Aspects of the present disclosure describe large scale steerable optical switched arrays that may be fabricated on a common substrate including many thousands or more emitters that may be arranged in a curved pattern at the focal plane of a lens thereby allowing the directional control of emitted light and selective reception of reflected light suitable for use in imaging, ranging, and sensing applications including accident avoidance.

A method for producing a microoptoelectromechanical component and a corresponding microoptoelectromechanical component. The microoptoelectromechanical component is equipped with a base substrate comprising a cavity which is formed therein and is closed by a covering substrate, an optical waveguide on the covering substrate above the cavity, which optical waveguide comprises a sheathed waveguide core, an electrical contact element in the region of the surrounding covering substrate, wherein a contact pad formed by an electrically conductive polysilicon layer is arranged underneath the electrical contact element, wherein the optical waveguide and the covering substrate located thereunder are divided into a stationary portion and a deflectable portion, which can be docked to the stationary portion by electrically deflecting the corresponding portion of the covering wafer.

Microelectromechanical systems (MEMS) have found widespread applications across biotechnology, medicine, communications, and consumer electronics. These are typically one-dimensional MEMS (e.g. rotation, linear translation on a single axis) or two-dimensional MEMS (e.g. linear translation in two directions in the plane of the MEMS). It would be beneficial therefore for designers of components, circuits, and systems to exploit MEMS elements that produce both out-of-plane and in-plane motion thereby allowing for novel two-dimensional and three-dimensional MEMS micropositioners.

The present disclosure relates to semiconductor structures and, more particularly, to non-planar waveguide structures and methods of manufacture. The structure includes: a first waveguide structure; and a non-planar waveguide structure spatially shifted from the first waveguide structure and separated from the first waveguide structure by an insulator material.

The imaging system has a photonic circuit chip that includes multiple cores that each includes a port through which an outgoing optical signal exits the photonic circuit chip. Each of the cores is configured such that the outgoing signal exits the photonic circuit chip traveling toward a location that is above or below the photonic circuit chip. Additionally, each of the cores is configured to combine light from one of the outgoing signals with a reference signal so as to generate a signal beating at a beat frequency. The imaging system also includes electronics that use the beat frequencies from the cores to calculate data that indicates a radial velocity and/or distance between the system and one or more objects located outside of the system.

A compact micro electrical mechanical actuated ring-resonator includes a bus waveguide disposed on a platform; a ring resonator disposed on the platform, including at least a first optical coupler, wherein the ring resonator is optically coupled with the bus waveguide; and a selective waveguide disposed on a piezoelectric cantilever mounted in a trench defined in the platform, wherein the selective waveguide includes a second optical coupler and is controllable to selectively adjust a coupling ratio between the first optical coupler with the second optical coupler by physically changing a distance between the first optical coupler and the second optical coupler.

One example system comprises a substrate and a waveguide disposed on the substrate to define an optical path on the substrate. The waveguide is configured to guide, inside the waveguide and along the optical path, a light signal toward an edge of the waveguide. The edge defines an optical interface between the waveguide and a fluidic optical medium adjacent to the edge of the waveguide. The system also includes an optical fluid and a fluid actuator configured to adjust a physical state of the optical fluid based on a control signal. The adjustment of the physical state of the optical fluid causes an adjustment of the fluidic optical medium adjacent to the edge.

An optical switch is configured by providing a planar lightwave circuit layer on a top surface of a Si substrate. The circuit layer forms, on the top surface of the substrate, an optical waveguide including an underclad layer, an optical waveguide core, and an overclad layer. The optical waveguide is provided to have a structure configuring a Mach-Zehnder interferometer. A heater is provided at a position just above an arm of the core on the top surface of the clad layer, and power supply electric wires are electrically connected to both ends of the heater. In a local portion including an interface between the clad layer and the top surface of the substrate, trench structure portions as concave grooves are provided.

An ultra-broadband silicon waveguide micro-electro-mechanical systems (MEMS) photonic switch is provided, which is mainly composed of three parts: input waveguides, a waveguide crossing with a nano-gap, and output waveguides. The waveguide crossing is composed of two identical orthogonal elliptical cylinders. Four ports of the waveguide crossing respectively extend to form single-mode strip waveguides to serve as input/output waveguides. The center of the waveguide crossing is fully etched with a nano-gap. The two symmetrical port waveguides are fully etched with nano-grooves. The lower cladding near the waveguide crossing and the nano-grooves is penetrated and etched. The width of the nano-gap is adjusted through adjusting a voltage applied across both ends of the waveguide crossing, so that a guided-mode directly passes through or is totally reflected. In the disclosure, a propagation path of the photonic switch is switched through adjusting the voltage applied to the waveguide crossing.

Photonic chip includes an external cavity (EC) optical circuit to provide wavelength-selective optical feedback to a length of active optical fiber. Light generated in the active optical fiber may be coupled from the EC circuit to a light processing circuit of the photonic chip, such as an optical modulator or an optical mixer. The EC circuits may include single-frequency and multi-frequency optical filters, which may include ring resonators, dual-ring resonators, and optical modulators to support multi-frequency lasers. The EC circuits may further include pump combiners and optical isolators.