G02B6/3584

ROTATIONAL AND TRANSLATIONAL MICROPOSITIONERS USING DEFORMABLE MICROELECTROMECHANICAL SYSTEMS
20230042123 · 2023-02-09 ·

Microelectromechanical systems (MEMS) have found widespread applications across biotechnology, medicine, communications, and consumer electronics. These are typically one-dimensional MEMS (e.g. rotation, linear translation on a single axis) or two-dimensional MEMS (e.g. linear translation in two directions in the plane of the MEMS). It would be beneficial therefore for designers of components, circuits, and systems to exploit MEMS elements that produce both out-of-plane and in-plane motion thereby allowing for novel two-dimensional and three-dimensional MEMS micropositioners.

Light module

A light module includes an optical element and a base on which the optical element is mounted. The optical element has an optical portion which has an optical surface; an elastic portion which is provided around the optical portion such that an annular region is formed; and a pair of support portions which is provided such that the optical portion is sandwiched in a first direction along the optical surface and in which an elastic force is applied and a distance therebetween is able to be changed in accordance with elastic deformation of the elastic portion. The base has a main surface, and a mounting region in which an opening communicating with the main surface is provided. The support portions are inserted into the opening in a state where an elastic force of the elastic portion is applied.

Multi-axis MEMS mirror parking
11693187 · 2023-07-04 · ·

The present disclosure provides an improved method of parking a microelectromechanical system (MEMS) mirror in an array of MEMS mirrors to protect against single high voltage channel failures in a driver. Two separate voltages are applied to each MEMS mirror to move and park the mirror out of a camera sensor field of view in a servo system. For example, a first voltage may be applied in a positive X direction and a second voltage may be applied in a positive Y direction which will move the mirror in a diagonal direction. If one of the high voltage channels fail, the mirror will still be parked and outside of the camera sensor field of view. If a high voltage channel fails, the servo system can park a mirror affected by the failure in an opposite corner. Moreover, if 2-axis parking is not feasible, the mirror can use single-voltage parking.

Adiabatic optical switch using a waveguide on a MEMS cantilever

An optical switching device (20) includes a substrate (39) and first and second optical waveguides (23, 25) having respective first and second tapered ends (62, 64), which are fixed on the substrate in mutual proximity one to another. A pair of electrodes (36, 38) is disposed on the substrate with a gap therebetween. A cantilever beam (32) is disposed on the substrate within the gap and configured to deflect transversely between first and second positions within the gap in response to a potential applied between the electrodes. A third optical waveguide (21) is mounted on the cantilever beam and has a third tapered end (60) disposed between the first and second tapered ends of the first and second waveguides, so that the third tapered end is in proximity with the first tapered end when the cantilever beam is in the first position and is in proximity with the second tapered end when the cantilever beam is in the second position.

Glass fiber hole plates for 2D fiber collimators and methods for alignment and fabrication for optical switching applications
11630265 · 2023-04-18 · ·

An optical circuit switch including a two-dimensional fiber collimator includes a hole plate to hold and align a plurality of optical fibers. Fiber pathways within the hole plate can be formed using a femtosecond laser irradiation chemical etching (FLICE) technique. The use of the FLICE technique allows for extremely precise channels to be formed which allows for fibers to be aligned more closely with their intended alignment. The technique also allows for the channels or fiber pathways to be formed in a thicker material, which allows for greater structural support and robustness of the fiber collimator in use.

Optical phased array chip using MEMS switch and manufacturing method thereof

Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.

DEFORMABLE MIRROR AND CAPACITIVE ACTUATOR ARRAY CONTROLLER
20170371106 · 2017-12-28 ·

A deformable mirror and capacitive array controller is capable of controlling a plurality of individual actuators by applying independent voltages from 0V to 240V to each actuator. The device utilizes a distributed microcontroller (MCU) architecture, including a main microcontroller and a plurality of slave microcontrollers to maximize actuator voltage refresh rate. One Slave MCU may be used for up to 384 actuators. For maximizing actuator refresh rate, each Slave MCU may be limited to 192 actuators. The final circuit stage includes a digital/analog converter, a voltage sample and hold and a high voltage amplifier, all packaged in a single integrated circuit. These integrated circuits are referred hereinafter as HV S&H (high voltage sample and hold). A flexible, stacked PCB assembly significantly reduces overall footprint and weight compared to conventional devices. The device's power consumption is nearly an order of magnitude less than that of a conventions adaptive optical system.

Foveal patterned optical switches for MEMS LiDAR beam steering unit

A MEMS optical switch-based LiDAR beam steering unit may comprise an optical switching array comprising two or more translatable optical switch gratings. The two or more translatable optical switch gratings may be arranged in a foveal pattern. Each of the two or more translatable optical switch gratings may have an associated MEMS structure operative to selectively translate the optical switch grating between a first position and a second position, and a first waveguide associated with the translatable optical switch grating. The grating being in the first position may cause the grating to be sufficiently close to the first waveguide to produce a strong optical coupling between the grating and the first waveguide. The grating being in the second position may cause the grating to be sufficiently far from the first waveguide to produce a weak optical coupling between the grating and the first waveguide.

ANTIREFLECTIVE SURFACE STRUCTURES FOR ACTIVE AND PASSIVE OPTICAL FIBER

A system and method for creating an anti-reflective surface structure on an optical device includes a shim including a textured pattern, wherein the ship is configured to stamp the optical device with the textured pattern, a connector configured to place the optical device in proximity to the shim and apply a force to the optical device against the shim, and a laser source configured to heat the optical device by generating and applying a laser beam to the optical device when the optical device is placed in proximity to the shim.

OPTICAL PHASED ARRAY CHIP USING MEMS SWITCH AND MANUFACTURING METHOD THEREOF

Disclosed are an optical phased array chip and a method of manufacturing the same. The optical phased array chip includes a plurality of optical switches and a plurality of optical phased arrays implemented on a single integrated circuit, wherein the single integrated circuit includes a silicon substrate, a lower layer formed on an upper portion of the silicon substrate, a silicon layer formed on an upper portion of the lower layer, a first upper layer, a second upper layer and a third upper layer sequentially arranged on the silicon layer, and an electrode that penetrates through the first upper layer while being grounded to the silicon layer and is formed on an upper portion of the first upper layer.