An example system for detecting pipe defects is provided. The system includes a transmitter, a receiver and a processing device. The transmitter is oriented to transmit Terahertz (THz) waveform pulses towards at least one of an outer surface of a pipe or an inner surface of the pipe. The receiver is oriented to receive reflected Terahertz (THz) waveform pulses from at least one of the outer surface of the pipe or the inner surface of the pipe. The processing device configured is to receive as input the Terahertz (THz) waveform pulses transmitted from the transmitter and the reflected Terahertz (THz) waveform pulses received by the receiver and, based on the received input, determine if a defect in the pipe exists.

A computer-based system and method for taking clarity measurements of a gem, and a computer-readable medium having computer-executable instructions, are provided and include receiving a pixilated image of a gem and identifying pixels representing an inclusion. The method and medium further include determining characteristics of the inclusion as a function of the pixels representing the inclusion, and providing a clarity grade based upon the determined characteristics. Also provided is a method for mapping a gem, and a computer-readable medium having computer-executable instructions, which include receiving a pixilated image of a gem having facet edges, and identifying pixels representing the facet edges. The method and medium further include generating a diagram of the gem, such that the diagram is a function of the pixels representing the facet edges, and superimposing the diagram onto the pixilated image.

A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

A vehicle imaging station for capturing images of scratches on a vehicle, the vehicle imaging station including a tunnel having an entrance and an exit, with one or more walls defining an enclosure between the entrance and exit to define a tunnel volume containing a vehicle pathway having a central axis. The station further includes a reflection source surface and a camera arranged with a field of view including an imaging volume of the tunnel volume in which an image defined by the reflection source surface will be reflected to be visible to the camera as a reflected image by a vehicle moving along the vehicle pathway. The station also includes a color modifier arranged to cause the reflection source surface to adopt a first color of a plurality of possible colors in response to a color control signal such that the reflected image has the first color.

An optical system includes an illumination module configured to illuminate a sample object with at least one angle-variable illumination geometry. The optical system includes an imaging optical unit configured to produce an imaged representation of the sample object that is illuminated with the at least one angle-variable illumination geometry on a detector. The optical system includes the detector, which is configured to capture at least one image of the sample object based on the imaged representation. The optical system includes a controller configured to determine a result image based on a transfer function and the at least one image. A method includes illuminating a sample object with at least one angle-variable illumination geometry, imaging the sample object on a detector, based on the imaged representation, capturing at least one image of the sample object, and, based on a transfer function and the at least one image, determining a result image.

An image processing system includes one or more processors that select one target algorithm from evaluation algorithms, calculate an evaluation value indicating adaptation to image measurement using the target algorithm and one or more evaluation images corresponding to an evaluation lighting pattern for each evaluation lighting pattern, and determine a lighting pattern to be used for the image measurement from evaluation lighting patterns based on the evaluation value.

An illumination device for illuminating a region monitored by at least one image sensor. The illumination device has at least one light source carrier with at least one light source arranged thereon. Furthermore, the illumination device has a control and interface unit and an adjusting unit, which can be actuated by the control and interface unit and with which the light source carrier is positionally adjustable.

A computer-based system and method for taking clarity measurements of a gem, and a computer-readable medium having computer-executable instructions, are provided and include receiving a pixilated image of a gem and identifying pixels representing an inclusion. The method and medium further include determining characteristics of the inclusion as a function of the pixels representing the inclusion, and providing a clarity grade based upon the determined characteristics. Also provided is a method for mapping a gem, and a computer-readable medium having computer-executable instructions, which include receiving a pixilated image of a gem having facet edges, and identifying pixels representing the facet edges. The method and medium further include generating a diagram of the gem, such that the diagram is a function of the pixels representing the facet edges, and superimposing the diagram onto the pixilated image.

This illumination optical system comprises a laser light source 301, 401, 501, a light collection optical system 311, 411, 511, and a support structure 312, 412 that is able to secure the laser light source and the light collection optical system, wherein the light from the laser light source is focused onto an object to be inspected 307, 407, 507. The light collection optical system comprises a cylindrical mirror 306, 406, 506, and at least one cylindrical lens 304, 404a, 404b, 404c, 504a, 504b, 504c. The cylindrical mirror is an optical element that collects light in a first direction, and the cylindrical lens is an optical element that collects light in a second direction perpendicular to the first direction. The focal distance of the cylindrical lens to the object to be inspected is greater than the focal distance of the cylindrical mirror to the object to be inspected.

A defect inspecting method and apparatus for inspecting a surface state including a defect on a wafer surface, in which a polarization state of a laser beam irradiated onto the wafer surface is connected into a specified polarization state, the converted laser beam having the specified polarization state is inserted onto the wafer surface, and a scattering light occurring from an irradiated region where the laser beam having the specified polarization state is irradiated, is separated into a first scattering light occurring due to a defect on the wafer and a second scattering light occurring due to a surface roughness on the wafer. An optical element for optical path division separates the first and second scattering lights approximately at the same time.