diaphragm, an outer portion surrounding the diaphragm, and a trench formed in the top side of the diaphragm wafer and positioned in the outer portion surrounding the diaphragm.

A digital pressure sensor includes a substrate, a pressure sensing structure configured for measuring a pressure of an object to be measured, a signal processing chip configured for receiving a sensing signal of the pressure sensing structure, and a rubber cover having an opening through which the pressure is sensed. The pressure sensing structure and the signal processing chip are mounted on the substrate. The signal processing chip has an analog-digital conversion module that converts the sensing signal output by the pressure sensing structure into a digital signal and outputs the digital signal. The signal processing chip is electrically connected to the substrate. The substrate and the rubber cover are connected to each other and form a mounting cavity for holding the pressure sensing structure and the signal processing chip.

Provided is a cover member for an electronic device, the cover member having a through hole extending between a first surface and a second surface. The cover member for an electronic device includes a plurality of long particles that are present in an inner wall facing the through hole and whose longitudinal direction is along a through axis of the through hole in a cross section including the through axis.

In a vacuum gauge that controls a temperature of a sensor section to a high temperature, a circuit board can be sufficiently cooled without applying air to the vacuum gauge from outside. The vacuum gauge includes a sensor section that communicates with a measurement space via a connection port and outputs an output signal according to a pressure in the measurement space, a heater provided around the sensor section to heat the sensor section, a circuit board arranged on a side opposite to the connection port with respect to the sensor section, a first inner case that accommodates the sensor section and the heater, a second inner case that accommodates the circuit board, and an outer case that surrounds the first inner case and the second inner case and forms a flow path, through which outside air flows, together with the first inner case and the second inner case.

An industrial process transmitter includes a housing, sensor circuitry, transmitter circuitry, and a radiation shield. The sensor circuitry is contained in the housing, and is configured to sense a process parameter and generate a sensor output that is indicative of the sensed process parameter. The transmitter circuitry is contained in the housing, and is configured to communicate the sensed process parameter to an external unit. The radiation shield substantially surrounds a portion of the housing containing the sensor circuitry and shields the sensor circuitry from gamma radiation.

Methods, apparatuses and systems for providing sensing components for apparatuses are disclosed herein. An example sensing component comprises: a substrate; a sensing element attached to a surface of the substrate and in electronic communication therewith; a lower coupling element in contact with the sensing element defining a bottom layer of the sensing component; and an upper coupling element disposed adjacent a top surface of the lower coupling element and defining a top layer of the sensing component, wherein the lower coupling element exhibits lower internal stress relative to the upper coupling element.

Pressure sensor systems that include a pressure sensor die and other components in a small, space-efficient package, where the package allow gas or liquid to reach either or both sides of a membranes of the pressure sensor die. A package can include a substrate and a cap, where either or both the substrate and the cap divide the package internally into two chambers. The substrate can have a solid bottom layer, a middle layer having a slot or path running a portion of the length of the layer, and a top layer having two through-holes that provide access to the slot or path. The cap can have two ports. A first port can lead to a first chamber where a top side of a pressure sensor is in the first chamber. A second port can lead to a second chamber and the slot or path, where the slot or path leads to a bottom side of the pressure sensor.

Embodiments for protecting low-pressure blood pressure sensors in high-pressure fluid flow applications by equalizing pressure on both sides of a pressure sensor's diaphragm during high pressure are disclosed. A sensor protection device may include a pressure sensor assembly, a housing, and a plunger assembly. During low pressure, fluid in the primary flow path can flow through the housing, transferring its pressure to a first side of the diaphragm; the plunger assembly can prevent fluid flow into a secondary flow path in the housing, transferring atmospheric pressure to a second side of the diaphragm. During high pressure, fluid can still flow through the primary flow path, and the plunger assembly may now allow fluid flow into the secondary flow path, transferring pressure from the same fluid to the second side of the diaphragm to equal pressure across the diaphragm. The plunger assembly may automatically transition between low- and high-pressure configurations.