Non-destructive inspection systems (10) and methods for inspecting structural flaws that may be in a structure (15) based on guided wave thermography. The method may include sweeping a frequency-phase space to maximize ultrasonic energy distribution across the structure while minimizing input energy, e.g., via a plurality of actuators. The system may include transducer elements (12, 14, 16, 17) configured to predominantly generate shear horizontal-type guided waves in the structure to maximize thermal response from any flaws.

Non-destructive inspection systems (10) and methods for inspecting structural flaws that may be in a structure (15) based on guided wave thermography. The method may include sweeping a frequency-phase space to maximize ultrasonic energy distribution across the structure while minimizing input energy, e.g., via a plurality of actuators. The system may include transducer elements (12, 14, 16, 17) configured to predominantly generate shear horizontal-type guided waves in the structure to maximize thermal response from any flaws.

The invention is directed to a method for the production of an optoelectronic module including a support (5) and an additional layer, said support being formed by an assembly (25) which has no optoelectronic properties and which comprises, successively, a metal substrate (27), a dielectric coating (29) disposed on the metal substrate, and an electrically conductive layer (31) disposed on the dielectric coating. The production method comprises: a step of providing the support and performing a method in which the support is checked, or providing the support after it has already been checked; and a step of depositing at least one additional layer on the electrically conductive layer. The method in which support is checked comprises the following steps: electrical excitation of the support by bringing the metal substrate and the electrically conductive layer into electrical contact with a voltage source (33); and photothermal examination of the excited support so as to detect any possible fault (49, 51) located at least partially in the dielectric coating (29) and to provide a photothermal examination result.

The invention is directed to a method for the production of an optoelectronic module including a support (5) and an additional layer, said support being formed by an assembly (25) which has no optoelectronic properties and which comprises, successively, a metal substrate (27), a dielectric coating (29) disposed on the metal substrate, and an electrically conductive layer (31) disposed on the dielectric coating. The production method comprises: a step of providing the support and performing a method in which the support is checked, or providing the support after it has already been checked; and a step of depositing at least one additional layer on the electrically conductive layer. The method in which support is checked comprises the following steps: electrical excitation of the support by bringing the metal substrate and the electrically conductive layer into electrical contact with a voltage source (33); and photothermal examination of the excited support so as to detect any possible fault (49, 51) located at least partially in the dielectric coating (29) and to provide a photothermal examination result.

A method for inspecting a component is presented. The method includes inducing, by an inductive coil, an electrical current flow into the component. Further, the method includes capturing, by an infrared (IR) camera, at least a first set of frames and a second set of frames corresponding to the component, wherein the first set of frames is captured at a first time interval and a second set of frames is captured at a second time interval. Also, the method includes constructing, by a processing unit, a thermal image based on at least the first set of frames and the second set of frames corresponding to the component. Furthermore, the method includes determining presence of a thermal signature in the thermal image, wherein the thermal signature is representative of a defect in the component.

Devices, systems, and techniques relating to steam trap monitoring are described. These include battery-less steam trap monitors that run on power harvested from their environments, systems for acquiring steam trap monitor data for the traps in a facility or across multiple facilities, and techniques for processing steam trap monitor data to reliably determine the status of individual steam traps and potentially other system parameters.

Devices, systems, and techniques relating to steam trap monitoring are described. These include battery-less steam trap monitors that run on power harvested from their environments, systems for acquiring steam trap monitor data for the traps in a facility or across multiple facilities, and techniques for processing steam trap monitor data to reliably determine the status of individual steam traps and potentially other system parameters.

A method for evaluating a turbine component includes inducing a thermal response of the component at an initial time, capturing a two-dimensional infrared image of the thermal response of the component with a thermal imaging device, wherein the two-dimensional infrared image comprises a plurality of infrared image pixels, generating a two-dimension to three-dimension mapping template to correlate two-dimensional infrared image data with three-dimensional locations on the component, mapping at least a subset of the plurality of infrared image pixels of the two-dimensional infrared image to three-dimensional coordinates using the mapping template, and generating a three-dimensional infrared image and infrared data of the component from the mapped infrared image pixels to three-dimensional coordinates, wherein the three-dimensional infrared image and infrared data is used to qualify the component for use.

Methods, systems, devices, and products for ultrasonic borehole logging using an ultrasonic borehole imaging tool in a borehole intersecting the earth formation. Methods may include adjusting a focus for an ultrasonic beam generated from a single-transducer ultrasonic assembly of the ultrasonic imaging tool; using a receiver to generate measurement information responsive to an ultrasonic signal caused by the ultrasonic beam; and estimating a parameter of interest from the measurement information. Methods may include adjusting the focus in dependence upon environmental conditions, the environmental conditions comprising at least one of: i) standoff between the ultrasonic imaging tool and a wall of the borehole; and ii) borehole annulus conditions. Methods may include adjusting the focus in substantially real-time. The ultrasonic beam may be focused with a focal zone at the borehole wall configured to produce a beam spot size of a selected diameter.

A method for measuring thermal resistance between a thermal component of an instrument and a consumable includes contacting a known consumable with a thermal component to be tested; driving the thermal component using a periodic sine wave input based on a predetermined interrogation frequency; measuring temperature outputs from a thermal sensor responsive to the periodic sine wave input; multiplying the temperature outputs by a reference signal in phase with the periodic sine wave input and calculating the resultant DC signal component to determine an in-phase component X; multiplying the plurality of temperature outputs by a 90° phase-shifted reference signal and calculating the resultant DC signal component to determine a quadrature, out-of-phase component Y; calculating a phase offset responsive to the periodic sine wave input based on tan.sup.−1 (Y/X) or atan2(X, Y); and determining a resistance value for the thermal interface using a calibrated resistance-phase offset equation and the calculated phase offset.