A detection system for light communications comprises a total internal reflection (TIR) waveguide and a light sensor adjacent to the TIR waveguide. The TIR waveguide comprises a TIR structure, a diffusive element, and a waveguide entrance. The TIR structure is configured to internally propagate light associated with optical signaling along the TIR waveguide. The diffusive element is disposed at an internal edge of the TIR structure opposite the light sensor. The diffusive element is configured to disrupt the propagation of the light such that at least some of the light is directed to the light sensor. The waveguide entrance is offset from the diffusive element along the TIR structure and configured to collect the light into the TIR structure.

A duplex LC communication light detecting adapter for forming two parallel optical transmission lines therein when a duplex LC connector is inserted so as to extract as a leak light a portion of communication light transmitting through the optical transmission lines, including an adapter main body that is opaque to light. The adapter main body includes a first space defined by a first wall and isolated from other spaces to arrange a first optical transmission line of the two optical transmission lines, a first light extraction hole for extracting the leak light from the first space, a second space defined by a second wall and isolated from other spaces to arrange a second optical transmission line of the two optical transmission lines, and a second light extraction hole for extracting the leak light from the second space.

An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

Glass-as-a-Platform (GaaP) assemblies are provided. Embodiments of the GaaP assembly comprise a first glass plate and a second glass plate, each disposed under one or more switch ASICs and one or more opto-electronic devices co-packaged on the same substrate. Each glass plate includes a plurality of waveguides. The co-packaged substrate is disposed on top of one or more of the first glass plate and second glass plate, the first glass plate configured to couple to one or more opto-electronic devices and the second glass plate configured to couple to one or more other opto-electronic devices. A faceplate interface end of each glass plate is configured to connect to one or more optical cable connectors. The glass plates are configured to route optical signals to and from one or more opto-electronic devices and one or more optical cable connectors through the one or more waveguides and openings in the co-packaged substrate.

Embodiments described herein may be related to apparatuses, processes, and techniques related to active optical couplers that provide optical coupling at or proximate to an edge of a silicon photonics package, to allow the package to optically couple with other devices or peripherals. In embodiments, the active optical coupler is optically coupled with a photonics IC (PIC) inside the photonics package, and provides an optical coupling mechanism for optical pathways outside the photonics package. The active optical coupler may include electrical circuitry and may be coupled to the package substrate to provide data related to the operation of the active optical coupler. Other embodiments may be described and/or claimed.

A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.

An optical input/output chiplet is disposed on a first package substrate. The optical input/output chiplet includes one or more supply optical ports for receiving continuous wave light. The optical input/output chiplet includes one or more transmit optical ports through which modulated light is transmitted. The optical input/output chiplet includes one or more receive optical ports through which modulated light is received by the optical input/output chiplet. An optical power supply module is disposed on a second package substrate. The second package substrate is separate from the first package substrate. The optical power supply module includes one or more output optical ports through which continuous wave laser light is transmitted. A set of optical fibers optically connect the one or more output optical ports of the optical power supply module to the one or more supply optical ports of the optical input/output chiplet.

Devices implementing light communications use waveguides to efficiently collect light used for the light communications and propagate that collected light to a sensor. More particularly, light collected from one or more sensors propagates along a TIR waveguide until disrupted by a diffusive element, which effectively directs the propagating light to a sensor. In so doing, the solution presented herein increases the amount of light available for the light communications and/or reduces the number of sensors needed for the light communications, e.g., by providing light collected from multiple different locations to a single sensor. The waveguide solution presented herein may be implemented inside a device and/or along an exterior surface, e.g., housing or casing, of a device.

An optical communication system includes a first communication system to communicate first information from a controller to a truck and a second communication system to communicate second information. The first communication system includes a first light emitter to output the first information, a first optical fiber to transport the light output from the first light emitter while letting the light leak therefrom, and a first light receiver to receive the light leaking from the first optical fiber. The second communication system includes a second light emitter to output second information, a second optical fiber to transport the light output from the second light emitter and input to the second optical fiber at some point along the second optical fiber, and a second light receiver to receive the light transported over the second optical fiber.

A mid-infrared light emitting diode is provided, including a graphene lower electrode layer, a black phosphorous layer, and a graphene upper electrode layer sequentially arranged along a thickness direction of the mid-infrared light emitting diode, in which the black phosphorous layer contacts the graphene lower electrode layer and the graphene upper electrode layer. A manufacturing method of the mid-infrared light emitting diode, a silicon photonic circuit and a manufacturing method thereof are also provided.