A camera array, an imaging device and/or a method for capturing image that employ a plurality of imagers fabricated on a substrate is provided. Each imager includes a plurality of pixels. The plurality of imagers include a first imager having a first imaging characteristics and a second imager having a second imaging characteristics. The images generated by the plurality of imagers are processed to obtain an enhanced image compared to images captured by the imagers. Each imager may be associated with an optical element fabricated using a wafer level optics (WLO) technology.

A lens module arranged on a light-sensing surface of a sensor module is disclosed. The lens module includes at least one lens stacked along an optical axis and the lens includes a lens fixing element and a plurality of lens elements. The lens fixing element is provided with a plurality of through holes each receiving a corresponding one of the lens elements, and an edge of the lens elements is secured to the lens fixing element. According to the present invention, each of the through holes has the same shape as a corresponding one of photosensitive regions of the light-sensing surface, as well as a side wall spaced from the photosensitive region in the direction perpendicular to the optical axis by a relatively uniform gap. In the present invention, there is also provided a camera comprising such a lens module.

A fabrication method for stretchable/conformable electronic and optoelectronic circuits and the resulting circuits. The method may utilize a variety of electronic materials including, but not limited to Silicon, GaAs, InSb, Pb Se, CdTe, organic semiconductors, metal oxide semiconductors and related alloys or hybrid combinations of the aforementioned materials. While a wide range of fabricated electronic/optoelectronic devices, circuits, and systems could be manufactured using the embodied technology, a hemispherical image sensor is an exemplary advantageous optoelectronic device that is enabled by this technology. Other applications include but are not limited to wearable electronics, flexible devices for the internet-of-things, and advanced imaging systems.

A meta lens assembly includes a first meta lens, a second meta lens arranged on an image side of the first meta lens, and a third meta lens arranged on an image side of the second meta lens, the first meta lens, the second meta lens, and the third meta lens being arranged from an object side of the meta lens assembly to an image side of the meta lens assembly facing an image sensor.

A moiré pattern imaging device includes a light-transmitting film and an optical sensor. The light-transmitting film includes a plurality of microlenses, and a light-incident surface and a light-exit surface opposite to each other. The plurality of microlenses are disposed on the light-incident surface, the light-exit surface or a combination thereof, and the plurality of microlenses are arranged in two dimensions to form a microlens array. The optical sensor includes a photosurface. The photosurface faces the light-exit surface of the light-transmitting film, the photosurface is provided with a plurality of pixels, and the plurality of pixels are arranged in two dimensions to form a pixel array. The microlens array and the pixel array correspondingly form a moiré pattern effect to produce an imaging magnification effect, and the photosurface of the optical sensor senses light and forms a moiré pattern magnification image.

There is provided a camera module including a stacked lens structure including a plurality of lens substrates. The plurality of lens substrates includes a first lens substrate including a first lens that is disposed at an inner side of a through-hole formed in the first lens substrate, and a second lens substrate including a second lens that is disposed at an inner side of a through-hole formed in the second lens substrate, wherein the first lens substrate is directly bonded to the second lens substrate. The camera module further includes an electromagnetic drive unit configured to adjust a distance between the stacked lens structure and a light-receiving element.

An optical unit includes a transparent first substrate, a transparent second substrate, a transparent first projection forming a part of an optical path, and a first aperture configured by black resin filled in a periphery of the first projection between the first substrate and the second substrate.

A projector assembly includes three coaxially aligned lenses and an aperture stop. The three coaxially aligned lenses include a first lens and, in order of increasing distance therefrom and on a same side thereof, a second lens and a positive meniscus lens. The first lens is a positive lens. The second lens is a negative lens. The second lens is located between the aperture stop and the positive meniscus lens. The projector assembly is one-sided telecentric at a plane proximate the positive meniscus lens.

The present disclosure relates to an imaging apparatus and electronic equipment that make it possible to reduce peeling stresses at angled sections included in the four corners of a lens, and prevent the lens from being peeled off. An imaging apparatus includes a solid-state imaging element that generates a pixel signal by photoelectric conversion according to a light amount of incident light, a glass substrate provided on the solid-state imaging element, and a lens provided on the glass substrate, in which four corners of the lens that is substantially rectangular when seen in a plan view do not have angles equal to or smaller than 90°. The present technology may be applied to an imaging apparatus and the like, for example.

A lens assembly includes a plurality of lens arrays sequentially disposed from an object side toward an image side, wherein each lens array includes a plurality of lenses, and a plurality of lenses included in a lens array of the plurality of lens arrays, disposed to be closest to the image side have a length in a first axis direction, perpendicular to an optical axis, longer than a length in a second axis direction, perpendicular to both the optical axis and the first axis direction.