G01R33/091

Power Semiconductor Module with Accessible Metal Clips

A power semiconductor module includes a substrate with a metallization layer that is structured. A semiconductor chip having a first side bonded to the metallization layer. A metal clip, which is a strip of metal, has a first planar part bonded to a second side of the semiconductor chip opposite to the first side. The metal clip also has a second planar part bonded to the metallization layer. A mold encapsulation at least partially encloses the substrate and the metal clip. The mold encapsulation has a recess approaching towards the first planar part of the metal clip. The semiconductor chip is completely enclosed by the mold encapsulation, the substrate and the metal clip and the first planar part of the metal clip is at least partially exposed by the recess. A sensor is accommodated in the recess.

System and method for GMR-based detection of biomarkers

A system for detecting analytes in a test sample, and a method for processing the same, is provided. The system includes a cartridge reader unit that has a control unit and a pneumatic system, and a cartridge assembly that prepares the samples with mixing material(s) through communication channels. The assembly has a memory chip with parameters for preparing the sample and at least one sensor (GMR sensor) for detecting analytes in the sample. The assembly is pneumatically and electronically mated with the reader unit via a pneumatic interface and an electronic interface such that the parameters may be implemented via the control unit. The pneumatic system is contained within the unit and has pump(s) and valve(s) for selectively applying fluid pressure to the pneumatic interface of the assembly, and thus through the communication channels, to move the sample and mixing material(s) through and to sensor. The control unit activates the pneumatic system to prepare the sample and provide it to the sensor for detecting analytes, and also processes measurements from the sensor to generate test results.

Detection device
11579211 · 2023-02-14 · ·

A magnetic detection module is provided so as to be selectively mountable in any of housings having a plurality of specifications having different shapes or sizes of mounting portions, and detects magnetic flux generated in the housing. The magnetic detection module includes one or more magnetic sensors that detect magnetic flux, a case in which the magnetic sensors are housed, and a cap that can be attached to an end of the case and is provided with a sealing member. The magnetic detection module can be attached to the housing of the first specification with the cap not attached to the case, and can be attached to the housing of the second specification through a sealing member with the cap attached to the case.

Position detection element and position detection apparatus using same
11578996 · 2023-02-14 · ·

A position detection element includes an exchange coupling film having a large exchange coupling magnetic field and a position detection apparatus showing good detection accuracy in a high temperature environment. The position detection element includes an exchange coupling film composed of a fixed magnetic layer and an antiferromagnetic layer stacked on the fixed magnetic layer. The antiferromagnetic layer includes an X(Cr—Mn) layer containing X that is one or more elements selected from the group consisting of platinum group metals and Ni and containing Mn and Cr. The X(Cr—Mn) layer includes a PtMn layer as a first region relatively closer to the fixed magnetic layer and a PtCr layer as a second region relatively farther from the fixed magnetic layer. The content of Mn in the first region is higher than the content of Mn in the second region.

Devices and methods for frequency- and phase-based detection of magnetically-labeled molecules using spin torque oscillator (STO) sensors

Devices and methods for molecule detection using such devices are disclosed herein. A molecule detection device comprises at least one fluidic channel configured to receive molecules to be detected, a sensor comprising a spin torque oscillator (STO) and encapsulated by a material separating the sensor from the at least one fluidic channel, and detection circuitry coupled to the sensor. At least some of the molecules to be detected are labeled by magnetic nanoparticles (HNPs). A surface of the material provides binding sites for the molecules to be detected. The detection circuitry is configured to detect a frequency or frequency noise of a radio-frequency (RF) signal generated by the STO in response to presence or absence of at least one MNP coupled to one or more binding sites associated with the sensor.

SNAP-ON CURRENT SENSOR DESIGN

A snap-on assembly includes a housing that holds an integrated circuit with a sensor. A connector supplies power to the integrated circuit and transmits a signal from the integrated circuit to an electronic circuit. An insert fits into an opening of the housing and secures a conductor in the housing without a mechanical fastener. The sensor measures a magnetic field resulting from a current traveling through the conductor.

SENSOR AND INSPECTION DEVICE

According to one embodiment, a sensor includes an element part, and a control circuit part. The element part includes first and second elements. Each of the first and second elements includes a first magnetic element and a first conductive member. The control circuit part includes a first current circuit, a differential circuit, and a phase detection circuit. The first current circuit is configured to supply a first current to the first conductive member. The differential circuit is configured to output a differential signal corresponding to a difference of a first signal and a second signal. The first signal corresponds to a change in a first electrical resistance of the first magnetic element of the first element, The second signal corresponds to a change in a second electrical resistance of the first magnetic element of the second element. The phase detection circuit is configured to perform a phase detection of the differential signal.

Method of detecting biological sample

A method of detecting a biological sample includes the following steps. A magnetic sensor chip is provided, wherein the magnetic sensor chip includes a substrate and a magnetic sensing layer located on the substrate. Probes are connected to the magnetic sensor chip. A sample solution containing biological samples labeled with a first marker is provided on the magnetic sensor chip, so that the biological samples labeled with the first marker are hybridized with the probes. Magnetic beads labeled with a second marker are provided on the magnetic sensor chip, so that the magnetic beads labeled with the second marker are bound onto the biological samples labeled with the first marker. A signal sensed by the magnetic sensing layer is detected by a magnetic sensor.

Magnetic sensor device
11555870 · 2023-01-17 · ·

A magnetic sensor device includes a magnetic sensor detecting a detection-target magnetic field, and a soft magnetic structure near the sensor. In an orthogonal coordinate system having two orthogonal axes for representing an applied field strength and a magnetization-corresponding value, coordinates representing the applied field strength and the magnetization-corresponding value move along a minor loop not in contact with a major loop as the strength of an external magnetic field including the detection-target magnetic field varies within a variable range, where the applied field strength is a strength of a magnetic field applied to the soft magnetic structure, the magnetization-corresponding value is a value corresponding to magnetization of the soft magnetic structure, and the major loop is, among loops traced by a path of the coordinates as the applied field strength is varied, a loop that is the largest in terms of area of the region enclosed by the loop.

STACKED DIE ASSEMBLY
20230240153 · 2023-07-27 ·

A sensor device comprising: a lead frame; a first/second semiconductor die having a first/second sensor structure at a first/second sensor location, and a plurality of first/second bond pads electrically connected to the lead frame; the semiconductor dies having a square or rectangular shape with a geometric center; the sensor locations are offset from the geometrical centers; the second die is stacked on top of the first die, and is rotated by a non-zero angle and optionally also offset or shifted with respect to the first die, such that a perpendicular projection of the first and second sensor location coincide.