The disclosure discloses a method and device for monitoring partial discharge. The monitoring method including: step a, connecting a monitoring circuit in parallel to both ends of a tested product, disposing a ground wire between the monitoring circuit and ground, disposing a first sensor in the monitoring circuit, and disposing a ground wire sensor on the ground wire; step b, applying an excitation signal to the tested product, acquiring a first signal through the first sensor and acquiring a ground wire signal through the ground wire sensor within a monitoring cycle; and step c, determining whether the tested product has partial discharge through the first signal and the ground wire signal. The disclosure can avoid the partial discharge monitoring device from wrongly determining an interference signal to be a partial discharge signal, enhance anti-interference capability of the partial discharge monitoring device, and improve monitoring accuracy.

The disclosure discloses a method and device for monitoring partial discharge. The monitoring method including: step a, connecting a monitoring circuit in parallel to both ends of a tested product, disposing a ground wire between the monitoring circuit and ground, disposing a first sensor in the monitoring circuit, and disposing a ground wire sensor on the ground wire; step b, applying an excitation signal to the tested product, acquiring a first signal through the first sensor and acquiring a ground wire signal through the ground wire sensor within a monitoring cycle; and step c, determining whether the tested product has partial discharge through the first signal and the ground wire signal. The disclosure can avoid the partial discharge monitoring device from wrongly determining an interference signal to be a partial discharge signal, enhance anti-interference capability of the partial discharge monitoring device, and improve monitoring accuracy.

Provided are an electrical tree test device for a silicone rubber material for a cable accessory and a method for preparing a sample. The method includes: adding a semi-conductive silicone rubber into xylene, performing spraying on a surface of a silicone rubber insulation sample sheet, performing a curing processing, cutting the sample sheet into a high-voltage electrode with a triangular longitudinal section end, then adhering the high-voltage electrode on the surface of the silicone rubber insulation sample sheet, and performing a high temperature vulcanization to obtain a silicon rubber sample sheet; placing the silicon rubber sample sheet into a mold, injecting a high temperature vulcanizable liquid silicone rubber mixture, and performing the high temperature vulcanization, to obtain a sample; and performing cutting at a position distanced from a tip of the high-voltage electrode by 2 mm, and adhering a ground electrode of a flat plate-like structure at the cross section/

Provided are an electrical tree test device for a silicone rubber material for a cable accessory and a method for preparing a sample. The method includes: adding a semi-conductive silicone rubber into xylene, performing spraying on a surface of a silicone rubber insulation sample sheet, performing a curing processing, cutting the sample sheet into a high-voltage electrode with a triangular longitudinal section end, then adhering the high-voltage electrode on the surface of the silicone rubber insulation sample sheet, and performing a high temperature vulcanization to obtain a silicon rubber sample sheet; placing the silicon rubber sample sheet into a mold, injecting a high temperature vulcanizable liquid silicone rubber mixture, and performing the high temperature vulcanization, to obtain a sample; and performing cutting at a position distanced from a tip of the high-voltage electrode by 2 mm, and adhering a ground electrode of a flat plate-like structure at the cross section/

A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

A tester apparatus is described. Various components contribute to the functionality of the tester apparatus, including an insertion and removal apparatus, thermal posts, independent gimbaling, the inclusion of a photo detector, a combination of thermal control methods, a detect circuitry in a socket lid, through posts with stand-offs, and a voltage retargeting.

A testing apparatus for a semiconductor package includes a circuit board, testing patterns and a socket. The circuit board has a testing region and includes a plurality of testing contacts and a plurality of signal contacts distributed in the testing region. The testing patterns are embedded in the circuit board and electrically connected to the testing contacts, where each of the testing patterns includes a first conductive line and a second conductive line including a main portion and a branch portion connected to main portion. The first conductive line is connected to the main portion. The socket is located on the circuit board and comprising connectors electrically connected to the circuit board, wherein the connectors are configured to transmit electric signals for testing the semiconductor package from the testing apparatus.

Some embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes for use in die level testing of semiconductor devices) from a core material and a shell or coating material that partially coats the surface of the structure. Other embodiments are directed to electrochemical fabrication methods for producing structures or devices (e.g. microprobes) from a core material and a shell or coating material that completely coats the surface of each layer from which the probe is formed including interlayer regions. Additional embodiments of the invention are directed to electrochemical fabrication methods for forming structures or devices (e.g. microprobes) from a core material and a shell or coating material wherein the coating material is located around each layer of the structure without locating the coating material in inter-layer regions.

Disclosed is a probe card for testing a wafer. The probe card includes a substrate and a block including an insulation portion and a conducting portion disposed on the insulation portion. Here, the insulation portion includes a via and a probe pin which comes into contact with an object to be tested. The conducting portion includes a contact point electrically connected to the substrate and a conducting pattern passing through the via and electrically connecting the contact point to the probe pin. A pitch between a plurality of such probe pins is smaller than a pitch between a plurality of such contact points. The block includes a plurality of unit blocks. The plurality of unit blocks each include the insulation portion and the conducting portion, and at least parts of the insulation portions of the unit blocks are arranged while being spaced apart from each other.

A calibration method includes transmitting first data comprising a calibration data and a first checksum to the storage device according to each of a plurality of training parameter sets; recording a plurality of error indicators respectively which are corresponding to the plurality of training parameter sets and from the storage device; and identifying one of the plurality of training parameter sets as a predetermined parameter set according to the plurality of error indicators respectively corresponding to the plurality of training parameter sets; wherein each error indicator indicates whether transmitting the first data according to the corresponded training parameter set is successful.