A coherent LIDAR imaging system includes a laser source; an optical splitter/recombiner designed to split the laser radiation into a reference beam and into an object beam and to superpose the reference beam on a reflected object beam reflected by the scene; and an optical imager creating an image of the scene on a detector. The detector includes an array of pixels designed for detecting the reflected object beam and the reference beam which together form a recombined beam having a beat frequency representative of a range of the illuminated scene. The optical splitter/recombiner is configured to form an intermediate image of the reference beam in an intermediate image plane perpendicular to the optical axis.

Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.

Embodiments of the disclosure provide an optical antenna for a photonic integrated circuit (PIC). The optical antenna includes a vertically oriented semiconductor waveguide with a first end on a semiconductor layer. The vertically oriented semiconductor waveguide includes a first sidewall and a second sidewall opposite the first sidewall. A reflective material is along the second sidewall of the vertically oriented semiconductor waveguide. A first plurality of grating protrusions extends from the first sidewall of the vertically oriented semiconductor waveguide.

Aspects of the present disclosure describe large scale steerable optical switched arrays that may be fabricated on a common substrate including many thousands or more emitters that may be arranged in a curved pattern at the focal plane of a lens thereby allowing the directional control of emitted light and selective reception of reflected light suitable for use in imaging, ranging, and sensing applications including accident avoidance.

There is provided an optical communication connector, an optical communication cable, and an electronic device that can curb occurrence of a transmission error. The optical communication connector includes a collimating lens that collimates light from multiple optical transmission lines transmitting optical signals, and a refracting portion that refracts and emits light emitted from the collimating lens, in which in the collimating lens, at least some of transmission channels and reception channels corresponding to the multiple optical transmission lines are thinned out. The optical communication connector can be applied to an optical communication system, for example.

There is provided an optical communication connector, an optical communication cable, and an electronic device that can curb occurrence of a transmission error. The optical communication connector includes a collimating lens that collimates light from multiple optical transmission lines transmitting optical signals, and a refracting portion that refracts and emits light emitted from the collimating lens, in which in the collimating lens, at least some of transmission channels and reception channels corresponding to the multiple optical transmission lines are thinned out. The optical communication connector can be applied to an optical communication system, for example.

A manufacturing system performs a deposition of an etch-compatible film over a substrate. The etch-compatible film includes a first surface and a second surface opposite to the first surface. The manufacturing system performs a partial removal of the etch-compatible film to create a surface profile on the first surface with a plurality of depths relative to the substrate. The manufacturing system performs a deposition of a second material over the profile created in the etch-compatible film. The manufacturing system performs a planarization of the second material to obtain a plurality of etch heights of the second material in accordance with the plurality of depths in the profile created in the etch-compatible film. The manufacturing system performs a lithographic patterning of a photoresist deposited over the planarized second material to obtain the plurality of etch heights and one or more duty cycles in the second material.

Embodiments of the present disclosure relate to methods for controlling etch depth by providing localized heating across a substrate. The method for controlling temperatures across the substrate can include individually controlling a plurality of heating pixels disposed in a dielectric body of a substrate support assembly. The plurality of heating pixels provide temperature distributions on a first surface of the substrate disposed on a support surface of the dielectric body. The temperature distributions correspond to a plurality of portions of at least one grating on a second surface of the substrate to be exposed to an ion beam. Additionally, the temperatures can be controlled by individually controlling light emitting diodes (LEDs) of LED arrays. The substrate is exposed to the ion beam to form a plurality of fins on the at least one grating. The at least one grating has a distribution of depths corresponding to the temperature distributions.

Embodiments of the present disclosure relate to methods for controlling etch depth by providing localized heating across a substrate. The method for controlling temperatures across the substrate can include individually controlling a plurality of heating pixels disposed in a dielectric body of a substrate support assembly. The plurality of heating pixels provide temperature distributions on a first surface of the substrate disposed on a support surface of the dielectric body. The temperature distributions correspond to a plurality of portions of at least one grating on a second surface of the substrate to be exposed to an ion beam. Additionally, the temperatures can be controlled by individually controlling light emitting diodes (LEDs) of LED arrays. The substrate is exposed to the ion beam to form a plurality of fins on the at least one grating. The at least one grating has a distribution of depths corresponding to the temperature distributions.

A head-mounted computing device having a convertible waveguide optical engine assembly is disclosed. The waveguide in accordance with aspects herein can be utilized in its transparent configuration, or may be provided with means for blocking light from passing through it either by using mechanical means, or by using different types of treatments that can switch the waveguide between opaque an transparent states based on an external stimulus, such as, for example, electricity, temperature, light, and the like. Further, the waveguide optical engine assembly comprises a compact footprint, which is advantageous for head-mounted computing devices. In addition to the compact footprint of the waveguide optical assembly, the configuration of the waveguide optical assembly, as disclosed, allows for maximization of advantages provided by the waveguide as related to eye box and eye relief.