A method of detecting a ferroelectric signal from a ferroelectric film and a piezoelectric force microscopy (PFM) apparatus are provided. The method includes following steps. An input waveform signal is applied to the ferroelectric film. An atomic force microscope probe scans over a surface of the ferroelectric film to measure a surface topography of the ferroelectric film. A deflection of the atomic force microscope probe is detected when the input waveform signal is applied to the ferroelectric film to generate a deflection signal. Spectrum data of the ferroelectric film based on the deflection signal is generated. The spectrum data of the ferroelectric film is analyzed to determine whether the spectrum data of the ferroelectric film is a ferroelectric signal or a non-ferroelectric signal.

A method of detecting a ferroelectric signal from a ferroelectric film and a piezoelectric force microscopy (PFM) apparatus are provided. The method includes following steps. An input waveform signal is applied to the ferroelectric film. An atomic force microscope probe scans over a surface of the ferroelectric film to measure a surface topography of the ferroelectric film. A deflection of the atomic force microscope probe is detected when the input waveform signal is applied to the ferroelectric film to generate a deflection signal. Spectrum data of the ferroelectric film based on the deflection signal is generated. The spectrum data of the ferroelectric film is analyzed to determine whether the spectrum data of the ferroelectric film is a ferroelectric signal or a non-ferroelectric signal.

Systems and methods for manufacturing multiple integrated tip probes for scanning probe microscopy. According to an embodiment is a microscope probe configured to analyze a sample, the microscope probe including: a movable probe tip including a terminal probe end; a first actuator configured to displace the movable probe tip along a first axis; and a detection component configured to detect motion of the movable probe tip in response to an applied signal; where the moveable probe tip comprises a metal layer affixed to a supporting layer, at least a portion of the metal layer at the terminal probe end extending past the supporting layer.

Systems and methods for manufacturing multiple integrated tip probes for scanning probe microscopy. According to an embodiment is a microscope probe configured to analyze a sample, the microscope probe including: a movable probe tip including a terminal probe end; a first actuator configured to displace the movable probe tip along a first axis; and a detection component configured to detect motion of the movable probe tip in response to an applied signal; where the moveable probe tip comprises a metal layer affixed to a supporting layer, at least a portion of the metal layer at the terminal probe end extending past the supporting layer.

In order to increase the order of a frequency of an AC signal to be applied between a vibration section and a sample to an order at substantially the same level as the order of a vibration frequency of the vibration section in measuring a vibration component of the vibration control section, a vibration component measuring device (2) includes: a vibration section (4); a first AC signal generator (20) configured to generate a first AC signal; a second AC signal generator (44) configured to generate a second AC signal having a frequency which is (a) more than one time and less than two times or (b) more than two times and less than three times as high as a frequency of the first AC signal; a signal applying section (14, 56) configured to apply the second AC signal between the vibration section and a sample (X); a vibration control section (10) configured to cause the vibration section to vibrate; and a measuring section (16, 18, 20, 22, 42, 44, 50) configured to measure a varying component of vibration of the vibration section, the varying component being varied by an interaction between the vibration section and the sample.

In order to increase the order of a frequency of an AC signal to be applied between a vibration section and a sample to an order at substantially the same level as the order of a vibration frequency of the vibration section in measuring a vibration component of the vibration control section, a vibration component measuring device (2) includes: a vibration section (4); a first AC signal generator (20) configured to generate a first AC signal; a second AC signal generator (44) configured to generate a second AC signal having a frequency which is (a) more than one time and less than two times or (b) more than two times and less than three times as high as a frequency of the first AC signal; a signal applying section (14, 56) configured to apply the second AC signal between the vibration section and a sample (X); a vibration control section (10) configured to cause the vibration section to vibrate; and a measuring section (16, 18, 20, 22, 42, 44, 50) configured to measure a varying component of vibration of the vibration section, the varying component being varied by an interaction between the vibration section and the sample.

Scanning Probe Microscope (SPM) system configured with the use of a composite material employing a non-metallic matrix and at least one of diamond particles, fused silica particles, boron carbide particles, silicon carbide particles, aluminum oxide particles, carbon fiber elements, carbon nanotube elements, and doped diamond particles to increase the structural integrity and/or strength of the SPM system, and a fraction of reinforcement ranging from at least 25% to at least 75% with advantageous modification of the Young's modulus, coefficient of thermal expansion, and thermal conductivity.

Scanning Probe Microscope (SPM) system configured with the use of a composite material employing a non-metallic matrix and at least one of diamond particles, fused silica particles, boron carbide particles, silicon carbide particles, aluminum oxide particles, carbon fiber elements, carbon nanotube elements, and doped diamond particles to increase the structural integrity and/or strength of the SPM system, and a fraction of reinforcement ranging from at least 25% to at least 75% with advantageous modification of the Young's modulus, coefficient of thermal expansion, and thermal conductivity.

A method for implementing a transistor using multiple integrated probe tips is provided. The method comprises the steps of (1) providing a sample; (2) providing a microscope probe comprising a plurality of probe tips; (3) contacting a first outer probe tip of the plurality of probe tips to the sample, wherein he first outer probe tip is configured to act as a source terminal for a transistor; (4) contacting a second outer probe tip of the plurality of probe tips to the sample, wherein the second outer probe tip is configured to act as a drain terminal for the transistor; (5) using an inner probe tip of the plurality of probe tips as a gate terminal for the transistor; and (6) characterizing the sample with the plurality of probe tips.

A method for implementing a transistor using multiple integrated probe tips is provided. The method comprises the steps of (1) providing a sample; (2) providing a microscope probe comprising a plurality of probe tips; (3) contacting a first outer probe tip of the plurality of probe tips to the sample, wherein he first outer probe tip is configured to act as a source terminal for a transistor; (4) contacting a second outer probe tip of the plurality of probe tips to the sample, wherein the second outer probe tip is configured to act as a drain terminal for the transistor; (5) using an inner probe tip of the plurality of probe tips as a gate terminal for the transistor; and (6) characterizing the sample with the plurality of probe tips.