A colorimetric sensor array includes a CMOS image sensor having a surface including pixels and a multiplicity of colorimetric sensing elements. Each sensing element has a sensing material disposed directly on one or more of the pixels. The colorimetric sensing elements are distributed randomly on the surface of the CMOS image sensor. Fabricating the colorimetric sensor array includes spraying a sensing fluid in the form of droplets directly on a surface of a CMOS image sensor and removing the solvent from the droplets to yield a multiplicity of sensing elements on the surface of the CMOS image sensor. Each droplet covers one or more pixels of the CMOS image sensor with the sensing fluid. The sensing fluid includes a solvent and a sensing material. The droplets are distributed randomly on the surface of the CMOS image sensor.

A biosensing system that measures the concentration of halogenated alkenes is disclosed.

A method for manufacturing an optical sensor is provided. The operations of the method for manufacturing the optical sensor includes providing a semiconductive layer having an electrical circuit area and an optical sensing area; forming a first electrical contact directly over the electrical circuit area; forming a first light guiding part directly over the optical sensing area simultaneously with forming the first electrical contact; forming a first metal layer directly over the first electrical contact; forming a second light guiding part directly over the first light guiding part simultaneously with forming a second electrical contact directly over the first electrical contact; forming a thick metal layer over the electrical circuit area and an optical sensing area; and forming an aperture in the thick metal layer, wherein the aperture aligning with the optical sensing area.

This present invention relates generally to devices, systems, and methods for performing optical and electrochemical assays and, more particularly, to devices and systems having universal channel circuitry configured to perform optical and electrochemical assays, and methods of performing the optical and electrochemical assays using the universal channel circuitry. The universal channel circuitry is circuitry that has electronic switching capabilities such that any contact pin, and thus any sensor contact pad in a testing device, can be connected to one or more channels capable of taking on one or more measurement modes or configurations (e.g., an amperometric measurement mode or a current drive mode).

This present invention relates generally to devices, systems, and methods for performing optical and electrochemical assays and, more particularly, to devices and systems having universal channel circuitry configured to perform optical and electrochemical assays, and methods of performing the optical and electrochemical assays using the universal channel circuitry. The universal channel circuitry is circuitry that has electronic switching capabilities such that any contact pin, and thus any sensor contact pad in a testing device, can be connected to one or more channels capable of taking on one or more measurement modes or configurations (e.g., an amperometric measurement mode or a current drive mode).

A colorimetric sensor array includes a CMOS image sensor having a surface including pixels and a multiplicity of colorimetric sensing elements. Each sensing element has a sensing material disposed directly on one or more of the pixels. The colorimetric sensing elements are distributed randomly on the surface of the CMOS image sensor. Fabricating the colorimetric sensor array includes spraying a sensing fluid in the form of droplets directly on a surface of a CMOS image sensor and removing the solvent from the droplets to yield a multiplicity of sensing elements on the surface of the CMOS image sensor. Each droplet covers one or more pixels of the CMOS image sensor with the sensing fluid. The sensing fluid includes a solvent and a sensing material. The droplets are distributed randomly on the surface of the CMOS image sensor.

Systems, devices and methods for monitoring a physical property over time are disclosed. A monitoring device in accordance with the present disclosure may comprise an electronic chip assembly, at least one light source, at least one monitoring label comprising a chemical configured to absorb light depending upon at least one physical property, and at least one photodiode configured to collect light emitted by the at least one monitoring label and provide at least one measurement corresponding to the at least one physical property. The at least one measurement may correspond to a past or present status of the at least one physical property. The monitoring device may be communicatively coupled to a user device configured to run an application that collects and store the at least one measurement provided by the at least one photodiode.

Various embodiments may provide an optical sensing device based on surface plasmon resonance (SPR). The optical sensing device may include an optical arrangement configured to provide a first polarization light beam and a second polarization light beam, and a first optical member including a sensing surface, the first optical member configured to receive the first and second polarization light beams and reflect the first and second polarization light beams at the sensing surface. The optical sensing device may further include a second optical member arranged to receive the reflected first and second polarization light beams from the first optical member and configured to separate the reflected first and second polarization light beams in a first direction and a second direction, respectively. The optical device may additionally include a detector arrangement configured to detect the reflected first and second polarization light beams from the second optical member.

A method for manufacturing an optical sensor is provided. The operations of the method for manufacturing the optical sensor includes providing a semiconductive layer having an electrical circuit area and an optical sensing area; forming a first electrical contact directly over the electrical circuit area; forming a first light guiding part directly over the optical sensing area simultaneously with forming the first electrical contact; forming a first metal layer directly over the first electrical contact; forming a second light guiding part directly over the first light guiding part simultaneously with forming a second electrical contact directly over the first electrical contact; forming a thick metal layer over the electrical circuit area and an optical sensing area; and forming an aperture in the thick metal layer, wherein the aperture aligning with the optical sensing area.

Disclosed are a zero-power detecting sensor of a chemical substance and a sensing method. As light is irradiated to the detecting sensor including a graphene, a light absorbing layer, and an electrode stacked, the chemical substance is detected without power.