A radiation imaging system includes a radiation imaging apparatus and an imaging control apparatus, the radiation imaging apparatus includes a dose detection pixel that detects a dose of radiation irradiated from a radiation source, and the imaging control apparatus controls the radiation imaging apparatus. Before radiation imaging, the imaging control apparatus specifies a position of the dose detection pixel in a region of interest for calculating a dose indicator value of a radiation image, determines a threshold according to the position of the dose detection pixel, and transmits the position of the dose detection pixel and the threshold to the radiation imaging apparatus. The radiation imaging apparatus makes a setting of the position of the dose detection pixel in the region of interest and the threshold transmitted from the imaging control apparatus, and performs imaging based on the setting.

A method and system for determining concentricity of a multiple layer golf ball are disclosed herein. One or more images of a golf ball are generated using an X-ray source, a camera or a digital detector, and an image intensifier. An edge detection algorithm is preferably utilized. The method also includes calculating Y,Z center coordinates of the a best fit diameter or ellipse of the inner edge layer and outer edge layer of the multiple layer golf ball.

In some embodiments, the present specification describes methods for displaying a three-dimensional image of an isolated threat object or region of interest with a single touch or click and providing spatial and contextual information relative to the object, while also executing a view dependent virtual cut-away or rendering occluding portions of the reconstructed image data as transparent. In some embodiments, the method includes allowing operators to associate audio comments with a scan image of an object. In some embodiments, the method also includes highlighting a plurality of voxels, which are indicative of at least one potential threat item, in a mask having a plurality of variable color intensities, where the intensities may be varied based on the potential threat items.

A device and method for measuring angles of orientation of an x-ray imaging system including an x-ray source, an x-ray detector and a sample holder arranged to receive a sample to be analysed. The method includes: emitting a polychromatic x-ray beam through a reference sample installed on the sample holder in order to form a diffraction pattern on the sensing area of the x-ray detector, generating, with the x-ray detector, an observed image comprising the diffraction pattern, and determining the orientation of the x-ray source and the orientation of the x-ray detector by comparing the observed image with at least one target image comprising a diffraction pattern obtained for the reference sample with preset orientations of the x-ray source and of the x-ray detector.

A radiation imaging apparatus includes an attenuation member for reducing reflection of components arranged on a backside of the radiation imaging apparatus generated by back scattered radiation that has reflected on a structure on the backside of the radiation imaging apparatus, the attenuation member being provided on the backside of the radiation incident plane of the radiation detection unit, wherein the attenuation member is made of a material with a higher atomic number and a material with a lower atomic number than a material with a highest atomic number among materials of the component, covers an end portion of an outer shape of the component overlapping the radiation detection unit in orthogonal projection onto the second plane, and is smaller in area than the radiation detection unit.

An optical inspection is performed to detect potential defects within integrated circuit devices and a first electron-based inspection of less than all of the potential defects is performed to identify primary actual defects. A process window of manufacturing parameter settings used to manufacture the integrated circuit devices is identified and the integrated circuit devices manufactured using the manufacturing parameter settings inside the process window have less than a threshold number of the primary actual defects. To identify additional actual defects a second electron-based inspection is performed that is limited to selected ones of the potential defects in the integrated circuit devices that were manufactured using the manufacturing parameter settings inside the process window but were uninspected in the first electron-based inspection.

There is provided a system and method of measuring a lateral recess in a semiconductor specimen, comprising: obtaining a first image acquired by collecting SEs emitted from the surface of the specimen, and a second image acquired by collecting BSEs scattered from an interior region of the specimen between the surface and a target second layer, the specimen scanned using an electron beam with a landing energy selected to penetrate to a depth corresponding to the target second layer; generating a first GL waveform based on the first image, and a second GL waveform based on the second image; estimating a first width of the first layers based on the first GL waveform, and a second width with respect to at least the target second layer based on the second GL; and measuring a lateral recess based on the first width and the second width.

In measuring a dimension of an object to be measured W made of a single material, a plurality of transmission images of the object to be measured W are obtained by using an X-ray CT apparatus, and then respective projection images are generated. The projection images are registered with CAD data used in designing the object to be measured W. The dimension of the object to be measured W is calculated by using a relationship between the registered CAD data and projection images. In such a manner, high-precision dimension measurement is achieved by using several tens of projection images and design information without performing CT reconstruction.

An X-ray imaging system using multiple puked X-ray sources to perform highly efficient and ultrafast 3D radiography is presented. There are multiple puked X-ray sources mounted on a structure in motion to form an array of sources. The multiple X-ray sources move simultaneously relative to an object on a pre-defined arc track at a constant speed as a group. Electron beam inside each individual X-ray tube is deflected by magnetic or electrical field to move focal spot a small distance. When focal spot of an X-ray tube beam has a speed that is equal to group speed but with opposite moving direction, the X-ray source and X-ray flat panel detector are activated through an external exposure control unit so that source tube stay momentarily standstill equivalently. 3D scan can cover much wider sweep angle in much shorter time and image analysis can also be done in real-time.

In some examples, there is described a method for processing inspection data associated with cargo irradiated by a plurality of successive pulses of X-rays. The method may involve obtaining the inspection data, the inspection data being generated as a result of scanning the cargo using a matrix including a plurality of at least two rows of detectors, and a source of the plurality of successive pulses. In some examples radiation corresponding to the plurality of successive pulses irradiating the cargo is arranged in a first order on the plurality of rows of detectors of the matrix and one or more successive reconstruction zones for the inspection data and corresponding to different orders are determined. Intermediate images of the cargo and an average image are generated. On the generated average image, pixels may be selected and neighbourhoods of the pixels having fewer artefacts may be extracted.