G01N2223/66

ANTI-VIBRATION FIXTURING SYSTEM FOR NONDESTRUCTIVE TESTING
20230039471 · 2023-02-09 ·

Described is an anti-vibration fixture comprising a radiolucent enclosure and a vibration-dampening material attached to an inside face of the radiolucent enclosure. The vibration-dampening material is configured to receive a component for nondestructive testing by computed tomography (CT) scanning. The anti-vibration fixture further comprises a plurality of fasteners attached to opposing faces of the radiolucent enclosure.

LATERAL RECESS MEASUREMENT IN A SEMICONDUCTOR SPECIMEN

There is provided a system and method of measuring a lateral recess in a semiconductor specimen, comprising: obtaining a first image acquired by collecting SEs emitted from the surface of the specimen, and a second image acquired by collecting BSEs scattered from an interior region of the specimen between the surface and a target second layer, the specimen scanned using an electron beam with a landing energy selected to penetrate to a depth corresponding to the target second layer; generating a first GL waveform based on the first image, and a second GL waveform based on the second image; estimating a first width of the first layers based on the first GL waveform, and a second width with respect to at least the target second layer based on the second GL; and measuring a lateral recess based on the first width and the second width.

Anti-vibration fixturing system for nondestructive testing

Described is an anti-vibration fixture comprising a radiolucent enclosure and a vibration-dampening material attached to an inside face of the radiolucent enclosure. The vibration-dampening material is configured to receive a component for nondestructive testing by computed tomography (CT) scanning. The anti-vibration fixture further comprises a plurality of fasteners attached to opposing faces of the radiolucent enclosure.

Multiple image segmentation and/or multiple dynamic spectral acquisition for material and mineral classification
20220319206 · 2022-10-06 · ·

The invention relates to method and system configured for material analysis and mineralogy. At least one image based on first emission from a sample is provided. First spectra of the sample based on second emissions from the second scan locations of the image are provided. A confidence score is calculated for every first spectrum, and second scan location(s) with confidence score(s) below a threshold value are selected. Second emissions from the selected second scan location(s) are acquired to provide new image and determine new second scan locations within the respective new image.

Method and system for wafer defect inspection

Methods for locating and characterizing defects can include performing a first scan of a substrate to produce a first defect map including a first set of coordinates of one or more defects of the substrate and performing a second scan of one or more regions of the substrate associated with the defects based on the first defect map to produce one or more electron channeling contrast (ECC) images of the defects. Characterization of the defects can be based on the ECC images alone or in combination with other techniques. Such methods can include determining a second set of coordinates associated with the one or more defects based on the ECC images and directing an ion beam toward the substrate and milling the substrate based on the second set of coordinates.

X-RAY IMAGING APPARATUS
20220057340 · 2022-02-24 · ·

In an X-ray imaging apparatus, an image processor is configured to generate a super-resolved image having higher resolution in an X direction than a first fluoroscopic X-ray image and a second fluoroscopic X-ray image by dividing, in the X direction, a pixel value of a first pixel in the first fluoroscopic X-ray image based on pixel values of two pixels in the second fluoroscopic X-ray image that overlap the first pixel when the first fluoroscopic X-ray image and the second fluoroscopic X-ray image are shifted in the X direction by an amount corresponding to a movement amount (of an X-ray detection position) and displayed in an overlapping manner

Method and system for performing EDS analysis
09726625 · 2017-08-08 · ·

The disclosure provides methods and systems for identifying materials using charged particle beam systems combined with x-ray spectroscopy systems.

METHOD AND DEVICE FOR ANALYZING DIFFRACTIONPATTERN OF MIXTURE, AND INFORMATION STORAGE MEDIUM
20220187225 · 2022-06-16 ·

Provided is a method of analyzing a diffraction pattern of a mixture, the method including: a first step of fitting, through use of a fitting pattern including a term obtained by multiplying a known target pattern indicating a target component by a first intensity ratio, and a term obtained by multiplying an unknown pattern indicating a residual group consisting of one or more residual components by a second intensity ratio, and having the first intensity ratio, the second intensity ratio, and the unknown pattern as fitting parameters, the fitting pattern to the observed pattern by changing the first and the second intensity ratio in a state where the unknown pattern is set to an initial pattern; and a second step of fitting the fitting pattern to the observed pattern by changing the unknown pattern while restricting the changes of the first and the second intensity ratio.

IN-SITU X-RAY DIFFRACTION ANALYSIS APPARATUS INCLUDING PELTIER-TYPE TEMPERATURE CONTROL UNIT AND ANALYZING METHOD USING THE SAME

An in-situ X-ray analysis apparatus includes: a potentiostat connected to an in-situ electrochemical cell and configured to control a voltage, current, and time of the in-situ electrochemical cell, or to record voltage, current, resistance, capacity, and time information of the in-situ electrochemical cell; an X-ray analysis apparatus configured to obtain X-ray diffraction information of the in-situ electrochemical cell; and a controller connected to the X-ray analysis apparatus and the potentiostat and configured to provide or receive a signal to or from each of the X-ray analysis apparatus and the potentiostat.

METHOD FOR TREATING AND EXAMINING A POWDER BY MEANS OF INSTRUMENTAL ANALYSIS AND USE
20220023943 · 2022-01-27 ·

The application relates to a method for treating and examining a powder by: generating two-dimensional tomographic representation of an initial small amount of powder granules of the powder; determining and outputting an initial powder granule structural parameter based on the two-dimensional tomographic representation of the initial small amount of powder; producing a solid body including a statistically validatable powder representation of a totality of the powder granules of the powder; tomographically representing the solid body, wherein at least one imaging parameter and/or at least one image recording setting is adjusted based on the initial powder granule structural parameter; and determining and outputting at least one characteristic value of the statistically validatable powder representation of the powder granules of the powder by evaluating the tomographic representation of the solid body.