Disclosed are methods and apparatus for detecting defects or reviewing defects in a semiconductor sample. The system has a brightfield (BF) module for directing a BF illumination beam onto a sample and detecting an output beam reflected from the sample in response to the BF illumination beam. The system has a modulated optical reflectance (MOR) module for directing a pump and probe beam to the sample and detecting a MOR output beam from the probe spot in response to the pump beam and the probe beam. The system includes a processor for analyzing the BF output beam from a plurality of BF spots to detect defects on a surface or near the surface of the sample and analyzing the MOR output beam from a plurality of probe spots to detect defects that are below the surface of the sample.

The invention relates to a method in the preparation of samples for microscopic examination onto which a coverslip is applied. The method is notable for the fact that the coverslipping quality is checked automatically and at least partly optically. The invention further relates to an apparatus for carrying out the method, and to an apparatus for checking the coverslipping quality of samples onto which a coverslip is applied.

An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122). The synchronization controller (140) is configured to directly or indirectly control the plurality of detectors (111, 112) and the plurality of light sources (121, 122) based on the position of the OUI (102) so that each of them is individually activated and deactivated according to a timing profile, that each of the detectors (111, 112) is able to capture images of the OUI (102) in an illumination mode provided by a corresponding one of the light sources (121, 122), and that when any one of the light sources (121, 122) is illuminating the OUI (102), only the one of the detectors (111, 112) corresponding to this light source (121, 122) is activated. Through the timing control over the multiple light sources (121, 122) and detectors (111, 112) by the synchronization controller (140), inspection with multiple measurement configurations can be accomplished within a single scan, resulting in a significant improvement in inspection efficiency.

A die bonding apparatus includes a first illumination device for irradiating a die with light along an optical axis of a photographing device, and a second illumination device that is located above the first illumination device and irradiates the die with light having a predefined angle with respect to the optical axis. The second illumination device includes a second light emitting section, and a light path control member that limits a light path of second irradiation light emitted from the second light emitting section. The second illumination device is disposed in such a way that the second irradiation light, the light path of which is limited by the light path control member, passes through the cylinder of the first illumination device, and the top surface of the die is irradiated with the second irradiation light.

A defect inspection apparatus includes a first objective lens having an optical axis is perpendicular to a wafer mounting surface of the stage, a second objective lens having an optical axis forms a predetermined acute angle with respect to the wafer mounting surface of the stage, and a dichroic mirror which reflects light having a first wavelength and transmits or reflects light having a second wavelength. Emitted light of a first optical path 111 from a first light source which is reflected from or transmitted through the dichroic mirror and first emitted light and second emitted light polarized and separated from a second light source which are transmitted through or reflected from the dichroic mirror are incident on the first objective lens, and emitted light of a second optical path from the first light source is incident on the second objective lens.

Embodiments of the present disclosure relate to methods for defect inspection. After pattern features are formed in a structure layer, a dummy filling material having dissimilar optical properties from the structure layer is filled in the pattern features. The dissimilar optical properties between materials in the pattern features and the structure layer increase contrast in images captured by an inspection tool, thus increasing the defect capture rate.

An inspection system for inspecting multiple surfaces of a substrate includes at least one illuminator that produces light at a first wavelength that is incident on the substrate at a first angle (e.g., normal) and light at a second wavelength directed that is obliquely incident on the substrate. An adjustment system adjusts the oblique angle. The substrate may be opaque to one of the wavelengths and at least partially transparent to the other wavelength. Detection optics collect backscattered light from the substrate and at least one detector generates a first image representative of the first surface of the substrate and a second image representative of a second surface or near the second surface of the substrate. The images may be compared to generate a third image representative of defects on or near the second surface of the substrate corrected for residual signals of defects on the first surface.

There is described an online inspection method and system having an illumination system that provides bright-field and dark-field illumination concurrently or sequentially, at varying intensities, in order to acquire images that may be read by an image processing device. The image processing device may obtain measurements of features in the images and evaluate acceptability of the features.

An optical metrology device is capable of detection of any combination of photoluminescence light, specular reflection of broadband light, and scattered light from a line across the width of a sample. The metrology device includes a first light source that produces a first illumination line on the sample. A scanning system may be used to scan an illumination spot across the sample to form the illumination line. A detector collects the photoluminescence light emitted along the illumination line. Additionally, a broadband illumination source may be used to produce a second illumination line on the sample, where the detector collects the broadband illumination reflected along the second illumination line. A signal collecting optic may collect the photoluminescence light and broadband light and focus it into a line, which is received by an optical conduit. The output end of the optical conduit has a shape that matches the entrance of the detector.

Reflective or embossed regions are supposed to be illuminated as uniformly as possible over the greatest possible angle range for optical inspection using in one aspect an apparatus for inspection having a passive lighting body spotlighted by a spotlight light source, which body illuminates a test region, as well as at least one optical sensor directed at the test region. The lighting body is configured to be partially transmissible, and the optical sensor is disposed, with reference to the test region, optically beyond the lighting body, detecting the test region through the lighting body, and/or the spotlight light source is directed at the lighting body and the lighting body extends continuously over at least 120° in a section plane that stands perpendicular to the surface of the flat items to be tested or inspected.