The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

Provided herein is an image focusing adjustment method, system, and module. A first image of a reference object is received in response to an input signal when the image focusing adjustment module is operating in a first state. The first image of the reference object is analyzed, based on which a plurality of adjustments to the image focusing adjustment module is controlled. The plurality of adjustments, performed by a plurality of actuators controlled by control module, include rotating a lens barrel assembly relative to a neck member along a first axis that causes a translational adjustment of the lens barrel assembly, rotating the neck member relative to a top member around the first axis that causes a rotational adjustment of the lens barrel assembly, and positioning a tilt adjustment member that causes tilt adjustment of the top member relative to a frame member along a second axis.

Provided herein is an image focusing adjustment method, system, and module. A first image of a reference object is received in response to an input signal when the image focusing adjustment module is operating in a first state. The first image of the reference object is analyzed, based on which a plurality of adjustments to the image focusing adjustment module is controlled. The plurality of adjustments, performed by a plurality of actuators controlled by control module, include rotating a lens barrel assembly relative to a neck member along a first axis that causes a translational adjustment of the lens barrel assembly, rotating the neck member relative to a top member around the first axis that causes a rotational adjustment of the lens barrel assembly, and positioning a tilt adjustment member that causes tilt adjustment of the top member relative to a frame member along a second axis.

The present disclosure provides a camera module, a circuit board assembly and a manufacturing method thereof, and an electronic device with the camera module, wherein the circuit board assembly comprises at least one electronic component, a substrate, and a molding unit. At least one of the electronic components is connected to the substrate conductively on a back face of the substrate. The molding unit comprises a back molding portion and a molding base, wherein the molding base is bonded to a front face of the substrate integrally when the back molding portion is bonded to at least a part of an area of the back face of the substrate integrally. There may be no need to reserve a position on the front face of the substrate to conductively connect the electronic components, so that the length and width of the camera module can be reduced, thereby reducing the volume of the camera module.

The imaging device includes a multiple-property lens that includes a first area having a first property and a second area having a second property different from the first property, an image sensor in which a first light receiving element 25A and a second light receiving element 25B having a different opening size of a light receiving section from the first light receiving element 25A are two-dimensionally arranged, and a crosstalk removal processing unit that removes a crosstalk component from each of a first crosstalk image acquired from the first light receiving element 25A of the image sensor and a second crosstalk image acquired from the second light receiving element to generate a first image and a second image respectively having the first property and the second property of the multiple-property lens.

The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.

A stage driving device includes a secured section; a movable section supported movably along a movement plane relative to the secured section; a driver including a magnet at one of the secured section and the movable section and a coil at the other one of the secured section and the movable section; a magnetic sensor at one of the secured section and the movable section provided with the coil, the magnetic sensor configured to detect a position of the movable section with respect to the secured section; and a magnetic body at the one of the secured section and the movable section provided with the coil, the magnetic body configured to make the position of the movable section stable with respect to the secured section in a direction perpendicular to the movement plane using a magnetic force that acts between the magnetic body and the magnet.

An image-capturing apparatus includes a controller configured to perform tilt control in which an image sensor is tilted about a rotation axis with respect to a plane orthogonal to an optical axis of an image-capturing optical system, a focus position determiner configured to determine a position of a focus lens, a first area detector configured to detect a first area corresponding to the rotation axis in a captured image, and a second area detector configured to detect a second area which is an area to be focused by the tilt control, wherein the focus position determiner determines a third area in which the first area and the second area overlap as a focus position before the tilt control, and wherein the controller performs the tilt control after the position of the focus lens is adjusted so that the third area is in focus.

The present invention discloses an array camera module and application thereof, wherein the array camera module comprises at least one optical lens and at least one circuit board assembly. The circuit board assembly further comprises at least one photosensitive chip, at least one circuit board, and at least one electronic component, wherein the photosensitive chip and the circuit board are conductively connected, at least one of the electronic components is attached to a back face of the circuit board, and the optical lens is held in a photosensitive path of the photosensitive chip. In this way, at least one of the length and the width of the array camera module can be reduced, so as to be beneficial to the miniaturization of the array camera module, so that the array camera module can be conveniently applied to a light-weighted and thinned electronic device.