There is provided an acquiring method of a projection image of a sample whose shape is uneven with respect to a rotation center, the method comprising the steps of setting the sample S0 at a position of the rotation center C0 provided between an X-ray source 116a and a detector 117, and acquiring the projection image of the sample S0 at each different rotation angle for each different magnification ratio over a rotation angle of 180° or more by rotating the sample S0 around the rotation center C0, and by relatively changing a separation distance between the X-ray source and the rotation center, or a separation distance between the rotation center and the detector in an optical axis direction according to the shape of the sample S0 and the rotation angle of the sample S0.

Provided is a method of diagnosing the degradation of a lithium secondary battery in a non-destructive manner without disassembling the battery, which includes: obtaining, from X-ray diffraction (XRD) data obtained during first charging of the lithium secondary battery, a first graph showing the change of the c-axis d-spacing value of the layered positive electrode active material according to the number of moles of lithium ions deintercalated from the layered positive electrode active material during the charging; obtaining, from XRD data obtained during second charging of the lithium secondary battery, a second graph showing the change of the c-axis d-spacing value of the layered positive electrode active material according to the number of moles of lithium ions deintercalated from the layered positive electrode active material during the charging; and classifying a cause of degradation of the secondary battery by comparing the first graph and the second graph.

The present invention is intended to provide improved patterned X-ray emitting targets as well as X-ray sources that include patterned X-ray emitting targets as well as X-ray reflectance scatterometry (XRS) systems and also including X-ray photoelectron spectroscopy (XPS) systems and X-ray fluorescence (XRF) systems which employ such X-ray emitting targets.

Embodiments may relate an x-ray filter. The x-ray filter may be configured to be positioned between an x-ray source output and a device under test (DUT) that is to be x-rayed. The x-ray filter may include at least 80% titanium (Ti) by weight. Other embodiments may be described or claimed.

To provide a charged particle beam image processing device in which a proper inspection region for an observation image that includes an edge of a line pattern can be set.

A charged particle beam image processing device performs image processing on an observation image generated by a charged particle beam apparatus, the charged particle beam image processing device includes: an extraction unit configured to extract an edge of a line pattern from an inspection region of the observation image; a division unit configured to divide the inspection region into sections each having a plurality of measurement points; a measurement unit configured to measure a line edge roughness in each of the sections and generate distribution data of the line edge roughness in each section; a calculation unit configured to calculate a line edge roughness in the entire inspection region and calculate a theoretical curve of the line edge roughness in each section; and a determination unit configured to determine whether the inspection region is proper based on a comparison between the distribution data and the theoretical curve.

A system is disclosed for the examination and inspection of integrated devices such as integrated circuits using 3-D laminography. X-rays are transmitted through the integrated device, and are incident on a photoemissive structure that absorbs x-rays and emits electrons. The electrons emitted by the photoemissive structure are shaped by an electron optical system to form a magnified image of the emitted electrons on a detector. This magnified image is then recorded and processed. In some embodiments, the incidence angle of the x-rays is varied to gather multiple images that allow internal three-dimensional structures of the integrated device to be determined using computed laminography. In some embodiments, the recorded images are compared with reference data to enable inspection for manufacturing quality control.

The method includes: determine a first integrated value by integrating measured values of widths of reference patterns (210A) belonging to a first group; determine a second integrated value by integrating measured values of widths of reference patterns (210B) belonging to a second group; performing second matching between patterns on an image of a second region and corresponding CAD patterns; determining a third integrated value by integrating measured values of widths of patterns (220A) belonging to a first group; determining a fourth integrated value by integrating measured values of widths of patterns (220B) belonging to a second group; and determining that the second matching has been performed correctly when the magnitude relationship between the third integrated value and the fourth integrated value coincides with the magnitude relationship between the first integrated value and the second integrated value.

A correction amount specifying apparatus comprises circuitry for storing diffraction data including a combination of the diffraction angle of the irradiation X-rays with respect to the sample rotation angle and the sample surface height, the diffraction data being acquired by irradiating X-rays to a standard sample that is an aggregate of isotropic and stress free crystal particles, determining a first correspondence relationship based on the diffraction data, and specifying a correction amount of the sample surface height with respect to a desired sample rotation angle and a desired diffraction angle based on the first correspondence relationship.

An insulated electrical component of an insulated electrical machine includes a conducting element, a first radiographically-visible conductor sensor node coupled to the conducting element, at least one second radiographically-visible conductor sensor node coupled to the conducting element a first distance in a predetermined direction from the first radiographically-visible conductor sensor node, and an insulating material bonded to the conducting element. In some embodiments, the insulated electrical component further includes a first radiographically-visible insulator sensor node coupled to the insulating material and not coupled to the conducting element and at least one second radiographically-visible insulator sensor node coupled to the insulating material and not coupled to the conducting element a second distance from the first radiographically-visible insulator sensor node. The radiographically-visible sensor nodes are distinguishable from the conducting element and the insulating material in a radiographic image. Methods of manufacturing and non-destructive testing of insulated electrical components are also disclosed.

The system for in-situ real-time measurements of microstructure properties of 3D-printing objects during 3-D printing processes. An intensive parallel X-ray beam (with an adjustable beam size) impinges on a printing object and is diffracted on a crystal lattice of the printing material. The diffracted radiation impinges on a reflector formed with an array of reflector crystals mounted on an arcuated substrate. The diffracted beams reflected from the reflector crystals correspond to the diffraction intensity peaks produced by interaction of the crystal lattice of the printing material with the impinging X-ray beam. The intensities of the diffraction peaks are observed by detectors which produce corresponding output signals, which are processed to provide critical information on the crystal phase composition, which is closely related to the defects and performance of the printing objects. The subject in-situ technology provides an effective and efficient way to monitor, in real-time, the quality of 3D-printing parts during the 3-D printing process, with a significant potential for effective process control based on the reliable microstructure feedback.