An external indicator assembly for a central processing unit (CPU) disposed within an equipment cabinet, including: an internal fitting adapted to be disposed adjacent to indicator lights associated with the CPU; an external fitting adapted to be coupled to or disposed through an external surface of the equipment cabinet; and one or more optical fibers adapted to be coupled between the internal fitting and the external fitting such that light from the indicator lights is transmitted from the CPU disposed within the equipment cabinet external to the equipment cabinet such that the light is visible to a person external to the equipment cabinet. This allows the person to visually assess the status or power-down cycling of the CPU during a shutdown or restart process without or before opening the equipment cabinet, thereby preventing corruption of the CPU and assuring personal safety by avoiding contact with powered components.

A connector assembly is provided and includes a shielding cage, a receptacle connector and a light guiding member. The shielding cage has a plurality of walls, a receiving space defined together by the plurality of walls, a front end opening communicated to the receiving space and an aperture communicated to the receiving space. The receptacle connector is received in a rear segment of the receiving space of the shielding cage. The light guiding member has at least two light guiding pipes, each light guiding pipe has a first segment positioned to the front and a second segment positioned to the rear. The first segments of the two light guiding pipes are positioned outside the shielding cage and the second segments of the two light guiding pipes pass through the aperture and enter into the rear segment of the receiving space of the shielding cage.

An optical device that includes a multicore optical fiber having at least two cores. An alignment feature is attached at the first end of the first multicore optical fiber. The device also includes a substrate having at least two waveguides, each waveguide comprising a redirecting feature. A fiber holder is located on the substrate to hold the multicore fiber in a correct axially rotational orientation using the alignment feature, so that light couples between the cores of the multicore fiber and respective waveguides in the substrate.

A semiconductor device including a singulated structure and an optical fiber assembly is provided. The singulated structure includes a photonic die, an electronic die connected to the photonic die and an optical element over the photonic die. The optical fiber assembly is disposed on a top of the singulated structure and includes a holder and an optical fiber structure. The holder keeps an air gap from the optical element. The optical fiber structure is carried by the holder and configured to be optically communicated with the photonic die through the optical element.

A fiber optic assembly is provided including a support substrate having a substantially flat surface and a signal-fiber array supported on the support substrate. The signal-fiber array includes a plurality of optical fibers. At least some of the optical fiber of the plurality of optical fibers includes a first datum contact disposed between the optical fiber and an adjacent optical fiber and each of the optical fibers of the plurality of optical fibers includes a second datum contact disposed between each of the optical fibers of the plurality of optical fibers and the support substrate. A first datum surface is disposed at a top surface of each of the plurality of optical fibers opposite the support surface.

An optical module according to the present invention includes: an optical device including an optical waveguide chip; an optical fiber block bonded to and arranged on an end face of the optical waveguide chip; an optical fiber that has one end optically connected to the optical waveguide chip via the optical fiber block; an optical fiber holding mechanism for holding the other end of the optical fiber; and an optical fiber carrier. The optical fiber is arranged while being curved from the optical fiber carrier toward the optical fiber block in a U-shape, and a wall structure is formed on the surface of the carrier while being adjacent to the optical fiber at, for example, a position on the outer side of the U-shaped curve of the optical fiber position at which the wall structure reduces a normal force of the optical fiber.

A system includes a housing that has a front panel; a substrate that is positioned at a distance from the front panel, in which a data processor is mounted on the substrate; and a pluggable module. The pluggable module includes a co-packaged optical module, at least one first optical connector, a first fiber optic cable that is optically coupled between the co-packaged optical module and the first optical connector, and a fiber guide that is positioned between the co-packaged optical module and the first optical connector and provides mechanical support for the co-packaged optical module and the first optical connector. The co-packaged optical module is configured to receive optical signals from the first optical connector, generate electrical signals based on the received optical signals, and transmit the electrical signals to the data processor. The pluggable module has a shape that enables the pluggable module to pass through an opening in the front panel to enable the co-packaged optical module to be coupled to the substrate.

An apparatus includes an installation tool for attaching an optical fiber to a structure. The tool includes a body. One or more contact portions are supported by the body and configured to secure the optical fiber. An adhesive dispenser is disposed proximate the body. The adhesive dispenser is configured to dispense at least one adhesive to the optical fiber and the structure. A dispenser controller is operatively coupled to the adhesive dispenser. The dispenser controller is configured to control the adhesive dispenser.

An apparatus comprises a flexible filament structure, and a fiber optic sensor with a buffer material that locally bonds the fiber optic sensor to the flexible filament structure to create a bond between the fiber optic sensor and the flexible filament structure to transfer strain from the flexible filament structure to the fiber optic sensor to allow the fiber optic sensor to detect strain on the flexible filament structure while maintaining flexibility in the flexible filament structure. A fiber optic interrogator may be optically coupled to the fiber optic sensor and configured to measure strain. A method comprises embedding a fiber optic sensor with a buffer material in or on a flexible filament structure. Thereafter, the buffer material is activated via heating or curing to locally adhere the fiber optic sensor to the flexible filament structure to create a local bond. The local bond transfers strain from the flexible filament structure to the fiber optic sensor.

The present disclosure provides an electrical connector connected with a chip connector. The electrical connector comprises a first terminal component, an adapting board, and a cable. The first terminal component comprises a plurality of terminals. The adapting board is disposed at one side of the first terminal component. At least one of the plurality of terminals of the first terminal component is connected with the adapting board. One end of the cable is connected with the adapting board. The other end of the cable is connected with the chip connector. Since the plurality of terminals and the cable of the first terminal component are connected with the adapting board, selectable cables in multiple dimensions would be increased, the soldering process can be simplified, the soldering cost can be reduced, and the stability of the connection between the terminal and the cable would also be enhanced.