A light conversion portion is constituted by a conversion material that converts infrared light to visible light. A reflection portion is fixed to a position on a main substrate at which the reflection portion faces an output end of an optical waveguide chip on the side from which light is output to an external space. The reflection portion includes a reflection surface that faces the output end and is inclined with respect to a plane of the main substrate such that a reflection direction is toward the upper side of the main substrate. The reflection surface reflects near infrared light.

A photonic integrated circuit includes a photonic device. The photonic device includes an input region configured to receive an input signal including a plurality of multiplexed channels. The photonic device includes a metastructured dispersive region structured to partially demultiplex the input signal into an output signal and a throughput signal. The output signal includes a channel of the multiplexed channels. The throughput signal includes the remaining channels of the multiplexed channels. The photonic device includes an output region and a throughput region optically coupled with the metastructured dispersive region to receive the output signal and the throughput signal, respectively. The metastructured dispersive region includes a heterogeneous distribution of a first material and a second material that structures the metastructured dispersive region to partially demultiplex the input signal into the output signal and the throughput signal.

A photonic integrated circuit (PIC) having a substrate in which vertically coupled photodetectors and in-line optical modulators are integrated to enable vertical coupling of light using a fiber assembly block (FAB), with the planar end surface thereof being attached to a substantially planar main surface of the substrate. In an example embodiment, the photodetectors are buried in deep vias formed in the substrate, and the in-line optical modulators are waveguide-connected to the corresponding vertical-coupling optical gratings. The photodetectors and optical gratings may be arranged in a linear array along the main surface of the substrate to enable uncomplicated optical alignment of end segments of the optical fibers in the FAB with the corresponding photodetectors and optical gratings for vertical coupling of light therebetween. In some embodiments, the FAB may have more than one hundred optical fibers. In some embodiments, the PIC can be implemented using the silicon photonics material platform.

A demultiplexer for use in a wavelength division multiplexed system. The demultiplexer comprises: an input waveguide, configured to receive a wavelength division multiplexed signal; a demultiplexing element, configured to demultiplex the multiplexed signal received from the input waveguide into a plurality of multi-mode demultiplexed signal components; a multi-mode output waveguide, the multi-mode output waveguide being coupled to the demultiplexing element and configured to receive one of the multi-mode demultiplexed signal components; and a splitter, coupled to the multi-mode output waveguide, and configured to split the received multi-mode demultiplexed signal component into two single-mode outputs.

The invention described herein pertains to the structure and formation of dual core waveguide structures and to the formation of optical devices including spot size converters from these dual core waveguide structure for the receiving and routing of optical signals on substrates, interposers, and sub-mount assemblies.

An optical system includes a tunable laser that generates an optical signal at an output that is wavelength tunable. A wavelength router directs particular wavelength bands of the optical signal to particular ones of the plurality of outputs. An optical emitter emits an optical beam at an output, wherein tuning the tunable laser steers the emitted beam.

A waveguide structure and a method for splitting light is described. The method may include optically coupling a first waveguide and a second waveguide, where the optical coupling may be wavelength insensitive. The widths of the first and second waveguides may be non-adiabatically varying and the optical coupling may be asymmetric between the first and second waveguides. A gap between the first and second waveguides may also be varied non-adiabatically and the gap may depend on the widths of the first and second waveguides. The optical coupling between the first and second waveguides may also occur in the approximate wavelength range of 800 nanometers to 1700 nanometers.

An optical subassembly includes a planar dielectric waveguide structure that is deposited at temperatures below 400 C. The waveguide provides low film stress and low optical signal loss. Optical and electrical devices mounted onto the subassembly are aligned to planar optical waveguides using alignment marks and stops. Optical signals are delivered to the submount assembly via optical fibers. The dielectric stack structure used to fabricate the waveguide provides cavity walls that produce a cavity, within which optical, optoelectronic, and electronic devices can be mounted. The dielectric stack is deposited on an interconnect layer on a substrate, and the intermetal dielectric can contain thermally conductive dielectric layers to provide pathways for heat dissipation from heat generating optoelectronic devices such as lasers.

Example gratings, grating characteristic adjustment methods and devices are provided. One example grating includes a first optical waveguide region, a second optical waveguide region, and an arrayed waveguide region comprising a plurality of optical waveguides, where the first optical waveguide region is connected to the arrayed waveguide region, and the second optical waveguide region is connected to the arrayed waveguide region. The grating has at least one of the following characteristics: a refractive index of an optical waveguide in the first optical waveguide region can be changed, a refractive index of an optical waveguide in the second optical waveguide region can be changed, a refractive index of an optical waveguide in the arrayed waveguide region can be changed, or an optical waveguide in an arrayed waveguide region can be eliminated.

An optical circuit includes one or more input waveguides, a plurality of output waveguides, and a reflector structure. At least a portion of the reflector structure forms an interface with the one or more input waveguides. The portion of the reflector structure has a smaller refractive index than the one or more input waveguides. An electrical circuit is electrically coupled to the optical circuit. The electrical circuit generates and sends different electrical signals to the reflector structure. In response to the reflector structure receiving the different electrical signals, a carrier concentration level at or near the interface or a temperature at or near the interface changes, such that incident radiation received from the one or more input waveguides is tunably reflected by the reflector structure into a targeted output waveguide of the plurality of output waveguides.