A human cooperation robot system includes: an external force detecting unit that detects an external force acting on a robot; a retreat operation commanding unit that commands a retreat operation for causing the robot to be moved in a direction such that the external force is decreased when the external force detected by the external force detecting unit is larger than a first threshold value; a position acquiring unit that a current position of the robot; and a retreat operation stopping unit that stops the retreat operation when the current position of the robot acquired by the position acquiring unit departs from a retreat area.

A tool received in a tool holding fixture of a tool holder includes a tool shank defining a recess and a force sensor arranged in the recess. During operation of the tool, the force sensor measures a tool force exerted by the tool shank onto the tool holder. A method for measuring a tool force by using the tool includes the steps of: arranging the force sensor between the tool shank and the tool holding fixture; clamping the force sensor by means of a clamping device of the tool holding fixture; operating the tool; and using the force sensor to measure the tool force exerted by the tool shank onto the tool holder.

The present disclosure describes a method that prevents pre-mature de-chucking in processing modules. The method includes placing a wafer onto a chuck equipped with lift pins. One or more of the lift pins include a pressure sensor configured to measure a pressure exerted by the wafer. The method further includes measuring a first pressure applied to the one or more lift pins by the wafer, lowering the lift pins to place the wafer on the chuck, and processing the wafer. The method also includes removing the wafer from the chuck by pressing the one or more lift pins against the wafer to measure a second pressure exerted by the wafer. If the measured second pressure is equal to the first pressure, the method raises the wafer using the lift pins above the chuck.

Collecting data includes generating a sensor signal from each of a plurality of sensors located on a sensing roll, wherein each signal is generated when each sensor enters a region of a nip between the sensing roll and mating roll during each rotation of the sensing roll; wherein a web of material travels through the nip and a continuous band contacts a region of the web of material upstream from or at the nip. A periodically occurring starting reference is generated associated with each rotation of the continuous band and the signal generated by each sensor is received so that the one of the plurality of sensors which generated this signal is determined and one of a plurality of tracking segments associated with the continuous band is identified. The signal is stored to associate the respective sensor signal with the identified one tracking segment.

A method of monitoring a dicing tape tension is described. The method includes acquiring tension data indicative of the dicing tape tension by automated optical inspection of a dicing tape.

A 2-stage force measuring system particularly useful for a high capacity press. A first stage load cell provides a high force range for measurements over 1,000 lbs. A second stage load cell is for measurements below 1,000 lbs. The assembly improves sensitivity and reduces noise by a factor of 16 (16,000 pounds/1,000 pounds) when pressing less than 1,000 pounds. If a press cycle exceeds 1,000 pounds, the force monitor will automatically and seamlessly transition from the low range load cell to the high range load cell. If the force required is less than 1,000 pounds, only the low range load cell will detect the load, providing a dramatic improvement in force resolution and accuracy.

We disclose a tactile sensing instrumented wafer, which may comprise a substrate; and at least one tactile sensor array disposed on a top surface of the substrate. The at least one tactile sensor array may comprise carbon nanotubes or a piezoelectric transducer. In further embodiments, the instrumented wafer may further comprise a power supply; a memory; a communications interface; and a controller. An instrumented wafer in accordance with embodiments herein may detect both downforce and lateral forces impinging on the wafer, and may be used in a semiconductor device manufacturing system.

The invention relates to a method for measuring the electrode force on welding tongs. The welding tongs have a first electrode arm with a first electrode and a second electrode arm with a second electrode, said second electrode arm lying opposite the first electrode arm. At least one workpiece is clamped between the electrodes during the welding process. The aim of the invention is to provide a method for measuring the electrode force, said method providing an improved signal quality. The method has the following steps: a) measuring a first force acting on the first electrode, b) measuring a second force acting on the second electrode, and c) adding the measured first force and the measured second force, wherein an electrode force signal transmitted from the welding point to the electrodes is amplified, and an interference force signal introduced into the at least one workpiece from the outside and transmitted to the electrodes is eliminated.

A method for sensing a cutting-edge load in a motor-driven machine-tool unit having a stator unit and a rotor unit that is rotatable at least about an axis of rotation. The rotor unit includes a tool receiving unit that is adjustable along the axis of rotation and to which a clamping force can be applied, for fixing and clamping a releasably fixable tool shank of a tool. A tool head of the tool includes at least one individual cutting edge. A tool sensor is provided for sensing the load on the tool, the tool sensor being realized as an individual-cutting-edge sensor for sensing a cutting-edge load on the individual cutting edge.

A torque sensor supporting device capable of preventing bending moment other than torque from occurring to a torque sensor and improving the detection accuracy of the torque sensor. A first supporting body is provided to a base serving as a first mounting section of a robot. A second supporting body is coupled to a second structure of a torque sensor including a first structure provided to the base, the second structure coupled to a first arm serving as a second mounting section, third structures provided between the first structure and the second structure, and at least two sensor sections provided between the first structure and the second structure. Rotating bodies are provided between the first supporting body and the second supporting body.