An optical switch device includes a first semiconductor structure configured to operate as a first waveguide and a second semiconductor structure configured to operate as a second waveguide. The second semiconductor structure is located above or below the first semiconductor structure and separated from the first semiconductor structure. The second semiconductor structure includes a first portion having a first width and a second portion having a width different from the first width and located on the first portion. The first portion is located between a first doped region and a second doped region.

A LiDAR system has a field of view and includes a polarization-based waveguide splitter. The splitter includes a first splitter port, a second splitter port and a common splitter port. A laser is optically coupled to the first splitter port via a single-polarization waveguide. An objective lens optically couples each optical emitter of an array of optical emitters to a respective unique portion of the field of view. An optical switching network is coupled via respective dual-polarization waveguides between the common splitter port and the array of optical emitters. An optical receiver is optically coupled to the second splitter port via a dual-polarization waveguide and is configured to receive light reflected from the field of view. A controller, coupled to the optical switching network, is configured to cause the optical switching network to route light from the laser to a sequence of the optical emitters according to a temporal pattern.

Electrical test of optical components via metal-insulator-semiconductor capacitor structures is provided via a plurality of optical devices including a first material embedded in a second material, wherein each optical device is associated with a different thickness range of a plurality of thickness ranges for the first material; a first capacitance measurement point including the first material embedded in the second material; and a second capacitance measurement point including a region from which the first material has been replaced with the second material.

An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.

In some embodiments method comprises depositing a ferroelectric layer on a top surface of a semiconductor wafer and forming one or more gaps in the ferroelectric layer. The one or more gaps can be formed on a repetitive spacing to relieve stresses between the ferroelectric layer and the semiconductor wafer. A first dielectric layer is deposited over the ferroelectric layer and the first dielectric layer is planarized to fill in the gaps. A second dielectric layer is formed between the ferroelectric layer and the semiconductor wafer. The second dielectric layer can be formed by annealing the wafer in an oxidizing atmosphere such that an upper portion of the semiconductor substrate forms an oxide layer between the semiconductor substrate and the ferroelectric layer.

A large-scale single-photonics-based optical switching system that occupies an area larger than the maximum area of a standard step-and-repeat lithography reticle is disclosed. The system includes a plurality of identical switch blocks, each of is formed in a different reticle field that no larger than the maximum reticle size. Bus waveguides of laterally adjacent switch blocks are stitched together at lateral interfaces that include a second arrangement of waveguide ports that is common to all lateral interfaces. Bus waveguides of vertically adjacent switch blocks are stitched together at vertical interfaces that include a first arrangement of waveguide ports that is common to all vertical interfaces. In some embodiments, the lateral and vertical interfaces include waveguide ports having waveguide coupling regions that are configured to mitigate optical loss due to stitching error.

An integrated circuit (IC) package comprising an optical die comprising a configurable optical switch. The configurable optical switch comprises an optical switch operably coupled to one or more optical transceivers. An optical connector comprises at least one exo-package optical port. The at least one exo-package optical port is operably coupled to the configurable optical switch. The configurable optical switch is to pass an optical signal on the at least one of the one or more exo-package ports to at least one of the one or more optical transceivers, and an IC die comprising electronic circuitry is operably coupled to the one or more optical transceivers.

According to various aspects of the present disclosure, an apparatus is provided. In an aspect, the apparatus includes an optical transceiver having a first port, a second port and an optical switch coupled to the first port and the second port. The optical switch is switchable between a unidirectional port operation mode and a bidirectional port operation mode. When the optical switch is in the unidirectional port operation mode, the first port is configured to send a first optical signal, and the second port configured to receive a second optical signal. When the optical switch is in the bidirectional port operation mode, the first port configured to send the first optical signal and receive the second optical signal, and the second port configured to receive a third optical signal and not send the first signal. Furthermore, a second bidirectional port operation mode is supported with the second port configured to send the first optical signal and receive the second optical signal, and the first port configured to receive a third optical signal and not send the first signal.

An optical switch is configured by providing a planar lightwave circuit layer on a top surface of a Si substrate. The circuit layer forms, on the top surface of the substrate, an optical waveguide including an underclad layer, an optical waveguide core, and an overclad layer. The optical waveguide is provided to have a structure configuring a Mach-Zehnder interferometer. A heater is provided at a position just above an arm of the core on the top surface of the clad layer, and power supply electric wires are electrically connected to both ends of the heater. In a local portion including an interface between the clad layer and the top surface of the substrate, trench structure portions as concave grooves are provided.

An optical aperture system is provided that includes a photonic integrated circuit. The photonic integrated circuit includes a plurality of apertures, a plurality of optical phase shifters coupled to respective apertures of the plurality of apertures, an optical splitter-combiner coupled to the plurality of optical phase shifters, an optical switch coupled to the optical splitter-combiner, a light source coupled to the optical switch, and a photodetector coupled to the optical switch. The optical aperture system further includes a controller configured to execute a first set of instructions to control the plurality of optical phase shifters and the light source in accordance with a first operating mode of a plurality of operating modes of the optical aperture system, and a processor configured to execute a second set of instructions to process an output of the photodetector in accordance with the first operating mode of the optical aperture system.