One embodiment is a transport apparatus for moving carriers of microelectronic devices along a track, the transport apparatus including: (a) a track with two rails adapted to support the carriers; (b) a trolley adapted to be transported in a direction along the track by a linear actuator; and (c) a first and a second engagement feature attached to the trolley wherein the first engagement feature is adapted to engage temporarily with a first of the carriers, and the second engagement feature is adapted to engage temporarily with a second of the carriers; wherein a predetermined movement of the trolley slidably moves the first carrier onto a test position and slidably moves the second carrier off the test position simultaneously.

A system for testing circuits of an integrated circuit semiconductor wafer includes a tester system for generating signals for input to the circuits and for processing output signals from the circuits for testing the wafer and a test stack coupled to the tester system. The test stack includes a wafer probe for contacting a first surface of the wafer and for probing individual circuits of the circuits of the wafer, a wafer thermal interposer (TI) layer operable to contact a second surface of the wafer and operable to selectively heat areas of the wafer, and a cold plate disposed under the wafer TI layer and operable to cool the wafer. The system further includes a thermal controller for selectively heating and maintaining temperatures of the areas of the wafer by controlling cooling of the cold plate and by controlling selective heating of the wafer TI layer.

It is described a testing head for a testing equipment of an electronic device comprising at least one upper guide and a lower guide provided with guide holes, a plurality of contact probes inserted into the guide holes of the upper and lower guides and at least one containment element of the probes being is disposed between the upper and lower guides, each of the contact probes having at least one terminal portion which ends with a contact tip adapted to abut on a respective contact pad of the electronic device to be tested; at least one spacer element sandwiched between the containment element and at least one of the upper and lower guides, the spacer element being removable to adjust a length of the terminal portions of the contact probes projecting from the lower guide.

A test fixture for PCB components is described herein. The test fixture comprises a shim with an aperture configured to direct RF energy from a component of a PCB, via an end of the PCB, and to a top clamp of the test fixture. The end of the PCB may correspond to a cut line of a destructive test. The test fixture also comprises the top clamp with a test port and a taper configured to direct the RF energy from the aperture to the test port. The test fixture also comprises a bottom clamp attached to the top clamp to retain the PCB between the top and bottom clamps for testing. The test fixture allows for quick mounting of the PCB and testing of the component without modifying a design of the PCB or requiring specific drilling of the PCB.

A water tree testing apparatus using a flat test piece comprising a candidate insulation material an d having a first surface having a plurality of electrode holes formed therein has: a liquid-permeable conductive first permeable member that is attached to the first surface and covers the electrode holes; a liquid-permeable conductive second permeable member that is attached to a second surface that is opposite side from the first surface, and extends along the second surface as to face the first permeable member with the test piece therebetween; a first water tank for immersing the first surface in the first aqueous solution; a second water tank for immersing the second surface in the second aqueous solution; a first electrode, and a second electrode.

A water tree testing apparatus using a flat test piece comprising a candidate insulation material an d having a first surface having a plurality of electrode holes formed therein has: a liquid-permeable conductive first permeable member that is attached to the first surface and covers the electrode holes; a liquid-permeable conductive second permeable member that is attached to a second surface that is opposite side from the first surface, and extends along the second surface as to face the first permeable member with the test piece therebetween; a first water tank for immersing the first surface in the first aqueous solution; a second water tank for immersing the second surface in the second aqueous solution; a first electrode, and a second electrode.

An electrical check executed on wafer tests for the correct positioning or alignment of the probes of a probe card on the pads or bumps of the electronic devices integrated on the wafer. A signal is applied to cause a current to circulate in at least part of a seal ring of at least one of the electronic devices. In a case where the current flows between and through multiple electronic devices, the seal rings of those electronic devices are suitably interconnected to each other by electronic structures that extend through the scribe line between electronic devices.

Aspects of the invention include a wafer test device with a conformal laminate and rigid probes extending from the laminate to form an electrical connection with a microcircuit under test. The wafer test device also includes a spring plate on a side of the laminate that is opposite a side from which the rigid probes extend. The spring plate includes a conformal inner frame and a rigid outer frame. The laminate is attached to the inner frame of the spring plate.

An alloy material includes: a composition containing 17 at % to 25 at % of silver (Ag), 30 at % to 45 at % of palladium (Pd), and 30 at % to 53 at % of copper (Cu) in a composition range of a ternary alloy of Ag, Pd, and Cu; and at least one of manganese (Mn), tin (Sn), silicon (Si), antimony (Sb), titanium (Ti) and magnesium (Mg) added to the composition in a range of 4.5 at % or less, and the Mn in a range of 0.5 at % to 3.5 at %, the Sn in a range of 1 at % to 2 at %, the Si in a range of 0.5 at % to 2 at %, the Sb in a range of 0.5 at % to 3 at %, the Ti in a range of 0.5 at % to 2 at %, and the Mg in a range of 0.5 at % to 3.5 at % are added to the composition.

A fluid pressure actuated device for establishing electrical contact includes a first side and a second side each defining a respective cavity. A respective flexible membrane is positioned across each cavity. Each membrane has an outer side that carries an electrically conducting contactor. The contactors are electrically connected to a conducting connector that extends at least partially through the device. Each flexible membrane extends and withdraws moving the associated electrically conducting contactor in opposing directions when fluid pressure is increased and decreased in the associated cavity. Each membrane may have an undulating shape by including concentric frustum portions that narrow in opposite directions. The contacts may have neutral positions that are internal relative to outer surfaces of the device until fluid pressure is increased in the respective cavities causing extension by movement of the membranes.