A switchable glass panel, a method of forming switchable glass panel and a method of forming switchable glass are provided. The method includes: forming a first electrode layer and a first alignment layer sequentially on a first substrate, and forming a second electrode layer and a second alignment layer sequentially on a second substrate; forming first sealants distributed along a first direction, second sealants distributed along a second direction and an edge sealant at the edge of the first alignment layer on the first alignment layer, where the first sealants and the second sealants form a grid with a plurality of openings; forming a plurality of liquid crystal layers corresponding to the plurality of openings on the second alignment layer; and oppositely arranging the first substrate and the second substrate to form a cell, and curing the first sealants and the second sealants.

A liquid crystal on silicon (LCOS) display panel and method for fabricating the LCOS display panel are disclosed. According to the present invention, injection openings for injection a liquid crystal material to cavities (liquid crystal cells) are formed in a glass substrate, and the injection opening extends through the glass substrate, allowing the cavities to have a thickness that is independent of a width of the injection openings and not affected thereby.

A method for manufacturing a liquid crystal display panel and a liquid crystal display panel are provided. The method of manufacturing a liquid crystal display panel comprises the following steps: grinding the display device along a preset edge and removing the adhesive layer on a side of the preset edge away from a frame sealant, to obtain the liquid crystal display panel.

A mother substrate for a color conversion substrate includes: a substrate including a display area and a tag area, where the tag area is disposed around the display area and includes a plurality of sub-tag areas; a first ink layer disposed in some of the sub-tag areas and having a first color; and a second ink layer disposed in some of the sub-tag areas and having a second color different from the first color. A volume of the first ink layer in each of the some of the sub-tag areas is different from each other, or a volume of the second ink layer in each of the some of the sub-tag areas is different from each other.

A substrate includes at least two edges; and at least one end portion, each end portion is connected to two adjacent edges. The end portion includes a cutting section and two breaking sections; an end of the cutting section is connected to one of the two adjacent edges through a breaking section, and another end of the cutting section is connected to another one of the two adjacent edges through another breaking section. The cutting section is configured to be formed through cutting of a tool, and the breaking sections are configured to be formed under an action of a physical force.

This disclosure discloses a light-emitting diode chip, a method for fabricating the same, a backlight module, and a display device. The light-emitting diode chip includes: a transparent base substrate; at least one light-emitting diode located on one side of the base substrate; and a dimming structure located on a side of the base substrate away from the light-emitting diode, wherein the light-emitting diode is configured to emit light from double sides thereof; and the dimming structure is configured to adjust the intensity of light emitted from the side of the base substrate away from the light-emitting diode.

An array substrate and a manufacturing method thereof, a motherboard and a display device are disclosed. The array substrate has a display region and a non-display region, and includes a base substrate, and a plurality of signal lines and at least one transfer electrode that are on the base substrate. The plurality of signal lines extend from the display region to the non-display region along a first direction, at least one of the plurality of signal lines includes a first trace in the display region and a second trace in the non-display region, the second trace includes at least two sub-traces disconnected from each other, a sub-trace, close to the display region, of the at least two sub-traces of the second trace is directly connected with the first trace, and every two adjacent sub-traces of the second trace are electrically connected with each other.

A display panel motherboard, a cutting method and a manufacturing method thereof, a display panel, and a display device are provided. The display panel motherboard includes at least three mother substrates, at least one display panel unit, and a cutting region. The at least three mother substrates are stacked with each other, at least a portion of the at least one display panel unit is surrounded by the cutting region, and an organic film layer is not disposed in at least two of the at least three mother substrates in the cutting region.

Embodiments of the present disclosure provide a display substrate motherboard and a manufacturing method and a cutting method thereof, a display substrate and a display device. The display substrate motherboard includes a preset cutting position, a back film and an adhesive layer disposed on the back film, the adhesive layer includes: a first adhesive layer corresponding to the preset cutting position; a second adhesive layer disposed on two sides of the first adhesive layer in a direction parallel to the back film; and a first light blocking layer disposed between the first adhesive layer and the second adhesive layer, wherein the first light blocking layer is configured to reduce light entering the second adhesive layer through the first light blocking layer after being incident from the first adhesive layer.

A color filter and a manufacturing method thereof, and a display device are provided. The color filter includes a color filter substrate, a plurality of sub-pixel regions, wherein each of the sub-pixel regions includes a first signal region, a second signal region, and a laser path disposed between the first signal region and the second signal region, a first light-shielding sheet disposed on the first signal region and covered with a first indium tin oxide layer, and a second light-shielding sheet disposed on the second signal region and covered with a second indium tin oxide layer. Wherein, the first signal region receives signals through the first indium tin oxide layer, and the second signal region receives signals through the second indium tin oxide layer, therefore improving the problem of signal transmission delay caused by the regional signal impedance difference of the indium tin oxide layer.