An apparatus for a system power device utilized in an interconnected power system. The interconnected power system may include multiple system power devices connected to various inter connections of groups of direct currents (DC) from power sources which also may be connected in various series, parallel, series parallel and parallel series combinations for example. The apparatus may include a processor connected to a memory and a communication interface operatively attached to the processor. The communication interface may be adapted to connect to a mobile computing system of a user in close proximity to the system power devices. A graphical user interface (GUI) of the mobile computing system may allow various operational and re-configuration options for the interconnected power system which may include installation, maintenance and monitoring schedules in the interconnected power system when the user of the GUI is in close proximity to the system power devices.

A current testing device including a housing assembly, an electrical assembly and a circuit board assembly is disclosed herein. The housing assembly includes a housing that encloses the electrical assembly. The electrical assembly includes a battery, a microprocessor, a display, a keypad, a power button, an electrical port, and test cables. The microprocessor permits the user to simulate a fuse. The microprocessor has a memory in which a predetermined catalogue of fuses characteristics is stored. The user connects the test cables to a circuit board where the fuse is blown. The keypad allows the user to type the simulation characteristics while the display shows the results of the simulation.

A current testing device including a housing assembly, an electrical assembly and a circuit board assembly is disclosed herein. The housing assembly includes a housing that encloses the electrical assembly. The electrical assembly includes a battery, a microprocessor, a display, a keypad, a power button, an electrical port, and test cables. The microprocessor permits the user to simulate a fuse. The microprocessor has a memory in which a predetermined catalogue of fuses characteristics is stored. The user connects the test cables to a circuit board where the fuse is blown. The keypad allows the user to type the simulation characteristics while the display shows the results of the simulation.

The invention involves a multimeter with a meter probe module and phasing probe module capable of wireless communication, proximity measurements, and accurately reading phase degrees. The meter probe module and the phasing probe module can communicate wirelessly, via a wired cable interface, or any combination thereof. The meter probe module and phasing probe module have unique radio frequency serial numbers that allow the probe modules to only communicate with its paired partner probe module while ignoring all other probe modules. The multimeter has a measurement point capable of taking direct contact measurements. The multimeter also has a measurement point capable of taking a voltage measurement without directly contacting the object to be measured. This is accomplished by taking voltage readings from the electric field of the air surrounding said object. The improved multimeter may allow an operator to more safely gather accurate information about an object being measured.

A test and measurement probe system (100,104), including an input (106) to receive an input signal, the input signal including a low frequency (LF) and/or direct current (DC) component and an alternating current (AC) component, an extractor circuit (110), such as an AC coupling circuit or a LF and/or DC rejection circuit, configured to receive the input signal and to separate the AC component and the LF and/or DC component from the input signal, a first output (118) to output the alternating current component to the test and measurement instrument, and a second output to output the direct current component to the test and measurement instrument. In some embodiments, the LF and/or DC component is digitized prior to being output by the second output.

An apparatus for a system power device utilized in an interconnected power system. The interconnected power system may include multiple system power devices connected to various inter connections of groups of direct currents (DC) from power sources which also may be connected in various series, parallel, series parallel and parallel series combinations for example. The apparatus may include a processor connected to a memory and a communication interface operatively attached to the processor. The communication interface may be adapted to connect to a mobile computing system of a user in close proximity to the system power devices. A graphical user interface (GUI) of the mobile computing system may allow various operational and re-configuration options for the interconnected power system which may include installation, maintenance and monitoring schedules in the interconnected power system when the user of the GUI is in close proximity to the system power devices.

Provided is a technique that allows measuring a film thickness of a substrate in a plating process.

A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

Provided is a technique that allows measuring a film thickness of a substrate in a plating process.

A plating apparatus 1000 includes a plating tank 10, a substrate holder 20, a rotation mechanism 30, a plurality of contact members 50, a coil 60, a current sensor 65, and a film thickness measuring device 70. The plurality of contact members 50 are disposed in a substrate holder and arranged in a circumferential direction of the substrate holder. The plurality of contact members 50 contact an outer peripheral edge of a lower surface of a substrate to supply electricity to the substrate in the plating process. The coil 60 generates a current by an electromagnetic induction due to a magnetic field generated by a current flowing into the contact member, the contact member being rotate together with the substrate holder in the plating process. The current sensor 65 detects the current generated in the coil. The film thickness measuring device 70 measures a film thickness of the substrate based on the current detected by the current sensor in the plating process.

A wireless tracking device includes circuit components, a battery, and a circuit connecting the circuit components and the battery. The circuit components include a first wireless communication system, a processor, a memory or storage, and a first sensor operable to measure conditions of the wireless tracking device. The wireless tracking device is configured to attach to an overhead electrical line and detect failure events that are experienced by the overhead electrical line based on sensor data monitored by the wireless tracking device.

A wireless tracking device includes circuit components, a battery, and a circuit connecting the circuit components and the battery. The circuit components include a first wireless communication system, a processor, a memory or storage, and a first sensor operable to measure conditions of the wireless tracking device. The wireless tracking device is configured to attach to an overhead electrical line and detect failure events that are experienced by the overhead electrical line based on sensor data monitored by the wireless tracking device.