The present invention relates to a flexible pressure sensor using a multi-material 3D-printed microchannel mold, and a method for manufacturing the same. An object of the present invention is to provide a flexible pressure sensor using a multi-material 3D-printed microchannel mold, the flexible pressure sensor being formed by using a conductive liquid and an elastomer, having a microchannel formed therein, and having improved flexibility, sensitivity, and stability in comparison to the related art. Another object of the present invention is to provide a method for manufacturing a flexible pressure sensor using a multi-material 3D-printed microchannel mold, in which the flexible pressure sensor is manufactured by using the microchannel mold including microbumps, the microchannel mold being multi-material 3D-printed by using a sacrificial material and a hard material.

A micromechanical device that includes a carrier substrate; a sensor device that is situated on the carrier substrate and spaced apart from a surface section of the carrier substrate with the aid of spring elements in such a way that the sensor device is oscillatable relative to the surface section; and at least one stopper element, situated on the sensor device and/or on the surface section of the carrier substrate, which limits a deflection of the sensor device in the direction of the surface section.

In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip (16) is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

According to one embodiment, a pressure detection device includes a buffer layer formed of an elastic material and including a press surface including a biaxially curved surface and an installation surface including a uniaxially curved surface opposing the press surface with an interval therebetween, and a sheet-shape pressure sensor provided in tight contact with the installation surface and uniaxially curved along the installation surface.

The invention describes a pressure measuring device having a carrier (1), a base (3) which is connected to the carrier (1), and a pressure sensor (5) which is mounted on the base (3) and of which the base area is greater than a base area of the base (5), the pressure sensor (5) being protected against thermomechanical stresses by an end, which is averted from the pressure sensor (5), of the base (3) being adhesively bonded into a recess (17) in the support (1) by means of an adhesive bond (19, 23, 25).

A pressure sensor outputting an electrical signal upon a fluid pressure in a target space includes a diaphragm having a pressure receiving surface disposed in the target space for receiving a fluid pressure, and a back surface on a back side of the pressure receiving surface, an inner member disposed to face the back surface and a diaphragm supporting portion connected to the diaphragm. The diaphragm includes a center portion disposed to face the inner member and is distorted as a concave shape toward the detecting direction because of the heat transmitted to the pressure receiving surface and the distortion of the center portion as a concave shape toward the detecting direction. A contacting portion provided on a connecting portion between the center portion and the outside portion is in contact with the inner member.

A micro-electro-mechanical pressure sensor device, formed by a cap region and by a sensor region of semiconductor material. An air gap extends between the sensor region and the cap region; a buried cavity extends underneath the air gap, in the sensor region, and delimits a membrane at the bottom. A through trench extends within the sensor region and laterally delimits a sensitive portion housing the membrane, a supporting portion, and a spring portion, the spring portion connecting the sensitive portion to the supporting portion. A channel extends within the spring portion and connects the buried cavity to a face of the second region. The first air gap is fluidically connected to the outside of the device, and the buried cavity is isolated from the outside via a sealing region arranged between the sensor region and the cap region.

A pressure sensor comprising a housing, a diaphragm wafer, and an isolator configured to absorb lateral stress. The diaphragm wafer includes a fully exposed diaphragm, a fluid contact surface, a sensing element, and a support portion, where the support portion and the contact surface define a cavity. The isolator extends laterally from the support portion to the housing. The pressure sensor is easily drainable, eliminating the buildup of particulates, and the diaphragm can be directly wire-bonded to printed circuit boards, eliminating the need for extensive electrical feedthrough.

In a pressure sensor, a cap-shaped shielding member (17) to block an electric field undesirable for a signal processing electronic circuit unit of a sensor chip (16) is supported by an end surface of a disk conductive plate (19) between one end surface of the sensor chip (16) in a liquid sealing chamber (13) and a diaphragm (32). The conductive plate (19) is electrically connected via a group of input-output terminals (40ai) and bonding wires (Wi), for example, and the sensor chip 16 is supported by one end portion of a chip mounting member (18) which is electrically connected via the group of input and output terminals (40ai) and the bonding wires (Wi).

A method for manufacturing a MEMS unit for a micromechanical pressure sensor. The method includes the steps: providing a MEMS wafer including a silicon substrate and a first cavity formed therein, under a sensor membrane; applying a layered protective element on the MEMS water; and exposing a sensor core from the back side, a second cavity being formed between the sensor core and the surface of the silicon substrate, and the second cavity being formed with the aid of an etching process which is carried out with the aid of etching parameters changed in a defined manner; and removing the layered protective element.