Disclosed are an integrated optical assembly structure with an isolator and a processing method therefor. The structure comprises a front metal cover, a ceramic sleeve, a pressing block, a ceramic plug core and an isolator chip, wherein the ceramic sleeve is disposed inside the front metal cover; one end of the ceramic plug core is disposed inside the ceramic sleeve and the other end thereof is fixed in the pressing block; the pressing block has a plug core positioning hole and a chip accommodating hole; the chip accommodating hole has at least two positioning corners; and the isolator chip having magnetism itself is installed in the chip accommodating hole and is positioned and fixed via the positioning corners.

Disclosed are an integrated optical assembly structure with an isolator and a processing method therefor. The structure comprises a front metal cover, a ceramic sleeve, a pressing block, a ceramic plug core and an isolator chip, wherein the ceramic sleeve is disposed inside the front metal cover; one end of the ceramic plug core is disposed inside the ceramic sleeve and the other end thereof is fixed in the pressing block; the pressing block has a plug core positioning hole and a chip accommodating hole; the chip accommodating hole has at least two positioning corners; and the isolator chip having magnetism itself is installed in the chip accommodating hole and is positioned and fixed via the positioning corners.

Embodiments herein describe a focal polarization displacer with a birefringent crystal disposed within the focal region of a lens. The birefringent crystal separates optical signals into at least two separate signals based on having different polarization states and an optical axis of the birefringent crystal is set so that focal points of the two separate signals are at an output surface of the polarization displacer where the two separate signals are output from the polarization displacer. This output surface can be a surface of the birefringent crystal or a surface of additional layer coupled to the crystal such as a polarization rotator or dielectric layer.

There is set forth herein an integrated photonics structure having a waveguide disposed within a dielectric stack of the integrated photonics structure, wherein the integrated photonics structure further includes a field generating electrically conductive structure disposed within the dielectric stack; and a heterogenous structure attached to the integrated photonics structure, the heterogenous structure having field sensitive material that is sensitive to a field generated by the field generating electrically conductive structure. There is set forth herein a method including fabricating an integrated photonics structure, wherein the fabricating an integrated photonics structure includes fabricating a waveguide within a dielectric stack, wherein the fabricating an integrated photonics structure further includes fabricating a field generating electrically conductive structure within the dielectric stack; and attaching a heterogenous structure to the integrated photonics structure, the heterogenous structure having field sensitive material that is sensitive to a field generated by the field generating electrically conductive structure.

There is set forth herein an integrated photonics structure having a waveguide disposed within a dielectric stack of the integrated photonics structure, wherein the integrated photonics structure further includes a field generating electrically conductive structure disposed within the dielectric stack; and a heterogenous structure attached to the integrated photonics structure, the heterogenous structure having field sensitive material that is sensitive to a field generated by the field generating electrically conductive structure. There is set forth herein a method including fabricating an integrated photonics structure, wherein the fabricating an integrated photonics structure includes fabricating a waveguide within a dielectric stack, wherein the fabricating an integrated photonics structure further includes fabricating a field generating electrically conductive structure within the dielectric stack; and attaching a heterogenous structure to the integrated photonics structure, the heterogenous structure having field sensitive material that is sensitive to a field generated by the field generating electrically conductive structure.

A Faraday rotator and an optical isolator having a high transmittance and a high Verdet constant are provided. The optical isolator includes at least a Faraday rotator that rotates a polarization plane of incident light in a non-reciprocal manner, a polarizer disposed on a light incident side of the Faraday rotator, and an analyzer disposed on a light exit side of the Faraday rotator. The Faraday rotator is made of an oxide containing ytterbium oxide (Yb.sub.2O.sub.3), and is manufactured by a ceramic manufacturing process, wherein the oxide is allowed to contain an oxide of a metal other than ytterbium, and the proportion of ytterbium in all metal atoms in the oxide is 80% or more.

An optical module having an externally-mounted magnetic ring and a chip positioning angle and a pressing block structure thereof are disclosed. The pressing block structure includes a pressing block. The pressing block includes a pressing block body. The pressing block body is provided with an insertion core positioning hole, a chip accommodating hole, and a magnetic ring accommodating chamber. The chip accommodating hole is provided with at least one positioning angle. The overall assembly accuracy of the optical module is improved, the material cost of the isolator chip is reduced, the positioning of the chip is more accurate, and the occurrence of glue overflow can be avoided.

An optical module having an externally-mounted magnetic ring and a chip positioning angle and a pressing block structure thereof are disclosed. The pressing block structure includes a pressing block. The pressing block includes a pressing block body. The pressing block body is provided with an insertion core positioning hole, a chip accommodating hole, and a magnetic ring accommodating chamber. The chip accommodating hole is provided with at least one positioning angle. The overall assembly accuracy of the optical module is improved, the material cost of the isolator chip is reduced, the positioning of the chip is more accurate, and the occurrence of glue overflow can be avoided.

A nonreciprocal waveguide includes a substrate, a light propagation path, a magnetic member, an insulating layer, and a mask. The light propagation path is positioned at the substrate along a substrate surface. The magnetic member is positioned at the substrate along part of the light propagation path in a longitudinal direction. The insulating layer is positioned at the substrate and contains the light propagation path and the magnetic member. Inside the insulating layer, the mask is positioned further away than the light propagation path from the substrate. As seen from a direction perpendicular to the substrate surface, the mask overlaps at least part of the light propagation path in a width direction from a side of the light propagation path opposite to the magnetic member in the width direction. The mask is positioned in at least a range in which the magnetic member is positioned in the longitudinal direction.

The invention relates to optical waveguide components, such as Faraday rotators and their manufacture Faraday rotators based on silicon waveguides are provided, where the waveguide has folded or wound sections that are parallel to an externally applied magnetic field.