A detection system serves for X-ray inspection of an object. An imaging optical arrangement serves to image the object in an object plane illuminated by X-rays generated by an X-ray source. The imaging optical arrangement comprises an imaging optics to image a transfer field in a field plane into a detection field in a detection plane. A detection array is arranged at the detection field. An object mount holds the object to be imaged and is movable relative to the light source via an object displacement drive along at least one lateral object displacement direction in the object plane. A shield stop with a transmissive shield stop aperture is arranged in an arrangement plane in a light path and is movable via a shield stop displacement drive in the arrangement plane. A control device has a drive control unit, which is in signal connection with the shield stop displacement drive and with the object displacement drive for synchronizing a movement of the shield stop displacement drive and the object displacement drive. The result is an optimization of an X-ray illumination of the object to achieve a high-resolution object imaging.

An electron beam detection apparatus for a semiconductor device and an electron beam detection assembly are disclosed, the electron beam detection apparatus including a stage, which is configured to carry and hold the semiconductor device at a top surface of the stage, and is translatable in two directions orthogonal to each other, an aiming device, configured to determine a position of the semiconductor device in a coordinate system of the electron beam detection apparatus by capturing an image of the semiconductor device, the aiming device provided with a first field of view and a first optical axis, and an electron beam detection device, configured to detect an emergent electron beam exiting the semiconductor device by projecting an electron beam to the semiconductor device, the electron beam detection device provided with a second field of view and a second optical axis which is not consistent with the first optical axis.

An apparatus for inspecting a semiconductor device according to an embodiment includes an X-ray irradiation unit configured to make monochromatic X-rays obliquely incident on the semiconductor device, which is an object at a predetermined angle of incidence, a detection unit configured to detect observed X-rays observed from the object using a plurality of two-dimensionally disposed photodetection elements, an analysis apparatus configured to generate X-ray diffraction images obtained by photoelectrically converting the observed X-rays, and a control unit configured to change an angle of incidence and a detection angle of the X-rays, in which the analysis apparatus acquires an X-ray diffraction image every time the angle of incidence is changed, extracts a peak X-ray diffraction image, X-ray intensity of which becomes maximum for each of pixels and compares the peak X-ray diffraction image among the pixels to thereby estimate a stress distribution of the object.

A method for detecting the maximum potential presence of a material in an object. The method includes obtaining raw x-ray image data comprising a plurality of pixels for the object from an X-ray scanning device, wherein each pixel of the plurality of pixels has associated therewith an attenuation value and an effective atomic number (Z.sub.eff) for the pixel. The method further includes converting, for each pixel having a Z.sub.eff value greater than a threshold effective atomic number (Z.sub.eff-threshold), the Z.sub.eff at the pixel to the Z.sub.eff-threshold while applying a correction factor to the attenuation value for the pixel to bring the attenuation value into correspondence with the conversion of the Z.sub.eff value for the pixel and determining a maximum potential amount of the material present at each pixel based on the corrected attenuation value at the pixel. This renders material more apparent in visual display.

A method of determining at least one x-ray scanning system geometric property includes the steps of positioning a calibration device inside a scanning chamber of the scanning device, the chamber being intersected by at least one fan beam of x-rays during a scanning operation, measuring a distance between the calibration device and at least one inner wall of the chamber, scanning the calibration device to produce an image of the calibration device, identifying pixels representing the a geometric feature of the calibration device in the image, determining a position and orientation of the pixels representing the geometric feature in the image and, determining a scanning system property based on the position and orientation of the pixels representing the geometric feature in the image. The position and orientation of the feature in the scanning chamber and the x-ray scanning system property may be determined simultaneously.

A spent and/or decommissioned accumulator treatment plant and process, wherein a plurality of objects originating from separate waste collection of spent and/or decommissioned accumulators, nominally comprising lead-acid accumulators and accumulators and objects of a different type, are subject to an X-ray scan. If an analysis of the X-ray scan indicates that an object is not a lead-acid accumulator, and in particular is a lithium-ion battery or accumulator, it is deviated out of the treatment workflow, that comprises grinding the objects and separating lead from other materials.

A device for measuring short-wavelength characteristic X-ray diffraction based on array detection, and a measurement and analysis method based on the device are provided. An array detector of the device only detects and receives a diffraction ray which is diffracted by a material of a to-be-measured part inside a sample and passes through a through hole of a receiving collimator, and rays passing through a positioning hole. The to-be-measured part inside the sample is placed at the center of the diffractometer circle of the device. The method is performed with the device. With the present disclosure, a diffraction pattern of a part inside the sample with a centimeter thickness, i.e. Debye rings, can be rapidly and non-destructively measured, thereby rapidly and non-destructively measuring and analyzing crystal structures, and its crystal structural change of the part inside the sample, such as phase, texture, and stress.

Described herein are a computed tomography scanning system for inspecting an object and methods incorporating the same. The system includes an imaging assembly including a frame positioned within an underground chamber below a ground surface, a platform coupled to and translatable with respect to the frame, and a stage coupled to and rotatable with respect to the platform. The platform is translatable to raise the object above the ground surface and lower the object below the ground surface when the object is on the stage. The imaging assembly also includes an X-ray source fixed with respect to the frame and configured to emit radiation that is attenuated by the object as the platform translates and the stage rotates, and an X-ray detector fixed with respect to the frame, the X-ray detector configured to detect the radiation transmitted through the object and generate a signal representative of the transmitted radiation.

A real-time inline digital tomosynthesis system according to an embodiment of the present disclosure includes a subject moving rail configured to move a subject in a preset direction and at a preset speed, a pair of an X-ray generator and an X-ray detector fixedly provided to face each other in a first direction of the subject moving rail, a subject position identifier configured to identify and notify a current position of the subject based on an image or a sensor, and an image reconstructor configured to obtain a plurality of X-ray images having different subject positions through the X-ray detector based on the current position of the subject, and then reconstruct and output the plurality of X-ray images as at least one of a tomographic image for each section and one three-dimensional (3D) image.

A method for the X-ray inspection of products of a predefined product type including at least one first component and one second component having different absorption coefficients for X-radiation. X-radiation with a spectral range is transmitted through a product to be examined. The X-radiation that has passed through the product is detected by means of a spectrally resolving X-ray detector. The spectrally resolving X-ray detector assigns the X-ray quanta to a number of energy channels and generates image data which for each pixel include spectral values for selected or all energy channels and/or total spectral values for one or more groups of adjacent energy channels. At least one mapping rule is used to process the image data to form a total image, where each mapping rule is designed such that spectral values or total spectral values are mapped onto a total image value of an image point.