A radiography system comprising a radiography device and a power supply device is provided. The radiography device includes a sensor unit for obtaining a radiographic image and is capable of non-contact power reception, and the power supply device is capable of non-contact power supply to the radiography device. In a period in which a fluctuation in a power supply frequency of the power supply from the power supply device to the radiography device affects a signal obtained by the radiography device from the sensor unit, the power supply device supplies power to the radiography device at a constant power supply frequency.

A radiography system comprising a radiography device and a power supply device is provided. The radiography device includes a sensor unit for obtaining a radiographic image and is capable of non-contact power reception, and the power supply device is capable of non-contact power supply to the radiography device. In a period in which a fluctuation in a power supply frequency of the power supply from the power supply device to the radiography device affects a signal obtained by the radiography device from the sensor unit, the power supply device supplies power to the radiography device at a constant power supply frequency.

The present disclosure provides an X-ray detecting device, and a manufacturing method of an X-ray detecting panel. The present disclosure also provides an X-ray detecting panel including a main bias voltage signal line and a photodiode. A cathode of the photodiode is electrically connected to the main bias voltage signal line. The X-ray detecting panel further includes at least one auxiliary bias voltage signal line electrically connected to the main bias voltage signal line.

Some embodiments include an x-ray system, comprising: an x-ray detector comprising: a housing; a sensor array configured to generate an image in response to incident x-ray radiation and disposed in the housing; a control circuit coupled to the sensor array, configured to control the sensor array, and disposed in the housing; and a first connector interface disposed on an exterior of the housing and electrically connected to the control circuit; an adapter comprising: a second connector interface configured to physically and electrically mate with the first connector interface; a third connector interface having at least one of a physical configuration and an electrical configuration different from the first connector interface; and a plurality of electrical connections between the second connector interface and the third connector interface.

Some embodiments include an x-ray system, comprising: an x-ray detector comprising: a housing; a sensor array configured to generate an image in response to incident x-ray radiation and disposed in the housing; a control circuit coupled to the sensor array, configured to control the sensor array, and disposed in the housing; and a first connector interface disposed on an exterior of the housing and electrically connected to the control circuit; an adapter comprising: a second connector interface configured to physically and electrically mate with the first connector interface; a third connector interface having at least one of a physical configuration and an electrical configuration different from the first connector interface; and a plurality of electrical connections between the second connector interface and the third connector interface.

A switching mode power supply includes a microcontroller, an interface circuit connected to the controller, and a boost circuit connected to the controller. A feedback circuit is connected to the controller, and an SiPM is connected to the boost circuit and the feedback circuit.

A sensor system includes a detector substrate, multiple readout substrates and a processing substrate. The detector substrate has a detector mounted thereon. Each of the readout substrates is disposed perpendicular to the detector substrate, and has corresponding readout circuitry mounted thereon. The processing substrate is disposed perpendicular to each of the readout substrates and parallel to the detector substrate, and has one or more processing elements mounted thereon. Electrical connections between component nodes on the detector substrate and corresponding readout substrates are made using connectors or right-angled solder joints created using a solder reflow process. Electrical connections between component nodes on the processing substrate and corresponding readout substrates are also made using connectors or right-angled solder joints created using a solder reflow process. The geometric arrangement of the substrates allows for high density of pixelation on the detector. In an embodiment, the sensor system is a radiation detector system.

A sensor system includes a detector substrate, multiple readout substrates and a processing substrate. The detector substrate has a detector mounted thereon. Each of the readout substrates is disposed perpendicular to the detector substrate, and has corresponding readout circuitry mounted thereon. The processing substrate is disposed perpendicular to each of the readout substrates and parallel to the detector substrate, and has one or more processing elements mounted thereon. Electrical connections between component nodes on the detector substrate and corresponding readout substrates are made using connectors or right-angled solder joints created using a solder reflow process. Electrical connections between component nodes on the processing substrate and corresponding readout substrates are also made using connectors or right-angled solder joints created using a solder reflow process. The geometric arrangement of the substrates allows for high density of pixelation on the detector. In an embodiment, the sensor system is a radiation detector system.

An analog front-end circuit includes an array of pixel circuits. Each pixel circuit includes an event counter and a power consumption circuit. The event counter is configured to count photons incident at the pixel circuit. The power compensation circuit includes an event rate circuit and a current sink circuit. The event rate circuit is configured to determine a rate of photon detection events at the pixel circuit. The current sink circuit is configured to pass a compensation current selected based on the rate of photon detection events at the pixel circuit.

A computed tomography device includes a holding frame and a ring mount, being movably mounted to the holding frame. The ring mount includes an x-ray detector, with a semiconductor material, operable in an equilibrium of statistical states of occupation. In an embodiment, the computed tomography device includes a first power supply, set up to supply power, in an operating state of the computed tomography device, to a first lot of components of the computed tomography device, the first lot of components being arranged on the ring mount for an image generation process; and a second power supply, separable from the first power supply in terms of circuitry, to supply power to a second lot of components of the computed tomography device in a resting state of the computed tomography device, the components of the second lot being set up to hold the semiconductor material in the equilibrium.