Disclosed are methods for quantifying the cleanability of a surface of an article, for instance an aircraft interior component. In embodiments, a solution containing an artificial “dirt” is introduced to a surface under test to simulate a sullied condition. The sullied surface is subjected to at least one cleaning process. Obtained reference and post-cleaning light measurements are compared to determine a measurement difference corresponding to a cleanability of the surface and/or effectiveness of the at least one cleaning process. In embodiments, the measurement difference is assigned a cleanability score for at least one of determining a passing or failing cleanability, modifying the cleaning process, indicating the need for a second or subsequent cleaning, modifying the barrier coating formulation, redesigning the article, etc. The disclosed methods provide solutions for objective verification measures of surface cleanability used to facilitate new article designs, materials, barrier coatings, cleaning processes, cleaners, etc.

Disclosed are multifunctional barrier coating forming solutions for surface coating substrates, for instance interior surfaces in aircraft. In embodiments, the solutions include a base coating component in an amount from 5 to 40% by weight of the solution, a solvent in an amount from 50 to 70% by weight of the solution, an FST resistive component in an amount from 0.1 to 5% by weight of the solution, a UV resistive component in an amount from 0.1 to 2% by weight of the solution, an antimicrobial component in an amount from 0.1 to 5% by weight of the solution, and optionally a dye component in an amount less than 0.5% by weight of the solution. Also disclosed are methods for surface coating a substrate with a multifunctional barrier coating forming solution and detecting the same post application to determine a need for barrier coating reapplication.

A patterned wafer is disclosed, in accordance with one or more embodiments of the present disclosure. The patterned wafer may include at least a first material and at least a second material, where the first material may be different from the second material. The patterned wafer may further include a photoluminescent material configured to selectively bind to one of the first material or the second material to enhance a feature of interest.

Stack fault inspection apparatus and method are disclosed. The apparatus includes a sample stage fixing the silicon carbide substrate and allow the incident light to scan the substrate surface; an incident light source configured to irradiate a vertical illumination light of a wavelength corresponding to an energy greater than a band gap energy of the substrate to at least a portion of a surface of the substrate in a direction substantially perpendicular to the surface of the substrate; a photomultiplier tube (PMT) configured to obtain a photoluminescence mapping image having a wavelength corresponding to the band gap energy of the substrate from the surface of the substrate; and a controller configured to process the mapping image and identify stacking faults.

The present invention relates to defects inspection on a silicon carbide wafer or an epitaxial layer thereon to determine the location, and adjustment of the location of the scribe line, which is a separation line forming a gap between adjacent dies. The present invention can obtain high efficiency and economy in the semiconductor process using wafers containing various defects in the surface and thin film, by minimizing the effect of wafer defects on the final yield of the semiconductor chip or die, via adjustment of scribe line positions arranged on the wafer.

An inspection arrangement for fluorescence-based inspection of a product containing at least one fluorophore having an excitation spectrum and an emission spectrum, the inspection arrangement including a radiation source for generating a first electromagnetic radiation in a first wavelength range containing an excitation spectrum and a second electromagnetic radiation in a second wavelength range containing the emission spectrum, an imaging device for generating images of an inspection area in which the product can be arranged, and an image data processing device for image processing of the images. The inspection arrangement captures with the imaging device at least one fluorescence image of the inspection area irradiated with the first electromagnetic radiation and at least one reference image of the inspection area irradiated with the second electromagnetic radiation. The image data processing device generates a correction image based on the at least one fluorescence image and the at least one reference image.

Fluorescent pigment is introduced into the plastic composition, preferably a thermoplastic, especially polyethylene or polypropylene, in the granules formation stage, in addition to possible standard components of the composite, mixed, granules are formed, and then the granules are formed into a finished building material component, and then, with the help of a known fluorimeter, the fluorescence intensity of individual parts of the surface of a plastic element is measured and the homogeneity of the material is inferred on the basis of the differences in the results of the fluorescence intensity measurements.

A fluorescent optical system and a fluorescent image inspection system are provided. The fluorescent optical system includes a platform, at least one light source device, and at least one first filter. The platform is configured for placement of a sample to be inspected. The at least one light source device is configured to illuminate the sample to be inspected, so that the sample to be inspected is stimulated to generate a fluorescent light. The at least one first filter is correspondingly arranged in an optical path of the at least one light source device, so that an excitation light passes through the at least one first filter. An incident angle is formed between the excitation light and the platform, and the incident angle is less than 90 degrees.

A flow of air including a fungal spore is directed to a collection cartridge. The fungal spore is trapped within the collection cartridge. The fungal spore is illuminated with ultraviolet (UV) light and a camera shutter associated with a camera sensor is opened for a time period. The camera sensor is allowed to collect light emitted from the fungal spore during a first portion of the time period. After the first portion of the time period has elapsed, a first burst of visible light originating from a first position is directed towards the fungal spore during a second portion of the time period. A second burst of visible light originating from a second position is directed towards the fungal spore. After the second portion of the time period has elapsed, the camera shutter is closed to generate an image. The image is analyzed to obtain a shape of the fungal spore.

A system for measuring thermal degradation of composites includes a cylindrical body; a bottom cover having a lower central aperture; an upper concave mirror facing the bottom cover with an upper central orifice concentric with a central axis of the body; a lower concave mirror facing the upper concave mirror with a lower central orifice concentric with the central axis; a source of actinic radiation between the upper concave mirror and the lower concave mirror on the central axis to direct actinic radiation through the lower central orifice and lower central aperture; and a camera with an image sensor positioned concentrically relative to the upper central orifice; wherein the bottom cover is adjustable relative to the cylindrical body to provide a focusing function for the image sensor by varying the distance from the lower central orifice and the upper reflective surface.