Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.

Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.

A method and apparatus for mass production of AR diffractive waveguides. Low-cost mass production of large-area AR diffractive waveguides (slanted surface-relief gratings) of any shape. Uses two-photon polymerization micro-nano 3D printing to realize manufacturing of slanted grating large-area masters of any shape (thereby solving the problem about manufacturing of slanted grating masters of any shape on the one hand, realizing direct manufacturing of large-size wafer-level masters on the other hand, and also having the advantages of low manufacturing cost and high production efficiency). Composite nanoimprint lithography technology is employed (in combination with the peculiar imprint technique and the composite soft mold suitable for slanted gratings) to solve the problem that a large-slanting-angle large-slot-depth slanted grating cannot be demolded and thus cannot be manufactured, and realize the manufacturing of the slanted grating without constraints (geometric shape and size).

An integrated optical beam steering device includes a planar Luneburg lens that collimates beams from different inputs in different directions within the lens plane. It also includes a curved (e.g., semi-circular or arced) grating coupler that diffracts the collimated beams out of the lens plane. The beams can be steered in the plane by controlling the direction along which the lens is illuminated and out of the plane by varying the beam wavelength. Unlike other beam steering devices, this device can operate over an extremely wide field of view—up to 180°—without any aberrations off boresight. In other words, the beam quality is uniform in all directions, unlike with aplanatic lenses, thanks to the circular symmetry of the planar Luneburg lens, which may be composed of subwavelength features. The lens is also robust to misalignment and fabrication imperfections and can be made using standard CMOS processes.

An integrated optical beam steering device includes a planar Luneburg lens that collimates beams from different inputs in different directions within the lens plane. It also includes a curved (e.g., semi-circular or arced) grating coupler that diffracts the collimated beams out of the lens plane. The beams can be steered in the plane by controlling the direction along which the lens is illuminated and out of the plane by varying the beam wavelength. Unlike other beam steering devices, this device can operate over an extremely wide field of view—up to 180°—without any aberrations off boresight. In other words, the beam quality is uniform in all directions, unlike with aplanatic lenses, thanks to the circular symmetry of the planar Luneburg lens, which may be composed of subwavelength features. The lens is also robust to misalignment and fabrication imperfections and can be made using standard CMOS processes.

A LiDAR system has a field of view and includes a polarization-based waveguide splitter. The splitter includes a first splitter port, a second splitter port and a common splitter port. A laser is optically coupled to the first splitter port via a single-polarization waveguide. An objective lens optically couples each optical emitter of an array of optical emitters to a respective unique portion of the field of view. An optical switching network is coupled via respective dual-polarization waveguides between the common splitter port and the array of optical emitters. An optical receiver is optically coupled to the second splitter port via a dual-polarization waveguide and is configured to receive light reflected from the field of view. A controller, coupled to the optical switching network, is configured to cause the optical switching network to route light from the laser to a sequence of the optical emitters according to a temporal pattern.

A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of depths relative to the substrate. The manufacturing system performs a deposition of a second material over the profile created in the etch-compatible film. The manufacturing system performs a planarization of the second material to obtain a plurality of etch heights of the second material in accordance with the plurality of depths in the profile created in the etch-compatible film. The manufacturing system performs a lithographic patterning of a photoresist deposited over the planarized second material to obtain the plurality of etch heights and one or more duty cycles in the second material.

A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of depths relative to the substrate. The manufacturing system performs a deposition of a second material over the profile created in the etch-compatible film. The manufacturing system performs a planarization of the second material to obtain a plurality of etch heights of the second material in accordance with the plurality of depths in the profile created in the etch-compatible film. The manufacturing system performs a lithographic patterning of a photoresist deposited over the planarized second material to obtain the plurality of etch heights and one or more duty cycles in the second material.

A photonic structure is provided. The photonic structure includes a guiding region, a sensing region, and logic region. The guiding region has a first side and a second side opposite to the first side. The sensing region is disposed on the second side of the guiding region. The logic region is disposed on a side of the sensing region opposite to the guiding region. The guiding region, the sensing region, and the logic region are stacked along a vertical direction. A method for manufacturing the photonic structure is also provided.

A method includes forming a first photonic package, wherein forming the first photonic package includes patterning a silicon layer to form a first waveguide, wherein the silicon layer is on an oxide layer, and wherein the oxide layer is on a substrate; forming vias extending into the substrate; forming a first redistribution structure over the first waveguide and the vias, wherein the first redistribution structure is electrically connected to the vias; connecting a first semiconductor device to the first redistribution structure; removing a first portion of the substrate to form a first recess, wherein the first recess exposes the oxide layer; and filling the first recess with a first dielectric material to form a first dielectric region.