A method of processing an analog signal includes receiving, into signal processing circuitry from compensation circuitry, an offset compensation signal, the offset compensation signal having (i) a polarity opposite a polarity of a gain error of the signal processing circuitry and (ii) a magnitude equal to a nominal compensation value plus a deviation. The method includes generating, by the signal processing circuitry, an output signal based on an analog signal received into the signal processing circuitry, including applying the offset compensation signal to an intermediate signal generated by the signal processing circuitry. The method includes scaling the output signal based on the deviation between the magnitude of the offset compensation signal and the nominal compensation value.

Wafer taping apparatuses and methods are provided for determining whether taping defects are present on a semiconductor wafer, based on image information acquired by an imaging device. In some embodiments, a method includes applying an adhesive tape on a surface of a semiconductor wafer. An imaging device acquires image information associated with the adhesive tape on the semiconductor wafer. The presence or absence of taping defects is determined by defect recognition circuitry based on the acquired image information.

A polarized image acquisition apparatus includes a division type half-wave plate, located opposite to the mask substrate with respect to an objective lens and near an objective lens pupil position, to arrange P and S polarized waves of the transmitted light having passed through the objective lens to be mutually orthogonal, a Rochon prism to separate trajectories of P and S polarized waves, an imaging lens to form images of P and S polarized waves having passed through the Rochon prism at image formation positions different from each other, a mirror, in a case where one of P and S polarized waves is focused/formed at one of the different image formation positions, to reflect the other wave at the other position, a first sensor to capture an image of one of P and S polarized waves, and a second sensor to capture an image of the other wave.

Based on a plurality of first pattern images, a first angle image with each pixel having irradiation angle information of first measuring pattern lights on the measurement object is generated, and based on a plurality of second pattern images, a second angle image with each pixel having irradiation angle information of second measuring pattern lights on the measurement object is generated. In accordance with the irradiation angle information of each pixel in the first angle image, the irradiation angle information of each pixel in the second angle image, and relative position information of a first light projection unit and a second light projection unit, the height of the measurement object in a direction of a central axis of a lighting device is measured.

A detection apparatus improves abnormality detection accuracy after start of an inspection operation while reducing the amount of work that is done before the start of the operation. The apparatus includes an object characteristic storage device that stores a parameter indicating a characteristic of an abnormal object, an object detection unit that detects an abnormal object candidate from image information by using the parameter, an object storage unit that stores the abnormal object candidate, an object display unit that displays the abnormal object candidate stored in the object storage unit, a calibration input unit that receives input of calibration information on the abnormal object candidate, and, based on the calibration information, corrects the abnormal object candidate stored in the object storage unit, and an object characteristic calibration unit that calibrates the parameter stored in the object characteristic storage device, based on the calibration information received by the calibration input unit.

Self-leveling inspection system methods and devices for use in inspecting buried pipes or other cavities are disclosed. A camera head may include an image sensor, an orientation sensing module, and an image processing module with programming to adjust an image or video provided from the image sensor, based at least in part on information provided from the orientation sensor.

An automatic optical inspection (AOI) device and method are disclosed. The device is adapted to inspect an object under inspection (OUI) (102) carried on a workpiece stage (101) and includes: a plurality of detectors (111, 112) for capturing images of the OUI (102); a plurality of light sources (121, 122) for illuminating the OUI (102) in different illumination modes; and a synchronization controller (140) signal-coupled to both the plurality of detectors (111, 112) and the plurality of light sources (121, 122). The synchronization controller (140) is configured to directly or indirectly control the plurality of detectors (111, 112) and the plurality of light sources (121, 122) based on the position of the OUI (102) so that each of them is individually activated and deactivated according to a timing profile, that each of the detectors (111, 112) is able to capture images of the OUI (102) in an illumination mode provided by a corresponding one of the light sources (121, 122), and that when any one of the light sources (121, 122) is illuminating the OUI (102), only the one of the detectors (111, 112) corresponding to this light source (121, 122) is activated. Through the timing control over the multiple light sources (121, 122) and detectors (111, 112) by the synchronization controller (140), inspection with multiple measurement configurations can be accomplished within a single scan, resulting in a significant improvement in inspection efficiency.

Based on a plurality of first pattern images, a first angle image with each pixel having irradiation angle information of first measuring pattern lights on the measurement object is generated, and based on a plurality of second pattern images, a second angle image with each pixel having irradiation angle information of second measuring pattern lights on the measurement object is generated. In accordance with the irradiation angle information of each pixel in the first angle image, the irradiation angle information of each pixel in the second angle image, and relative position information of a first light projection unit and a second light projection unit, the height of the measurement object in a direction of a central axis of a lighting device is measured.

There is disclosed a method and an apparatus for monitoring textile yarn quality. Textile yarn is checked for quality to meet the required criteria such as diameter evenness and unwanted foreign fiber presence by utilizing an artificial diffuse light illuminating image sensor, with the yarn placed as an obstacle, into the pathway of the light, the contours of the light being focused for sharp image capture. The yarn diameter is determined by processing of focused yarn image.

A substrate inspection device includes an imaging part that is disposed in a chamber and obtains an input image by photographing a substrate coated with a solution, and an analysis part that converts brightness data of the input image into grayscale data and analyzes a film shape of a pixel region based on the grayscale data.