A Hall effect sensor including a Hall element disposed at a surface of a semiconductor body, including a first doped region of a first conductivity type disposed over and abutted by an isolated second doped region of a second conductivity type. First through fourth terminals of the Hall element are in electrical contact with the first doped region, and a fifth terminal in electrical contact with the second doped region. A Hall effect sensor includes a first current source coupled to the first terminal of the Hall element, and common mode feedback regulation circuitry. The common mode feedback regulation circuitry has an output coupled to the third terminal and a ground node, and having an input coupled to the second and fourth terminals of the Hall element, and an output coupled to the third terminal and a ground node, where the second doped region is coupled to the third terminal.

Provided are magnetoresistance effect element and a Heusler alloy in which an amount of energy required to rotate magnetization can be reduced. The magnetoresistance effect element includes a first ferromagnetic layer, a second ferromagnetic layer, and a non-magnetic layer positioned between the first ferromagnetic layer and the second ferromagnetic layer, in which at least one of the first ferromagnetic layer and the second ferromagnetic layer is a Heusler alloy in which a portion of elements of an alloy represented by Co.sub.2Fe.sub.αZ.sub.β is substituted with a substitution element, in which Z is one or more elements selected from the group consisting of Mn, Cr, Al, Si, Ga, Ge, and Sn, α and β satisfy 2.3≤α+β, α<β, and 0.5<α<1.9, and the substitution element is an element different from the Z element and has a smaller magnetic moment than Co.

A magnetic sensor whose output characteristic is less sensitive to the environmental temperature is provided. Magnetic sensor 1 has free layer 24 whose magnetization direction changes in response to an external magnetic field, pinned layer 22 whose magnetization direction is fixed with respect to the external magnetic field, spacer layer 23 that is located between pinned layer 22 and free layer 24 and that exhibits a magnetoresistance effect, and at least one magnet film 25 that applies a bias magnetic field to free layer 24. The film thickness of the magnet film is 15 nm or more and 50 nm or less. The relationship of 0.7≤T.sub.C_HM/T.sub.C_FL≤1.05 is satisfied, where T.sub.C_HM is Curie temperature of the magnet film, and T.sub.C_FL is Curie temperature of the free layer.

A Hall-effect sensor package includes and an IC die including a Hall-Effect element and a leadframe including leads on a first side providing a first field generating current (FGC) path including≥1 first FGC input pin coupled by a reduced width first curved head over or under the Hall-effect sensor element to ≥1 first FGC output pin, and second leads on a second side of the package. Some leads on the second side are attached to bond pads on the IC die including the output of the Hall-effect element. A clip is attached at one end to the first FGC input pin and at another end to a location on the first FGC output pin, having a reduced width second curved head in between that is over or under the Hall-effect sensor element opposite the first head.

The present disclosure relates to integrated circuits, and more particularly, to a highly sensitive tunnel magnetoresistance sensor (TMR) with a Wheatstone bridge for field/position detection in integrated circuits and methods of manufacture and operation. In particular, the present disclosure relates to a structure including: a first magnetic tunneling junction (MTJ) structure on a first device level; and a second magnetic tunneling junction (MTJ) structure on a different device level than the first MTJ structure. The second MTJ structure includes properties different than the first MTJ structure.

A jig includes a base and one or more movable blocks. The base has an upper surface, which is configured to receive a substrate shaped as a flattened polyhedron having multiple facets. The one or more movable blocks are configured to move on the base so as to fold respective ones of the multiple facets, and to hold the substrate in a folded three-dimensional configuration.

A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.

A sensor cross-talk compensation system includes a semiconductor substrate having a first main surface and a second main surface opposite to the first main surface; a vertical Hall sensor element disposed in the semiconductor substrate, the vertical Hall sensor element is configured to generate a sensor signal in response to a magnetic field impinging thereon; and an asymmetry detector configured to detect an asymmetric characteristic of the vertical Hall sensor element. The asymmetry detector includes a detector main region that vertically extends into the semiconductor substrate from the first main surface towards the second main surface and is of a conductivity type having a first doping concentration; and at least three detector contacts disposed in the detector main region at the first main surface, the at least three detector contacts are ohmic contacts of the conductivity type having a second doping concentration that is higher than the first doping concentration.

A magnetic sensor chip includes a substrate including a first main surface, and a magnetoresistive element having a magnetosensitive direction parallel or substantially parallel to the first main surface. The magnetoresistive element includes a reference layer, an intermediate layer, and a free layer stacked in a stacking direction perpendicular or substantially perpendicular to the first main surface. A direction of magnetic anisotropy of the free layer where no external magnetic field acts on the magnetic sensor chip is parallel or substantially parallel to the stacking direction and perpendicular or substantially perpendicular to the magnetosensitive direction. When a stress acts on the substrate predominantly in a first direction parallel or substantially parallel to the first main surface, a direction of stress-induced magnetic anisotropy in the free layer is perpendicular or substantially perpendicular to the magnetosensitive direction and the stacking direction.

A magnetic sensor device for detecting linear movement of a moving body includes a magnetic field generation unit and a magnetic field detection unit, which is provided to be capable of detecting the magnetic field generated by the magnetic field generation unit. The magnetic field detection unit is provided to be relatively moveable along a first axis accompanying linear movement of the moving body. The first axis is parallel to the direction of movement of the moving body. The magnetic field generation unit includes a first magnetic field generation unit and a second magnetic field generation unit. The first magnetic field generation unit and the second magnetic field generation unit are arranged substantially parallel to the first axis. A first line segment parallel to a first magnetization direction of the first magnetic field generation unit is inclined with respect to a second axis orthogonal to the first axis. A second line segment parallel to a second magnetization direction of the second magnetic field generation unit is inclined with respect to the second axis. The first line segment and the second line segment are positioned symmetrically with respect to the second axis and intersect each other to open toward the first axis.