Provided is optical module as a photoelectric conversion module that includes a photoelectric hybrid board, a light-receiving/emitting element, a driving element, and a heat dissipating sheet. The light-receiving/emitting element and the driving element are mounted on one surface in a thickness direction of the photoelectric hybrid board. The heat dissipating sheet is in contact with the light-receiving/emitting element and the driving element from a side opposite to the photoelectric hybrid board. The driving element has a greater height above the photoelectric hybrid board than the light-receiving/emitting element.

A transceiver assembly for mounting on a mother board, said transceiver assembly comprising: (a) a frame defining a first plane configured for mounting parallel to said motherboard, said frame defining a plurality of slots perpendicular to said first plane; and (b) one or more opto-electric cards, each of said one or more opto-electric cards disposed in one of said plurality of slots and comprising at least, (i) a substrate having a first edge parallel to said first plane when said opto-electric card is mounted in said slot, (ii) an electrical interface along said first edge, (iii) and an interposer electrically connected to said electrical interface and comprising at least one optical component operatively connected to said electrical interface, and (iv) at least one optical fiber extending freely from said interposer.

An electro-optical chip includes an optical input port, an optical output port, and an optical waveguide having a first end optically connected to the optical input port and a second end optically connected to the optical output port. The optical waveguide includes one or more segments. Different segments of the optical waveguide extends in either a horizontal direction, a vertical direction, a direction between horizontal and vertical, or a curved direction. The electro-optical chip also includes a plurality of optical microring resonators is positioned along at least one segment of the optical waveguide. Each microring resonator of the plurality of optical microring resonators is optically coupled to a different location along the optical waveguide. The electro-optical chip also includes electronic circuitry for controlling a resonant wavelength of each microring resonator of the plurality of optical microring resonators.

A fiber optic adapter assembly reduced in size from a SFP footprint to a SC footprint to accommodate a first fiber optic connector on a first side within one or more ports, and a second fiber optic connector on a second side within one or more ports. The first fiber optic connector is a duplex fiber optic connector with an overall length of about 50 mm and the second fiber optic connector is a behind-the-wall connector with an overall length of about 15 mm thereby reducing the overall length of a connector and adapter assembly for increasing optical fiber density.

An optical connector mechanism includes an abutting portion that applies a pressing force so as to cause an end surface of a first optical transmission and reception path and an end surface of a second optical transmission and reception path to abut against each other, a first case that houses the first optical transmission and reception path, a second case that houses the second optical transmission and reception path, a sleeve case slidably attached to the first case, an elastic bar member including one end portion fixed to the first case and another end portion to be inserted into the second case, an engagement portion that engages the other end portion of the elastic bar member with the second case, and an engagement releasing portion that presses the elastic bar member so as to release the engagement performed by the engagement portion when the sleeve case slides.

A split waveguide filter is described. The split waveguide filter includes a first waveguide section having a first outer surface and a first inner surface and a second waveguide section having a second outer surface and a second inner surface. When the first waveguide section and the second waveguide section are mated together, the first inner surface and the second inner surface form a waveguide aperture. The split waveguide filter also includes a first collar clamp for securing a first portion of the mated first waveguide section and second waveguide section together; and a second collar clamp for securing a second portion of the mated first waveguide section and second waveguide section together.

A system includes a housing including a front panel, a rear panel, an upper panel, and a lower panel. The system includes a first circuit board or substrate, at least one data processor coupled to the first circuit board or substrate and configured to process data, and at least one optical module coupled to the first circuit board or substrate. Each optical module is configured to perform at least one of (i) convert input optical signals to electrical signals that are provided to the at least one data processor, or (ii) convert electrical signals received from the at least one data processor to output optical signals. The system includes at least one inlet fan mounted near the front panel and configured to increase an air flow across a surface of at least one of (i) the at least one data processor, (ii) a heat dissipating device thermally coupled to the at least one data processor, (iii) the at least one optical module, or (iv) a heat dissipating device thermally coupled to the at least one optical module. The system includes at least one laser module configured to provide optical power to the at least one optical module.

An fiber-optic connector assembly includes a fiber optic ferrule and a connector, which engage an optical transceiver component. The fiber optic ferrule engages a mating plane of a lens array in the optical transceiver component and floats within the connector. The engagement of the assembly and the optical transceiver component may be removable rather than fixed. The fiber optic ferrule also engages a mechanical interface to account for three degrees of freedom, while the engagement of the mating surfaces account for another three degrees of freedom.

Embodiments of the present disclosure include optical transmitters and transceivers with improved reliability. In some embodiments, the optical transmitters are used in network devices, such as in conjunction with a network switch. In one embodiment, lasers are operated at low power to improve reliability and power consumption. The output of the laser may be modulated by a non-direct modulator and received by integrated optical components, such as a modulator and/or multiplexer. The output of the optical components may be amplified by a semiconductor optical amplifier (SOA). Various advantageous configurations of lasers, optical components, and SOAs are disclosed. In some embodiments, SOAs are configured as part of a pluggable optical communication module, for example.

Certain types of aggregation enclosures include cable input ports and downwardly angled cable output ports. A cover is pivotally coupled to the body so that the cover moves between an open position and a closed position. A modular component panel may be disposed within the enclosure. The component panel includes one or more distribution components (e.g., fiber distribution components or power distribution components) configured to connect at least a portion of an incoming cable to at least a portion of an outgoing cable.