Patent classifications
G01N2203/0076
HARDNESS PREDICTION METHOD OF HEAT HARDENED RAIL, THERMAL TREATMENT METHOD, HARDNESS PREDICTION DEVICE, THERMAL TREATMENT DEVICE, MANUFACTURING METHOD, MANUFACTURING FACILITIES, AND GENERATING METHOD OF HARDNESS PREDICTION MODEL
The hardness of a rail after the rail having a temperature equal to or higher than an austenite region temperature is forcibly cooled in a cooling facility is predicted. A plurality of sets of data for learning composed of a cooling condition data set and output data of hardness are acquired using a model that performs computing by using a cooling condition data set having at least a surface temperature of the rail before the start of cooling and the operating conditions of the cooling facility as input data and the hardness inside the rail after the forced cooling as output data.
SYSTEMS AND METHODS FOR MATERIAL TEST SYSTEMS UTILIZING SHARED DATABASES
Example networked material testing systems include: a database system storing a shared database, the shared database storing a material test procedure and material test result data; a first material test system communicatively coupled to the database system and configured to perform a first type of material test; and a second material test system communicatively coupled to the database system and configured to perform the first type of material test; wherein the database system comprises a computing device configured to execute machine readable instructions which cause the computing device to: transmit a first test program to the first material test system for performance of the first type of material test on a first specimen according to the first test program; store, in the shared database, first test result data received from the first material test system based on execution of the first test program; transmit a second test program to the second material test system for performance of the first type of material test on a second specimen according to the second test program; store, in the shared database, second test result data received from the first material test system or the second material test system based on execution of the second test program; and generate one or more test reports based on the first test program, the first material test system that performed the first test program, the second test program, and the second material test system that performed the second test program.
Dual indentation test method
A dual indentation test method according to an aspect of the present disclosure may include a first indentation step of indenting a surface of a material using a flat first indenter and a second indentations step of indenting the surface of the material indented by the first indenter using a second indenter.
Crushing system for large-size natural gas hydrate rock samples
A crushing system for large-size natural gas hydrate rock samples, which mainly includes a crushing and stirring control subsystem, crushing and stirring execution subsystem and hydrate preparation subsystem. Full automatic control to parameter acquisition and experimental process is achieved by utilizing modern automation technology, including the function of automatically crushing the large-size natural gas hydrate rock samples and also monitoring, collecting and storing the drilling pressure, the torque and the internal furnace pressure and temperature parameters during the crushing process in real time, to provide reliable guarantee for the follow-up researches on crushing mechanism, crushing efficiency, drilling parameter optimization, rock crushing ability evaluation of a crushing tool and the like of the large-size natural gas hydrate rock samples and necessary experimental verification means for optimization of on-site exploiting construction conditions of natural gas hydrate.
WEARABLE SENSOR-BASED SURFACE ANALYSIS
Disclosed aspects pertain to surface analysis based on wearable sensor data. Sensor data can be acquired from pressure-sensitive wearable sensors, such as shoe insole sensors, based on interaction with a surface. A location can also be determined for the sensor data with respect to a surface utilizing a positioning system. The sensor data can be utilized to determine surface properties at a particular location. Further, a graphical representation of the surface properties and location can be generated and conveyed for display on a display. Furthermore, movement instructions can be provided to aid in analysis of an entire surface, and recommendations can be made regarding surface maintenance based on collected sensor data.
Durometer
An object of the present invention is to provide a durometer enabling a contact portion in contact with an object to perform smooth piston motion. The durometer includes a main body unit including a movable unit pressed continuously against an object to be measured, a first sensor outputting acceleration information corresponding to an acceleration of movement of a contact part of the object to be measured in contact with the movable unit in a pressing direction, a second sensor outputting reactive force information corresponding to a reactive force at the contact part of the object to be measured in contact with the movable unit, a motor, a crank mechanism driven by the motor and causing the main body unit and the movable unit to perform piston motion, and at least one buffering member disposed on a periphery of the main body unit.
METHODS AND DEVICES FOR EVALUATING THE CONTENTS OF MATERIALS
Methods for determining the hardness and/or ductility of a material by compression of the material are provided as a first aspect of the invention. Typically, compression is performed on multiple sides of a geologic material sample in a contemporaneous manner. Devices and systems for performing such methods also are provided. These methods, devices, and systems can be combined with additional methods, devices, and systems of the invention that provide for the analysis of compounds contained in such samples, which can indicate the presence of valuable materials, such as petroleum-associated hydrocarbons. Alternatively, these additional methods, devices, and systems can also stand independently of the methods, devices, and systems for analyzing ductility and/or hardness of materials.
METHOD FOR MEASURING STOOL CONSISTENCY AND METHOD FOR EVALUATING STOOL STATE USING SAME
For providing a method capable of physically and objectively evaluating the consistency and state of a stool, provided is a method for measuring a stool consistency with a texture analyzer provided with a probe, the probe having a shape capable of measuring a consistency of a stool in a liquid form and in a solid form.
Guide for Compression Test
The present disclosure provides for a guide for use in a compression test, the compression test comprising loading a test sample between a first loading plate and an opposing load applied between the test sample and the first loading plate in a loading direction, the guide comprising: at least one support member, positionable between the first loading plate and the load and extending substantially parallel to the loading direction to constrain the test sample in a direction perpendicular to the loading direction, wherein, when in use, the at least one support member is positioned to define a space between the first loading plate and the support member such that when a load is applied the test sample is deformable in a direction perpendicular to the loading direction within the space.
METHOD FOR PREPARING SAMPLE FOR WAFER LEVEL FAILURE ANALYSIS
Embodiments of the present application provide a method for preparing a sample for wafer level failure analysis. The method includes that: a plurality of splitting points are formed on a surface of a selected region of a to-be-analyzed sample along a preset direction, the plurality of splitting points being arranged in a straight line; and the to-be-analyzed sample is split by taking the straight line where the plurality of splitting points are located as a splitting line, to expose a cross section of a side surface of the to-be-analyzed sample and form the sample for the wafer level failure analysis.