The invention refers to a detector based on 3D geometry made from a hydrogenated amorphous silicon substrate. This detector finds application in the detection of ionizing radiation.

According to an aspect, an active matrix substrate of an X-ray imaging panel includes: an active matrix substrate having a pixel region including a plurality of pixels; and a scintillator that converts X-rays projected onto the X-ray imaging panel to scintillation light. The plurality of pixels include respective photoelectric conversion elements. The active matrix substrate further includes a first planarizing film that covers the photoelectric conversion elements, is formed from an organic resin film, and has a plurality of first contact holes and a first wiring line that is formed in the first contact holes and in a layer upper than the first planarizing film and connected to the photoelectric conversion elements within the first contact holes.

The present invention relates to a photon counting detector comprising a plurality of detector tiles. Each detector tile comprises a sensor material layer (20), an integrated circuit (30), an input/output connection or flex (50), a high voltage electrode or foil (60), and an anti scatter grid (10). The input/output connection or flex is connected to the integrated circuit. The integrated circuit is configured to readout signals from the sensor material layer. The anti scatter grid is positioned adjacent to a surface of the sensor material layer. The high voltage electrode or foil extends across the surface of the sensor material layer and is configured to provide a bias voltage to the surface of the sensor material layer. The high voltage electrode or foil comprises at least one tail section (70). Relating to the photon counting detector and the plurality of detector tiles, the high voltage electrode or foil of a first detector tile is configured to make an electrical connection with the high voltage electrode or foil of an adjacent detector tile via one or more tail sections of the at least one tail section of the first detector tile and/or via one or more tail sections of the at least one tail section of the adjacent detector tile.

Methods and devices for detecting incident radiation, such as incident X-rays, gamma-rays, and/or alpha particle radiation are provided. The methods and devices use high purity, high quality single-crystals of inorganic semiconductor compounds, including solid solutions, having the formula AB.sub.2X.sub.5, where A represents Tl or In, B represents Sn or Pb, and X represents Br or I, as photoelectric materials.

A semiconductor material having the molecular formula Cu2l2Se6 is provided. Also provided are solid solutions of semiconductor materials having the formulas Cu2lxBr2-xSeyTe6-y and Cu2lxBr2-xSeyS6-y, where 0≤x≤1 and 0≤y≤3. Methods and devices that use the semiconductor materials to convert incident radiation into an electric signal are also provided. The devices include optoelectronic and photonic devices, such as photodetectors, photodiodes, and photovoltaic cells.

According to one embodiment, a radiation detector includes a first conductive layer including a first conductive region, and a first stacked body. The first stacked body includes a first electrode separated from the first conductive region in the a direction, a first scintillator layer provided between the first conductive region and the first electrode, a first intermediate electrode provided between the first scintillator layer and the first electrode, and a first organic semiconductor layer provided between the first intermediate electrode and the first electrode.

Example embodiments generally relate to a detector for electromagnetic radiation such as a detector comprising a first, pixelated electrode layer comprising a plurality of electrode pixels, a first layer comprising a plurality of tiles comprising a material configured to absorb and convert the electromagnetic radiation, and a second electrode layer, as well as a method of producing a detector for electromagnetic radiation, comprising providing a first, pixelated electrode layer comprising a plurality of electrode pixels, applying a plurality of tiles comprising a material configured to absorb and convert the electromagnetic radiation on the first, pixelated electrode layer, and applying a second electrode layer on the first layer.

Disclosed herein is a radiation detector comprising: an electronics layer comprising a first set of electric contacts and a second set of electric contacts; a radiation absorption layer configured to absorb radiation; a semiconductor substrate, portions of which extend into the radiation absorption layer in a direction of thickness thereof, the portions forming a first set of electrodes and a second set of electrodes; wherein the first set of electrodes and the second set of electrodes are interdigitated; wherein the semiconductor substrate comprises a p-n junction that separates first set of electrodes from the second set of electrodes; wherein the electronics layer and the semiconductor substrate are bonded such that the first set of electrodes are electrically connected to the first set of electric contacts and the second set of electrodes are electrically connected to the second set of electric contacts.

A detector is for electromagnetic radiation. In an embodiment, the detector includes a first, pixelated electrode layer, a second electrode, and a first layer including at least one first perovskite, located between the first, pixelated electrode layer and the second electrode. An embodiment further relates to a method for manufacturing a corresponding detector.

A radiation detection device includes a detection element including a substrate having a first surface and a second surface, a first electrode on the first surface, a second electrode adjacent to the first electrode in a first direction, a third electrode adjacent to the first electrode in a second direction; a fourth electrode adjacent to the third electrode in the first direction and adjacent to the second electrode in the second direction and a fifth electrode on the first surface and between the first and second electrode, between the first and third electrode, between the second and fourth electrode, and between the third and fourth electrode; a wiring layer on the second surface and including a first wiring, a second wiring, a third wiring, and a fourth wiring; and a circuit element opposite to the wiring layer and connected to the first to fourth wiring.