An apparatus comprising an array of polymer-based capacitive micromachined ultrasonic transducers positioned on a substrate. The substrate may be at least substantially transparent to ionizing radiation, be flexible, and/or have walls positioned thereon to protect the transducers.

Micromachined ultrasonic transducers integrated with complementary metal oxide semiconductor (CMOS) substrates are described, as well as methods of fabricating such devices. Fabrication may involve two separate wafer bonding steps. Wafer bonding may be used to fabricate sealed cavities in a substrate. Wafer bonding may also be used to bond the substrate to another substrate, such as a CMOS wafer. At least the second wafer bonding may be performed at a low temperature.

An ultrasonic transducer includes a membrane, a bottom electrode, and a plurality of cavities disposed between the membrane and the bottom electrode, each of the plurality of cavities corresponding to an individual transducer cell. Portions of the bottom electrode corresponding to each individual transducer cell are electrically isolated from one another. Each portion of the bottom electrode corresponds to each individual transducer that cell further includes a first bottom electrode portion and a second bottom electrode portion, the first and second bottom electrode portions electrically isolated from one another.

A manual system for non-destructive testing of a part to be tested includes a sub-system for acquiring non-destructive test data comprising a probe, a sub-system for tracking the position of the probe, and a sub-system for acquiring surface characterisation data of a test zone defined on the surface of the part. The system also includes a central sub-system for controlling the test data acquisition, surface characterisation data acquisition and position tracking subsystems as a function of the test zone covered by the probe manipulated by an operator, the central subsystem being able to synchronise the operation of the test data acquisition, surface characterisation data acquisition and position tracking subsystems and to pair the data produced by the test data acquisition, surface characterisation data acquisition and position tracking subsystems during their operation.

An ultrasound circuit comprising a trans-impedance amplifier (TIA) with built-in time gain compensation functionality is described. The TIA is coupled to an ultrasonic transducer to amplify an electrical signal generated by the ultrasonic transducer in response to receiving an ultrasound signal. The TIA is, in some cases, followed by further analog and digital processing circuitry.

Techniques for compensating a TFM delay computation live (e.g., during acquisition) as a function of the measured thickness along the scan axis of a probe of an acoustic inspection system. At various scan positions, the acoustic inspection system can measure the thickness of the object under test. With the measured thickness, the acoustic inspection system can compute the delays used for the TFM computation to reflect the actual thickness at that particular scan position of the probe.

Various embodiments include determining a level of a surface of a fluid and/or for determining a quality of the fluid in a fluid container. An example apparatus comprises a sound transducer module having two sound transducers designed to receive and emit sound signals in such a manner that a superimposition sound signal results when the sound signals are superimposed, and a reference element arranged in the fluid at a predefined distance from the sound transducer module and is designed to reflect the superimposition sound signal. The sound transducer module is designed, by superimposing the at least two sound signals, to emit the superimposition sound signal both in a first direction to the surface of the fluid and in a second direction to the reference element, said second direction running at a predetermined sound signal angle with respect to the first direction.

Sensing apparatuses and method of making the sensing apparatuses are disclosed herein. In some variations, a sensing apparatus can comprise at least one optical waveguide, and at least one whispering gallery mode (WGM) resonator configured to propagate a set of WGMs, where the WGM resonator communicates to the at least one optical waveguide a set of signals corresponding to the set of WGMs. In some variations, a polymer structure may encapsulate the at least one WGM resonator and/or the at least one optical waveguide. Furthermore, in some variations, the WGM resonator(s) may have one or more selectable modes with different bandwidth and sensitivity for sensing, which may, for example, enable tailoring the sensing apparatus to specific applications having certain bandwidth and/or sensitivity requirements.

A method of manufacturing a plurality of resonators, each formed by a membrane sealing a cavity, includes forming a plurality of cavities starting from one face called the front face of a support substrate, the plurality of cavities comprising central cavities and peripheral cavities arranged around the assembly formed by the central cavities, and forming central membranes and peripheral membranes covering the central cavities and peripheral cavities, respectively, by the transfer of a coverage film on the front face of the support substrate. At least part of the peripheral membranes is removed.

The present disclosure relates to a CUT transducer (200) comprising: —a conductive or semiconductor substrate (201) coated with a stack of one or a plurality of dielectric layers (203, 213); —a cavity (205, 215) formed in said stack; —a conductive or semiconductor membrane (221) suspended above the cavity; —at the bottom of the cavity, a conductive region (209) in contact with the upper surface of the substrate, said conductive region being interrupted on a portion of the upper surface of the substrate; and—in the cavity, a stop structure (207) made of a dielectric material localized on or above the area of interruption of the conductive region (209).