Estimating wear on bottom hole assembly (BHA) components utilizes a rock hardness index using analysis of drill cutting. Estimating the amount of wear on borehole assembly components comprises measuring the rock properties in drilled cuttings from a borehole. A hardness value is assigned to each mineral present in the drilled cuttings. A hardness index is calculated for a drilled borehole interval. A wear resistance factor is assigned to each BHA component of the BHA. The wear resistance factor depends on the wear resistance of each BHA component. A wear value for each BHA component is calculated based on the hardness index for the drilled borehole interval, the wear resistance of the BHA component, and drilling parameters.

Estimating wear on bottom hole assembly (BHA) components utilizes a rock hardness index using analysis of drill cutting. Estimating the amount of wear on borehole assembly components comprises measuring the rock properties in drilled cuttings from a borehole. A hardness value is assigned to each mineral present in the drilled cuttings. A hardness index is calculated for a drilled borehole interval. A wear resistance factor is assigned to each BHA component of the BHA. The wear resistance factor depends on the wear resistance of each BHA component. A wear value for each BHA component is calculated based on the hardness index for the drilled borehole interval, the wear resistance of the BHA component, and drilling parameters.

Technologies are described for methods and systems effective for flex plates. The flex plates may comprise a base plate. The base plate may include walls that define an insert location opening in the base plate. The insert location opening in the base plate may be in communication with a securement area. The flex plates may comprise an insert. The insert may include a reservoir region and a crystallization region separated by a wall including channels. The reservoir region and the crystallization region may include a backing. The insert may further include securement tabs. The securement tabs may be configured to secure the insert to the base plate at the securement area.

A doubly bent X-ray spectroscopic device (1) according to the present invention includes: a glass plate (3) which is deformed into a shape having a doubly bent surface by being sandwiched between a doubly curved convex surface (21a) of a convex forming die (21) and a doubly curved concave surface (22a), of a concave forming die (22), that matches the doubly curved convex surface (21a), and being heated to a temperature of 400° C. to 600° C.; and a reflection coating (5) configured to reflect X-rays, which is formed on a concave surface (3a) of the deformed glass plate (3 ).

A doubly bent X-ray spectroscopic device (1) according to the present invention includes: a glass plate (3) which is deformed into a shape having a doubly bent surface by being sandwiched between a doubly curved convex surface (21a) of a convex forming die (21) and a doubly curved concave surface (22a), of a concave forming die (22), that matches the doubly curved convex surface (21a), and being heated to a temperature of 400° C. to 600° C.; and a reflection coating (5) configured to reflect X-rays, which is formed on a concave surface (3a) of the deformed glass plate (3 ).

Methods for using electron diffraction holography to investigate a sample, according to the present disclosure include the initial steps of emitting a plurality of electrons toward the sample, forming the plurality of electrons into a first electron beam and a second electron beam, and modifying the focal properties of at least one of the two beams such that the two beams have different focal planes. Once the two beams have different focal planes, the methods include focusing the first electron beam such that it has a focal plane at or near the sample, and focusing the second electron beam so that it is incident on the sample, and has a focal plane in the diffraction plane. An interference pattern of the first electron beam and the diffracted second electron beam is then detected in the diffraction plane, and then used to generate a diffraction holograph.

Methods for using electron diffraction holography to investigate a sample, according to the present disclosure include the initial steps of emitting a plurality of electrons toward the sample, forming the plurality of electrons into a first electron beam and a second electron beam, and modifying the focal properties of at least one of the two beams such that the two beams have different focal planes. Once the two beams have different focal planes, the methods include focusing the first electron beam such that it has a focal plane at or near the sample, and focusing the second electron beam so that it is incident on the sample, and has a focal plane in the diffraction plane. An interference pattern of the first electron beam and the diffracted second electron beam is then detected in the diffraction plane, and then used to generate a diffraction holograph.

The purpose of the present invention is to increase accuracy of a specific test using an electronic microscope and improve work efficiency. Provided is a system that identifies test recipe information corresponding to an object to be tested on the basis of attribute information about a testing sample, and analyzes and evaluates the object to be tested contained in the testing sample by checking image data and element analysis data that are acquired by a measuring device in accordance with a control program for the test recipe information, against reference image data and reference element analysis data that are used as evaluation references for the object to be tested.

A method for evaluating an array of high aspect ratio (HAR) structures on a sample includes illuminating the sample with an x-ray beam along a first axis parallel to within two degrees to the HAR structures in the array and sensing a first pattern of small angle x-ray scattering (SAXS) scattered from the sample while illuminating the sample along the first axis. The sample is illuminated with the x-ray beam along a second axis that is oblique to the HAR structures in the array, and a second pattern of the SAXS scattered from the sample is sensed while illuminating the sample along the second axis. Information is extracted with respect to the HAR structures based on the first and second patterns.

A method for evaluating an array of high aspect ratio (HAR) structures on a sample includes illuminating the sample with an x-ray beam along a first axis parallel to within two degrees to the HAR structures in the array and sensing a first pattern of small angle x-ray scattering (SAXS) scattered from the sample while illuminating the sample along the first axis. The sample is illuminated with the x-ray beam along a second axis that is oblique to the HAR structures in the array, and a second pattern of the SAXS scattered from the sample is sensed while illuminating the sample along the second axis. Information is extracted with respect to the HAR structures based on the first and second patterns.