A probe structure includes a monolithically integrated waveguide and lens. The probe is based on SU-8 as a guiding material. A waveguide mold is defined using wet etching of silicon using a silicon dioxide mask patterned with 45 angle with respect to the silicon substrate edge and an aluminum layer acting as a mirror is deposited on the silicon substrate. A lens mold is made using isotropic etching of the fused silica substrate and then aligned to the silicon substrate. A waveguide polymer such as SU-8 2025 is flowed into the waveguide mask+lens mold (both on the same substrate) by decreasing its viscosity and using capillary forces via careful temperature control of the substrate.

A photoacoustic apparatus, comprising: at least one optical amplifier, configured to produce light; at least one photonic integrated circuit, configured as a tunable light filter; light guiding means, wherein the at least one optical amplifier, at least one photonic integrated circuit and light guiding means are configured as an optical cavity to produce laser light having an optical path within the optical cavity; and at least one acoustic sensor configured to detect sound produced by analyte introduced into the optical path of the laser light.

A probe structure includes a monolithically integrated waveguide and lens. The probe is based on SU-8 as a guiding material. A waveguide mold is defined using wet etching of silicon using a silicon dioxide mask patterned with 45 angle with respect to the silicon substrate edge and an aluminum layer acting as a mirror is deposited on the silicon substrate. A lens mold is made using isotropic etching of the fused silica substrate and then aligned to the silicon substrate. A waveguide polymer such as SU-8 2025 is flowed into the waveguide mask+lens mold (both on the same substrate) by decreasing its viscosity and using capillary forces via careful temperature control of the substrate.

A planar immersion lens can include any number of features. A planar immersion lens can be configured to control a phase profile of an incident wave by modulating the incident wave with sub-wavelength structures of varying impedances. The planar immersion lens can also be directly excited, with electronics or other subwavelength sources coupled to the planar immersion lens, to generate a wave with the desired phase profile. The planar immersion lens can include a plurality of metallic elements and passive elements disposed over a substrate. The passive elements can be selected, based on both the intrinsic and mutual impedances of the elements, to shape the spatial phase profile of the incident wave within this phase range. The phase gradient can be introduced along the incident material/refractive material interface to focus the incident wave into the refractive material having wave components at or beyond the critical angle. Methods are also provided.

There is provided a photonic integrated circuit configured for low-coherence interferometry and in-field sensing. The photonic integrated circuit can include an opto-coupler that has a substrate substantially transparent to a specified wavelength of light and a waveguide configured to route a light beam having a center wavelength at the specified wavelength. The opto-coupler further includes a mirror disposed at an angle, and the mirror is disposed on an angled surface of the substrate, the angled surface being proximate to an output end of the waveguide. The opto-coupler further includes a beam forming element configured to collect light reflected from the mirror, and the waveguide and the mirror are integrated within the substrate.

A light emitter includes a substrate including a first surface, a cladding on the first surface of the substrate, a core inside the cladding, a lid on the cladding, a first light-emitting element inside an element sealing area on the first surface, a second light-emitting element inside the element sealing area, a first light-receiving element inside the element sealing area, and a second light-receiving element inside the element sealing area. A first light-receiving surface of the first light-receiving element faces the lid, and a second light-receiving surface of the second light-receiving element faces the lid.

Microelectronic assemblies, related devices and methods, are disclosed herein. In some embodiments, a microelectronic assembly may include a substrate having a glass core with a surface and a dielectric material on a portion of the surface of the core, the dielectric material including conductive pathways; a photonic integrated circuit (PIC) having an active surface, wherein the PIC is coupled to the surface of the core with the active surface facing away from the core; a processor integrated circuit (XPU) electrically coupled to the conductive pathways in the dielectric material and to the active surface of the PIC; a first optical component optically coupled to a lateral surface of the PIC and to the surface of the core; and a second optical component coupled to the core, wherein the second optical component is optically coupled to the PIC by an optical pathway through the first optical component and the core.

A semiconductor package and a manufacturing method thereof are provided. A die stack in the semiconductor package includes a photonic die and an electronic die stacked on the photonic die by a face-to-face manner. A convex lens is disposed at a back surface of the electronic die, and is formed in an oval shape, such that optical beams can be collimated to have circular beam shape, as passing through the convex lens. In some embodiments, the semiconductor package includes more of the die stacks, and includes an interposer lying below the die stacks. In these embodiments, tilted reflectors are formed in the photonic dies and the interposer, to set up vertical optical paths between the interposer and the photonic dies, and lateral optical paths in the interposer. In this way, optical communication between the photonic dies can be established.

A light emitter includes a substrate including a first surface, a cladding on the first surface of the substrate, a core inside the cladding, a lid on the cladding, a first light-emitting element inside an element sealing area on the first surface, a second light-emitting element inside the element sealing area, a first light-receiving element inside the element sealing area, and a second light-receiving element inside the element sealing area. A first light-receiving surface of the first light-receiving element faces the lid, and a second light-receiving surface of the second light-receiving element faces the lid.

Eyewear including a frame, a projector supported by the frame, and a lens supported by the frame. The lens has a first surface facing an eye of the user and a second surface facing away from the eye of the user when the frame is worn. The lens also includes a waveguide defined by the first and second surfaces to receive light from the projector. An input light coupler and an output light coupler are on the first surface of the lens and at least one reflector is positioned on a second surface of the lens to redirect light received from the input coupler and/or the output coupler to redirect light having an angle of incidence with respect to the second surface of the lens that would result in that portion of the light exiting the waveguide through the second surface in the absence of the at least one reflector.