Patent classifications
G02B6/3652
Fixture and method for attaching fibers to V-grooves of photonic integrated circuit
A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.
Fixture And Method For Attaching Fibers To V-Grooves Of Photonic Integrated Circuit
A system for passive alignment of fibers to an interface of a photonic integrated circuit (PIC) includes an input frame, an actuator, and an output frame. The actuator arranged to apply force along a force axis to the input frame. The output frame including a tip for picking up a plate and transferring the force thereto, the output frame being connected to the input frame such that the output frame may tilt relative to the input frame and the output frame is elastically biased relative to the input frame into a position wherein the tip is aligned on the force axis.
Multi-chip photonic quantum computer assembly with optical backplane interposer
A system includes a plurality of wafer-scale modules and a plurality of optical fibers. Each wafer-scale module includes an optical backplane and one or more die stacks on the optical backplane. The optical backplane includes a substrate and at least one optical waveguide layer configured to transport and/or manipulate photonic quantum systems (e.g., photons, qubits, qudits, large entangled states, etc.). Each die stack of the one or more die stacks includes a photonic integrated circuit (PIC) die optically coupled to the at least one optical waveguide layer of the optical backplane. The plurality of optical fibers is coupled to the optical backplanes of the plurality of wafer-scale modules to provide inter-module and/or intra-module interconnects for the photonic quantum systems.
Optical Circuit Module
An optical circuit module in which an optical fiber array and an optical circuit substrate are connected, the optical fiber array including a groove substrate in which a groove for optical fiber alignment is formed, a pressing plate stacked on and bonded to the groove substrate, and an optical fiber bonded to and fixed in the groove of the groove substrate, and the optical circuit substrate including an input/output waveguide. In a connection surface of the optical circuit module, an area of a common portion in a cross section of the optical circuit substrate and the pressing plate is larger than an area of a common portion in a cross section of the optical circuit substrate and the groove substrate.
WIRE-BONDING METHODOLOGIES UTILIZING PREFORMED GLASS OPTICAL WIRES FOR MAKING CHIP-TO-CHIP OPTICAL INTERFACES
A photonic integrated circuit (PIC) package comprising a first die, the first die comprising a first optical waveguide and a first trench extending from a first edge of the first die to the first optical waveguide. The first trench is aligned with the first optical waveguide. A second die comprises a second optical waveguide and a second trench extending from a second edge of the second die to the second optical waveguide. The second trench is aligned with the second optical waveguide. An optical wire comprising an uncladded glass fiber comprises a first terminal portion extending within the first trench and a second terminal portion extending within the second trench. The first terminal portion is aligned with the first optical waveguide and the second terminal portion is aligned with the second optical waveguide.
Light coupling element and assembly
A light coupling element including a groove and a light redirecting member is described. The groove is for receiving and aligning an optical waveguide and incudes an open front end and a back end. The light redirecting member includes an input side for receiving light from an optical waveguide received and supported in the groove and a light redirecting side for changing a direction of light received from the input side. The groove may include a bottom surface extending between the front and back ends of the groove and including a raised bottom surface portion raised upwardly relative to an unraised bottom surface portion. The unraised bottom surface portion of the bottom surface may be disposed between the raised bottom surface portion of the bottom surface and the input side of the light redirecting member. Optical coupling assemblies including the light coupling element and an optical waveguide are described.
SYSTEMS AND METHODS FOR OPTICAL FIBER ALIGNMENT
An optical fiber alignment assembly may comprise an alignment fixture including a groove configured to engage first and second optical fiber ferrules, a first clamping mechanism configured to selectively apply a force on the first optical fiber ferrule to constrain motion of the first optical fiber ferrule within the groove, and a second clamping mechanism configured to selectively apply a force on the second optical fiber ferrule to constrain motion of the second optical fiber ferrule within the groove.
High-density FAUs and optical interconnection devices and related methods
A fiber optic assembly is provided including a support substrate having a substantially flat surface and a signal-fiber array supported on the support substrate. The signal-fiber array includes a plurality of optical fibers. At least some of the optical fiber of the plurality of optical fibers includes a first datum contact disposed between the optical fiber and an adjacent optical fiber and each of the optical fibers of the plurality of optical fibers includes a second datum contact disposed between each of the optical fibers of the plurality of optical fibers and the support substrate. A first datum surface is disposed at a top surface of each of the plurality of optical fibers opposite the support surface.
OPTICAL CONNECTOR FOR PHOTONIC CIRCUITS
An optical connector for a photonic circuit. The optical connector includes a first part, fixable to a photonic circuit, having at least one slab of optically transparent material, the at least one slab including a first lens. The optical connector includes a second part, movable between a connected position adjacent the first part and a disconnected position removed from the first part. The second part includes at least one slab of optically transparent material, the at least one slab including a second lens located to be in alignment with the first lens in the connected position. One or more guiding elements are arranged to direct light to the second lens. The second part is configured to connect the one or more guiding elements to an optical fiber.
Universal optical fibre with double trench
The present disclosure provides an optical fibre. The optical fibre includes a core, an inner cladding, a first trench region, an intermediate cladding, a second trench region, and an outer cladding. The core has a first radius. The inner cladding is defined by the first radius and a second radius of the optical fibre. The first trench region is defined by the second radius and a third radius. The first trench region. The intermediate cladding is defined by the third radius and a fourth radius. The second trench region is defined by the fourth radius and a fifth radius. The outer cladding is defined by the fifth radius and a sixth radius.