In a crack detection device (10), an image acquisition unit (21) acquires image data acquired by taking an image of a road surface from an oblique direction with respect to the road surface, An image classification unit (22) classifies image data acquired into an acceptable range with a resolution higher than a standard value, and an unacceptable range with a resolution equal to or less than the standard value. A data output unit (23) outputs acceptable data being image data of a part classified into the acceptable range as data to detect a crack on the road surface. An image display unit (24) displays data output.

An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122). The synchronization controller (140) is configured to directly or indirectly control the plurality of detectors (111, 112) and the plurality of light sources (121, 122) based on the position of the OUI (102) so that each of them is individually activated and deactivated according to a timing profile, that each of the detectors (111, 112) is able to capture images of the OUI (102) in an illumination mode provided by a corresponding one of the light sources (121, 122), and that when any one of the light sources (121, 122) is illuminating the OUI (102), only the one of the detectors (111, 112) corresponding to this light source (121, 122) is activated. Through the timing control over the multiple light sources (121, 122) and detectors (111, 112) by the synchronization controller (140), inspection with multiple measurement configurations can be accomplished within a single scan, resulting in a significant improvement in inspection efficiency.

The present disclosure provides techniques for optical inspection systems and methods for moving objects. In some embodiments, an optical inspection system includes: a first and a second image capturing device configured to acquire images from moving objects; a first and a second first-stage storage system; a first and a second second-stage processor; a second-stage storage system; a third-stage processor; and a third-stage storage system. In some embodiments, an optical inspection system, includes: a first and a second image capturing device; a first and a second volatile memory system; a first and a second second-stage processor; a third second-stage processor; and a third-stage storage system. The first and second second-stage processors can be configured to analyze the images from the image capturing devices. The third-stage processor or the third second-stage processor can be configured to process information from a processor and/or storage system and produce a report.

An inspection system (1600), a lithography apparatus, and an inspection method are provided. The inspection system (1600) includes an illumination system (1602), a detection system (1606), and processing circuitry (1622). The illumination system generates a first illumination beam (1610) at a first wavelength and a second illumination beam (1618) at a second wavelength. The first wavelength is different from the second wavelength. The illumination system irradiates an object (1612) simultaneously with the first illumination beam and the second illumination beam. The detection system receives radiation (1620) scattered by a particle (1624) present at a surface (1626) of the object at the first wavelength. The detection system generates a detection signal. The processing circuitry determines a characteristic of the particle based on the detection signal.

An inspection device includes: an analyzer to calculate a parameter representing a feature of image data of an object having no defect by performing dimensionality reduction on the image data, and perform dimensionality reduction on image data of an object to be inspected by using the parameter; a restorer to generate restored data obtained by restoring the image data of the object to be inspected subjected to the dimensionality reduction; a corrector to filter the restored data by using a filter for correcting an error between the restored data and the image data of the object to be inspected, thereby generating corrected restored data; a determiner to output a determination result indicating whether the object to be inspected is defective, based on a difference of each pixel between the image data of the object to be inspected and the corrected restored data; and an interface to output the determination result.

Self-leveling inspection system methods and devices for use in inspecting buried pipes or other cavities are disclosed. The system includes a camera head with an image sensor, an orientation sensor, and a signal processing module including a processing programmed to receive an image from the image sensor, and an orientation signal from the orientation sensor, generate a second image based at least in part on information provided from the orientation sensor, and store the second image in a non-transitory memory.

Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.

Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

An electronic apparatus including a display and one or more processor is disclosed. The one or more processor is configured to: divide a first error value of each of a plurality of first components with respect to a mounting position acquired through inspection of a plurality of substrates of a first type, into a plurality of error values, generate a graph of a tree structure including a plurality of nodes corresponding to the plurality of first components, component types of each of the plurality of first components and a plurality of components included in a mounter, adjust attributes of each of the plurality of nodes using the plurality of error values divided from the first error value of each of the plurality of first components, and display the graph in which the attributes of each of the plurality of nodes are adjusted, on the display.