Patent classifications
G02B26/0866
Packaging for compact object-scanning modules
The present disclosure is directed to compact packaging for optical MEMS devices, such as one- and two-dimensional beam scanners. An embodiment in accordance with the present disclosure includes a light source and a MEMS-based scanning element for steering at least a portion of the light provided by the light source in at least one dimension as an output light signal, as well as one or more optical elements for collimating and/or redirecting light within a sealed chamber defined by the elements of a housing. In some embodiments, the one or more optical elements include a reflective lens that collimates the light provided by the light source while simultaneously correcting phase-front error imparted by the scanning element while steering the output beam.
Eye-Tracking System and Method Therefor
A system for tracking eye location is disclosed. Systems in accordance with the present invention include a scanner for sweeping a first optical signal across the surface of an eye, a detector for detecting a second optical signal reflected from the eye, and a detection circuit for determining a maximum intensity in the second optical signal. In operation, the scanner sweeps the first optical signal over the surface of the eye while the detection circuitry determines a plurality of intensity maxima in the second optical signal. The time between the intensity maxima during the sweep is indicative of the location of the cornea within the eye surface.
Opto-electro-mechanical beam manipulation system
An opto-electro-mechanical system for manipulating optical radiation comprising a rotationally or translationally movable element, wherein the element is itself an optical element or comprises an optical element. Furthermore the system comprises a stator for the movable element having a recess enabling a deflection range, a flexible connection between the stator and the movable element providing a corresponding kinematically defined mobility, and an actuator for deflecting the movable element, wherein the stator is connected as one piece to the movable element, and the one-piece connection consists of silicate glass- and the recess is arranged around the movable element in such a way that the movable element is deflectable in accordance with the kinematically defined mobility with elastic deformation of the connection by means of the actuator.
Optical structure with ridges arranged at the same and method for producing the same
An apparatus having an optical structure and ridges is described, wherein adhesive is arranged between the ridges and the optical structure, wherein the adhesive is effective to effect, after its annealing, a predetermined orientation of the optical structure in relation to a reference plane.
Semiconductor device
According to an embodiment, a semiconductor device includes a first actuator, a second actuator, a first frame provided between the first actuator and the second actuator, a first connection member connecting the first actuator and the first frame to each other, a second connection member connecting the first actuator and the first frame to each other at a position different from a position at which the first connection member connects the first actuator and the first frame to each other, a third connection member connecting the second actuator and the first frame to each other, a fourth connection member connecting the second actuator and the first frame to each other at a position different from a position at which the third connection member connects the second actuator and the first frame to each other.
ARRAY OF HEATING RESISTORS FOR MEMS MIRRORS
A micro-electromechanical system (MEMS) apparatus has an array of micro-mirrors and a control circuit for rotating the micro-mirrors synchronously at a resonant frequency. An array of heating resistors is used to heat the array of micro-mirrors compensate for changes in resonant frequency with temperature. A temperature sensor is mounted proximate the chip package for detecting a temperature proximate the array of micro-mirrors. A temperature control circuit, coupled to the temperature sensor and the array of heating resistors, provides current to the array of heating resistors in response to a change in temperature that will change the resonant frequency.
Sequential beam splitting in a radiation sensing apparatus
Systems, methods, and apparatuses for providing electromagnetic radiation sensing using sequential beam splitting. The apparatuses can include a micro-mirror chip having a plurality of light reflecting surfaces, an image sensor having an imaging surface, and a beamsplitter unit located between the micro-mirror chip and the image sensor. The beamsplitter unit includes a plurality of beamsplitters aligned along a horizontal axis that is parallel to the micro-mirror chip and the imaging surface. The beamsplitters implement the sequential beam splitting. Because of the structure of the beamsplitter unit, the height of the arrangement of the micro-mirror chip, the beamsplitter unit, and the image sensor is reduced such that the arrangement can fit within a mobile device. Within a mobile device, the apparatuses can be utilized for human detection, fire detection, gas detection, temperature measurements, environmental monitoring, energy saving, behavior analysis, surveillance, information gathering and for human-machine interfaces.
DEVICES FOR THERMALLY ACTUATING DEFORMABLE MIRROR, AND ASSOCIATED MANUFACTURING METHODS
A device for thermally actuating a deformable mirror includes a monolithic block that includes a mirror plate having a front face forming or configured to support a mirror, a base, and a one-dimensional array of thermally expandable actuators. The thermally expandable actuators mechanically connect a rear face of the mirror plate to the base such that shape, tilt, and/or location of the front face depend on temperature of the thermally expandable actuators. The mirror plate, base, and thermally expandable actuators are defined by slits that span between opposite-facing top and bottom surfaces of the monolithic block. The monolithic block may be made of a metal and may be manufactured at relatively low cost by wire eroding the slits in a metal block, using a wire that passes through the metal block between its top and bottom surfaces.
Optical switch and optical routing method and system
An optical switch is proposed, for routing an optical transmission signal according to an optical control signal, including one or more optical control ports; three or more optical transmission ports; a light director; and a thermally driven light mill; where the light mill and the light director are arranged with respect to each other, to the one or more control ports and to the three or more transmission ports such that: illumination of a respective one of the one or more control ports by a control beam carrying the control signal drives the light mill to rotate towards a respective position in which the light director is arranged so as to direct a transmission beam carrying the transmission signal, entering the switch via a respective one of the transmission ports, to exit the switch via a respective other of the transmission ports.
MEMS Device for Large Angle Beamsteering
An actuator element of a MEMS device is provided, which is fabricated using surface micromachining on a substrate. An insulating layer having a first portion contacts the substrate while a second portion is separated from the substrate by a gap. A metallic layer contacts the insulating layer having a first portion contacting the first portion of the insulating layer and a second portion contacting the second portion of the insulating layer. The second portion of the metallic layer is prestressed. Alternately, the actuator element includes a first insulating layer separated from the substrate by a gap. A metallic layer has a first portion contacting the substrate and a second portion contacting the insulating layer. A second insulating layer contacts a portion of the second portion of the metallic layer opposite the first insulating layer, where the second insulating layer is prestressed.