An inspection tool and associated methods for testing physical and electrical properties of a perforating gun and sending the perforating gun to a wellbore site with at least one of an electrical property and a dimension that has been previously verified. The perforating gun may be received in a perforating gun holder positioned between a first connecting portion and second connecting portion. The first connecting portion may be moved from a first position to a second position at which the at least one of the electrical property and the dimension is measured. Upon verification that the at least one of the electrical property and the dimension is within a predetermined specification, the perforating gun may be sent to the wellbore site.

Discussed is a method of manufacturing a display device, the method including: introducing semiconductor light emitting devices including a magnetic material into a fluid chamber; transferring a substrate to the fluid chamber, the substrate including assembly electrodes, an insulating layer covering the assembly electrodes, and open holes in the insulating layer and exposing portions of both ends of the assembly electrodes; applying a magnetic force to the semiconductor light emitting devices introduced into the fluid chamber to move the semiconductor light emitting devices in one direction; and forming an electric field so that the moving semiconductor light emitting devices are disposed at preset positions of the substrate, wherein a probe pin is in contact with the assembly electrodes exposed through the open holes to individually apply a voltage to the assembly electrodes to form the electric field.

Discussed is a method of manufacturing a display device, the method including: introducing semiconductor light emitting devices including a magnetic material into a fluid chamber; transferring a substrate to the fluid chamber, the substrate including assembly electrodes, an insulating layer covering the assembly electrodes, and open holes in the insulating layer and exposing portions of both ends of the assembly electrodes; applying a magnetic force to the semiconductor light emitting devices introduced into the fluid chamber to move the semiconductor light emitting devices in one direction; and forming an electric field so that the moving semiconductor light emitting devices are disposed at preset positions of the substrate, wherein a probe pin is in contact with the assembly electrodes exposed through the open holes to individually apply a voltage to the assembly electrodes to form the electric field.

An insulation fault response method for a fuel cell vehicle, comprising: when a vehicle starts, detecting whether a fuel cell is in a startup state or not; when the fuel cell is not in the startup state, reading a first insulation resistance detected by a fuel cell control unit and a second insulation resistance detected by a cell management system; when the first insulation resistance indicates that the vehicle is in an insulation fault, executing a first control policy; and when the second insulation resistance indicates that the vehicle in an insulation fault, executing a second control policy, wherein the first control policy is different from the second control policy, and wherein when the first insulation resistance is less than a first threshold and/or the second insulation resistance is less than a second threshold, the vehicle is in an insulation fault.

The invention provides a measuring method of resistivity of a wafer, comprising: choosing a wafer to be measured, conducting a thermal treatment for the wafer to remove a thermal doner in the wafer, conducting an oxidation process for the wafer to form an oxidized surface on the wafer, and measuring resistivity of the wafer. In the method, firstly, the wafer is oxidized to get the oxidized surface, so as to restrict surface variation when placing the wafer in a later process. Therefore, the resistivity measurement of the wafer surface only slightly varies.

The invention provides a measuring method of resistivity of a wafer, comprising: choosing a wafer to be measured, conducting a thermal treatment for the wafer to remove a thermal doner in the wafer, conducting an oxidation process for the wafer to form an oxidized surface on the wafer, and measuring resistivity of the wafer. In the method, firstly, the wafer is oxidized to get the oxidized surface, so as to restrict surface variation when placing the wafer in a later process. Therefore, the resistivity measurement of the wafer surface only slightly varies.

A system and method that includes inserting a needle of a phacoemulsification handpiece into an eye of a patient and vibrating the needle in a first trajectory. Matter from the eye is aspirated via an aspiration line while the needle is vibrated in the first trajectory. An indication is received, of a vacuum level in the aspiration line. Determined is, that the vacuum level has changed by at least a preset vacuum level change, and in response vibrating the needle is switched to a second trajectory, different from the first trajectory.

According to one embodiment, a sensor includes an element part, and a control circuit part. The element part includes first and second elements. Each of the first and second elements includes a first magnetic element and a first conductive member. The control circuit part includes a first current circuit, a differential circuit, and a phase detection circuit. The first current circuit is configured to supply a first current to the first conductive member. The differential circuit is configured to output a differential signal corresponding to a difference of a first signal and a second signal. The first signal corresponds to a change in a first electrical resistance of the first magnetic element of the first element, The second signal corresponds to a change in a second electrical resistance of the first magnetic element of the second element. The phase detection circuit is configured to perform a phase detection of the differential signal.

According to one embodiment, a sensor includes an element part, and a control circuit part. The element part includes first and second elements. Each of the first and second elements includes a first magnetic element and a first conductive member. The control circuit part includes a first current circuit, a differential circuit, and a phase detection circuit. The first current circuit is configured to supply a first current to the first conductive member. The differential circuit is configured to output a differential signal corresponding to a difference of a first signal and a second signal. The first signal corresponds to a change in a first electrical resistance of the first magnetic element of the first element, The second signal corresponds to a change in a second electrical resistance of the first magnetic element of the second element. The phase detection circuit is configured to perform a phase detection of the differential signal.

A detection device for detecting a line quality of an electric circuit includes two electrical connection members inserted into a socket and connected to two power lines, a load resistor, a switching member, a displaying module, and a control module. An end of the load resistor is connected to one of the electrical connection members, and another end thereof is connected to a first end of the switching member. A second end of the switching member is connected to the other electrical connection member. The control module controls the switching member to cut off when in a detection mode, and detects a peak voltage in a voltage waveform and records as a maximum open-circuit voltage, and controls the switching member to conduct and detects the peak voltage of the voltage waveform and records as a load voltage and calculates a load current. A line resistance value is calculated based on the maximum open-circuit voltage, the load voltage, and the load current. A message is correspondingly displayed via the displaying module.