The embodiments of the application provide a backlight module and a displaying device, relating to the technical field of display. The backlight module comprises a first support structure, an optical film material and a buffer structure; the first support structure is arranged on a side away from a light-outgoing side of the optical film material, and the first support structure and the optical film material have a through-hole; the buffer structure comprises a first buffer portion arranged in the through-hole, and a rigidity of the first buffer portion is less than a rigidity of the first support structure. The backlight module is internally provided with the buffer structure, and the first buffer portion in the buffer structure is arranged in the through-hole that penetrates through the first support structure and the optical film material.

An electronic device is provided. The electronic device includes a first substrate, a multilayer structure, and a passivation layer. The multilayer structure is disposed on the first substrate. The multilayer structure includes a first conductive layer and a second conductive layer disposed on the first conductive layer. The passivation layer is disposed on the second conductive layer. In addition, a thermal expansion coefficient of the second conductive layer is between a thermal expansion coefficient of the first conductive layer and a thermal expansion coefficient of the passivation layer.

An array substrate, includes: a substrate, a first metal layer, a first buffer layer, and an active layer, a gate insulating layer, a second metal layer, a first insulating layer, a third metal layer and a first planarization layer. The first metal layer is electrically connected with the first doped area of the active layer through the bridge layer of the second metal layer. The third metal layer is electrically connected with the second doped area of the active layer. The array substrate of the present disclosure reduces a size of a thin film transistor by stacking the first metal layer, the second metal layer, and the third metal layer, thereby increasing pixel density. A display panel is also provided.

Provided is an optical waveguide device in which both signal electrode collapse and signal electrode peeling/damage can be prevented. An optical waveguide device in which an optical waveguide is formed on a substrate and a control electrode for controlling a light wave propagating through the optical waveguide is disposed on the substrate, is characterized in that, the control electrode includes a signal electrode, and the signal electrode has a narrow portion, where a width of the signal electrode on a substrate side is narrow, and a wide portion, where a width of the signal electrode on an upper portion side of the signal electrode is wide, a prevention film that is disposed in contact with the narrow portion of the signal electrode and that prevents the signal electrode from collapsing, is provided on the substrate, and at a position of the signal electrode where the narrow portion and the wide portion are connected, a surface of the prevention film is formed as a curved surface protruding toward the signal electrode, and a side surface of the signal electrode is formed along the curved surface.

An optical waveguide device includes a substrate on which an intermediate layer, a thin-film LN layer of lithium niobate, and a buffer layer are stacked; an optical waveguide formed in the thin-film LN layer; and a plurality of electrodes near the optical waveguide. The intermediate layer and the buffer layer contain a same material of a metal element of any one of group 3 of group 18 of a periodic table of elements.

An optical waveguide device has a substrate, an intermediate layer, a thin-film LN layer containing an X-cut lithium niobate, and a buffer layer stacked on the substrate, and an optical waveguide having a ridge shape formed in the thin-film LN layer. The optical waveguide device includes a plurality of electrodes provided, respectively, at a first side and a second side of the optical waveguide. The electrodes are disposed so that respective bottom surfaces thereof are at positions lower than a position of a surface of the buffer layer.

The present disclosure relates to a display panel. The display panel includes a display substrate, an opposite substrate, and a first adhesive layer and light guide layer located between the display substrate and the opposite substrate and stacked on each other. The first adhesive layer includes a photo-cured layer formed by curing a photocurable material layer. And the light guide layer is used to direct light to the photocurable material layer during the curing to form the cured layer.

An optical modulators is disclosed. The optical modulator includes a substrate, an optical waveguide formed on the substrate, a signal electrode formed on the optical waveguide via a first buffer layer and applying a modulation signal to the optical waveguide, and a bias electrode formed on the optical waveguide via a second buffer layer and applying a DC bias to the optical waveguide, the first buffer layer and the second buffer layer are formed in such a way that either one of the first buffer layer and the second buffer layer covers an end surface of the other one of the first buffer layer and the second buffer layer at a boundary part of the first buffer layer and the second buffer layer. Accordingly, an optical modulator with high reliability can be provided.

The present disclosure provides a binding backplane and a manufacturing method thereof, a backlight module and a display device. The binding backplane includes: a substrate; a first trace layer on the substrate; a planarizing layer on a side of the first trace layer away from the substrate; a second trace layer on the planarizing layer and including a connecting portion and a binding portion; a surface protective layer on the second trace layer away and exposing the binding portion; and a conductive reflection structure on a side of the surface protective layer close to the substrate, wherein the conductive reflection structure includes a grounding portion, a distance between a surface of the grounding portion away from the substrate and the substrate is not greater than a distance between a surface of the binding portion away from the substrate and the substrate.

Provided are a display device and a preparation method thereof. The display device includes a first substrate, where the first substrate includes a display portion and a bending portion located on at least one side of the display portion; and a second substrate, where the second substrate and the first substrate are disposed opposite to each other, the second substrate includes a first region portion corresponding to the bending portion, and the bending portion is bent towards one side facing away from the second substrate. A protective layer is provided between the bending portion of the first substrate and the first region portion of the second substrate and the bending portion of the first substrate is bent towards one side of the second substrate.