Metasurface elements, integrated systems incorporating such metasurface elements with light sources and/or detectors, and methods of the manufacture and operation of such optical arrangements and integrated systems are provided. Systems and methods for integrating transmissive metasurfaces with other semiconductor devices or additional metasurface elements, and more particularly to the integration of such metasurfaces with substrates, illumination sources and sensors are also provided. The metasurface elements provided may be used to shape output light from an illumination source or collect light reflected from a scene to form two unique patterns using the polarization of light. In such embodiments, shaped-emission and collection may be combined into a single co-designed probing and sensing optical system.

Examples described herein relate to a ring resonator. The ring resonator may include an annular waveguide having a waveguide base and a waveguide core narrower than the waveguide base. Further, the ring resonator may include an outer contact region comprising a first-type doping and disposed annularly and at least partially surrounding an outer annular surface of the waveguide base. Furthermore, the ring resonator may include an inner contact region comprising a second-type doping and disposed annularly contacting an inner annular surface of the waveguide base. Moreover, the ring resonator may include an annular detector region disposed annularly at a distance from and covering at least a portion of a surface of the waveguide core and contacting the outer contact region.

The present disclosure relates to an active optical cable connector and an active optical cable assembly. The active optical cable connector includes a power supply interface, an optoelectronic conversion module and a short-range wireless communication module, wherein the power supply interface is electrically connected with the optoelectronic conversion module and the short-range wireless communication module, respectively, and the short-range wireless communication module is configured to transmit a control signal and a low-speed signal of the active optical cable.

The invention relates to a positioning apparatus (100) for positioning a light-guiding fiber (206) in a calibration port (208) of a medical apparatus (202) comprising at least one light source (204) for the light-guiding fiber (206), wherein the positioning apparatus (100) comprises an elongate body (102) with two end faces (110, 112) and at least one side face (116). A channel (104) for receiving the light-guiding fiber (206) is formed in the body (102), said channel extending along a longitudinal axis of the body (102) proceeding from a first end face (110). Here, according to the invention, provision is made for the body (102), at least in one portion, to consist of an opaque material in the region of the channel (104) and/or to be coated with an opaque material and for said body to have at least one cutout (113, 118), which extends from a side face (116) and/or the second end face (112) of the body (102) to the channel (104) such that radiation emitted by the light-guiding fiber (206) can only emerge from the positioning apparatus (100) in unimpeded fashion through the at least one cutout (113, 118).

Disclosed are apparatus and methods for a silicon photonic (SiPh) structure comprising the integration of an electrical integrated circuit (EIC); a photonic integrated circuit (PIC) disposed on top of the EIC; two or more polymer waveguides (PWGs) disposed on top of the PIC and formed by layers of cladding polymer and core polymer; and an integration fan-out redistribution (InFO RDL) layer disposed on top of the two or more PWGs. The operation of PWGs is based on the refractive indexes of the cladding and core polymers. Inter-layer optical signals coupling is provided by edge-coupling, reflective prisms and grating coupling. A wafer-level system implements a SiPh structure die and provides inter-die signal optical interconnections among the PWGs.

Disclosed are semiconductor packages and manufacturing method of the semiconductor packages. In one embodiment, a semiconductor package includes a substrate, a first waveguide, a semiconductor die, and an adhesive layer. The first waveguide is disposed on the substrate. The semiconductor die is disposed on the substrate and includes a second waveguide aligned with the first waveguide. The adhesive layer is disposed between the first waveguide and the second waveguide.

Provided is a waveguide photodetector including a semiconductor substrate, a first optical waveguide and a second optical waveguide, which are sequentially laminated on the semiconductor substrate, in which each of the first optical waveguide and the second optical waveguide includes a first portion and a second portion, and the first portion extends from the second portion in a first direction parallel to a top surface of the semiconductor substrate, a refractive index matching layer disposed on the second portion of the second optical waveguide, a clad layer disposed on the refractive index matching layer, and an absorber disposed between the refractive index matching layer and the clad layer. Here, the second optical waveguide has a first conductive-type, the clad layer has a second conductive-type opposite to the first conductive-type, and the refractive index matching layer includes a first semiconductor layer that is an intrinsic semiconductor layer.

A light-modulating device includes optical microstructures, each including a topmost layer, a bottommost layer, and in-between layers. The topmost layer extends in a first predetermined axis. The bottommost layer extends in a last predetermined axis which turns about a center axis such that an incident light beam passing through the topmost layer in an incident route is modulated to permit the light beam emitting from the bottommost layer to impinge upon a solar concentrator disposed below the light-modulating device along an impinging route different from the incident route. The in-between layers are sequentially turned about the center axis by an incremental degree toward the last predetermined axis.

An electronic device and a light pipe apparatus advantageously are formed of a relatively small number of components that are configured to provide various types of light at the exterior of the electronic device while detecting ambient light at the exterior of electronic device, while also providing weather seals that protect the interior of electronic device without requiring the use of additional components to provide such seals.

Embodiments described herein may be related to apparatuses, processes, and techniques directed to a double-sided glass substrate, to which a PIC is hybrid bonded to a first side of the glass substrate. A die is coupled with the second side of the glass substrate opposite the first side, the PIC and the die are electrically coupled with electrically conductive through glass vias that extend from the first side of the glass substrate to the second side of the glass substrate. Other embodiments may be described and/or claimed.