An optical light package includes an optical output lens, an optical filter located thereunder and between the output lens and LEDS, a tray of LEDs arrayed on a stage mounted on a linear comb based MEMS device that is distributed in such a way that the stage is movable, and a driver that controls movement of the stage.

A demultiplexer for use in a wavelength division multiplexed system. The demultiplexer comprises: an input waveguide, configured to receive a wavelength division multiplexed signal; a demultiplexing element, configured to demultiplex the multiplexed signal received from the input waveguide into a plurality of multi-mode demultiplexed signal components; a multi-mode output waveguide, the multi-mode output waveguide being coupled to the demultiplexing element and configured to receive one of the multi-mode demultiplexed signal components; and a splitter, coupled to the multi-mode output waveguide, and configured to split the received multi-mode demultiplexed signal component into two single-mode outputs.

A photonic device includes a PCB having an integrated circuit mounted thereon, with a cap mounted to the PCB and carrying a lens positioned over the integrated circuit. The cap is formed by: an outer wall mounted to the PCB, extending upwardly from the PCB, and surrounding a portion of the integrated circuit; a first retention structure extending inwardly from the outer wall and across the integrated circuit, the first retention structure having a hole defined therein; and a second retention structure having a hole defined therein, the second retention structure being affixed within the first retention structure such that the hole in the second retention structure is axially aligned with the hole in the first retention structure. The lens is mechanically constrained within the cap between the first retention structure and the second retention structure.

The chemical sensing device comprises a substrate of semiconductor material, integrated circuit components and a photodetector formed in the substrate, a dielectric on the substrate, a wiring in the dielectric, and a source of electromagnetic radiation, a waveguide and a fluorescent sensor layer arranged in or above the dielectric. A portion of the waveguide is arranged to allow the electromagnetic radiation emitted by the source of electromagnetic radiation to be coupled into the waveguide. A further portion of the waveguide is arranged between the photodetector and the fluorescent sensor layer.

Photonic chip includes an external cavity (EC) optical circuit to provide wavelength-selective optical feedback to a length of active optical fiber. Light generated in the active optical fiber may be coupled from the EC circuit to a light processing circuit of the photonic chip, such as an optical modulator or an optical mixer. The EC circuits may include single-frequency and multi-frequency optical filters, which may include ring resonators, dual-ring resonators, and optical modulators to support multi-frequency lasers. The EC circuits may further include pump combiners and optical isolators.

Arrays of integrated analytical devices and their methods for production are provided. The arrays are useful in the analysis of highly multiplexed optical reactions in large numbers at high densities, including biochemical reactions, such as nucleic acid sequencing reactions. The devices allow the highly sensitive discrimination of optical signals using features such as spectra, amplitude, and time resolution, or combinations thereof. The devices include an integrated diffractive beam shaping element that provides for the spatial separation of light emitted from the optical reactions.

An optical filter device may include an optical waveguide having an input and an output, and a plurality of first optical resonators optically coupled to the optical waveguide along a length thereof between the input and the output. The optical filter device may further include at least one second optical resonator optically coupled to the plurality of first optical resonators opposite the optical waveguide.

The present disclosure relates to system-level integration of lasers, electronics, integrated photonics-based optical components and a rotation sensing element, which can be a fiber coil or a sensing coil/micro-resonator ring on a sensing chip. Novel waveguide design on the integrated photonics chip, acting as a front-end chip, ensures precise detection of phase change in the fiber coil or the sensing chip, where the sending chip is coupled to the front end chip. Electrical and/or thermal phase modulators are integrated with the integrated photonics chip. Additionally, implant regions are introduced around the waveguides and other optical components to block unwanted/stray light into the waveguides and optical signal leaking out of the waveguide.

A photonic integrated circuit (“PIC”) bandpass filter with polarization diversity can comprise a polarization management stage operable to receive a polarization diverse light input and to output an intermediate beam having a uniform polarization, and a filter stage operable to receive the intermediate beam from the polarization management stage, to filter the intermediate beam, and to output a filter output beam. Energy from both an in-plane polarization and an out-of-plane polarization of the polarization diverse light input can thereby be transferred to the filter stage.

The present invention provides a multi-channel integrated optical wavelength division multiplexing/demultiplexing assembly structure, comprising a light transmitting assembly and a light receiving assembly, the light transmitting assembly consisting of a laser chip array, a coupling lens set, a wavelength division multiplexing assembly, a single coupling lens and a single-core optical fiber, wherein the wavelength division multiplexing assembly comprises an optical waveguide chip, a band-pass filter set, a full-wavelength reflection unit, and multiple segments of waveguide optical paths that are continuously distributed in the optical waveguide chip in a Z-shape or W-shape, each of the multiple segments of waveguide optical paths has an input port and an output port which are distributed on left and right sides of the optical waveguide chip, respectively, the output ports comprise a tail end port which is arranged in correspondence to the single coupling lens, the band-pass filter set covers the input ports, and the full-wavelength reflection unit covers the output ports other than the tail end port. With the combination of the foregoing structure configurations, the technical problem of the presence of accuracy offset of the overall optical path is solved, and the effects of easy assembly, reduced cost and improved product yield are realized.