An electrical system can include a diagnostic device that generates a first test signal. The electrical system can also include multiple energy transfer links coupled to the diagnostic device, where the first test signals flows through a first subset of the energy transfer links. The electrical system can further include a first monitoring device coupled to the first subset of energy transfer links, where the first monitoring device receives the first test signal from the diagnostic device through the first subset of the energy transfer links. The electrical system can also include a first electrical device coupled to the first monitoring device. The first monitoring device can implement a first test procedure based on the first test signal, where the first test procedure helps determine a first condition of the first electrical device.

A ground-loss detection circuit for an integrated circuit, (IC) device including a first dynamic threshold metal oxide semiconductor (DTMOS) device operably coupled between a first ground plane of the IC device and at least one further ground plane of the IC device, at least one of the first and at least one further ground planes comprising an external ground connection of the IC device, at least one further DTMOS device operably coupled between the first and at least one further ground planes of the IC device in an opposing manner to the first DTMOS device, and at least one ground-loss detection component operably coupled to at least one of the first and at least one further DTMOS devices and arranged to detect a ground-loss for at least one of the first and at least one further ground planes based at least partly on a drain current of the at least one of the first and at least one further DTMOS device(s).

A printed circuit board includes a substrate and a plurality of pad forming regions disposed thereon. The plurality of pad forming regions are spaced apart from each other by a predetermined distance. A plurality of connection pads are disposed on a portion of the plurality of pad forming regions. The plurality of connection pads are configured to transmit or receive a signal to an external device or from the external device. The printed circuit board includes a path configured for the transportation of moisture therein.

A contactor failure determining method in includes outputting a control signal for switching a positive-side contactor provided between a positive electrode of a multi-cell battery and a positive electrode of a load to which the multi-cell battery supplies electric power to an open state from a state in which a control signal for controlling the positive-side contactor and a negative-side contactor provided between a negative electrode of the multi-cell battery and a negative electrode of the load to a closed state and a precharge contactor provided between the multi-cell battery and the load to an open state is output, and as a first fixing determining step, determining a presence of fixing of the precharge contactor based on a degree of voltage drop of a voltage applied to the load after the control signal for switching the positive-side contactor to the open state is output.

Example implementations involve an electrical connector and a test method of the electrical connector, wherein the electrical conduction condition between a ground member and a ground terminal can be easily confirmed while reliably contacting the ground member and ground terminal. Electrical connector involves a plurality of terminals including two types of terminals, namely, signal terminals and ground terminals; a retaining body, made of an insulating material, that arranges and retains the plurality of terminals in a condition where the signal terminals and ground terminals are intermingled; and a ground member retained by the retaining body on the inward side of the retaining body, in a condition contacting at least two ground terminals; wherein the ground member has a detecting part exposed from the retaining body in order to detect an electrical conduction condition between the ground terminals and the ground member.

An energy saving device that is adapted to be connected to a power outlet and further connected to at least one electrical device, said electrical devices drawing power through the energy saving device, the energy saving device including testing means adapted to perform at least one installation verification test and communication means adapted to communicate a validation signal to a monitoring entity when a result of the installation verification test indicates that a correct installation has occurred.

In one example, a driver circuit includes a differential transistor pair configured to be biased by a current source and including a differential input and a differential output. The driver circuit further includes a resistor pair coupled between a node pair and the differential output, a transistor pair coupled between a voltage supply and the node pair, and a bridge transistor coupled between the node pair. The driver circuit further includes a pair of three-state circuit elements having a respective pair of input ports, a respective pair of control ports, and a respective pair of output ports. The pair of output ports is respectively coupled to the node pair. The pair of control ports is coupled to a common node comprising each gate of the transistor pair and a gate of the bridge transistor.

Provided is a semiconductor inspection circuit which is capable of inspecting connection states of power supply, ground, and signal bumps in a semiconductor package or a printed circuit board equipped with a semiconductor LSI mounted in a product operation state. As a means to solve the problem, a circuit capable of switching a path is provided at an input portion of a driver/receiver, a mechanism capable of transferring an output of a path switching circuit near a receiver circuit to a voltage waveform circuit with an internal variable terminal is provided, and a breakage state of a bump can be observed in the product operation state by observing a DC level at a terminal having a certain DC resistance when a signal bump connection state is observed and receiving a step wave and observing a response waveform thereof when an IO power supply bump connection state is observed.

Disclosed is an electronic circuit with a first terminal for connecting an accessory thereto, and with a functionality for detecting the presence of an accessory connected to the first terminal.

Some embodiments of the present invention are generally directed to testing connections of a memory device to a circuit board or other device. In one embodiment, a memory device that is configured to facilitate continuity testing between the device and a printed circuit board or other device is disclosed. The memory device includes a substrate and two connection pads that are electrically coupled to one another via a test path. A system and method for testing the connections between a memory device and a circuit board or other device are also disclosed, as are additional techniques for detecting excess temperature and enabling special functionalities using multi-stage connection pads.