A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.

A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.

The conductive film is arranged on the support and contains a binder and a metal portion, in which a position at which the contour line reaches the metal portion included in the thin conductive wire is set as an upper end position, and an average area ratio VA of the metal portion in a region ranging from the upper end position to 100 nm toward the support side is 1% or more and less than 50%, and a position at which the contour line reaches the thin conductive wire does not include the metal portion is set to a lower end position, and an average area ratio VM1 of the metal portion in a region ranging from a middle position between the upper end position and the lower end position to 50 nm toward the support side and to 50 nm toward the surface X side is 50% or more.

A method for producing a conductive film having a substrate and a conductive layer disposed on the substrate has a first step of forming a precursor layer on the substrate, the precursor layer including a metal component or its precursor, a water-insoluble polymer X having a cross-linking group, a water-insoluble polymer Y having a reactive group that reacts with the cross-linking group, and a water-soluble polymer Z different from polymer X and polymer Y; a second step of reacting the cross-linking group in the water-insoluble polymer X with the reactive group in the water-insoluble polymer Y; and a third step of forming the conductive layer by removing the water-soluble polymer Z.

A manufacturing method for a conductive substrate having a conductive thin wire with a thin line width and excellent conductivity in which the intersection growing is suppressed. The manufacturing method includes a step of forming a mesh-shaped underlying silver pattern on a side of one surface of a base material by a photographic method, a step of disposing a resist film on the side of the surface of the base material on which the underlying silver pattern is formed, a step of exposing the resist film by irradiation of light from a side of a surface of the base material on which the underlying silver pattern is not formed, a step of developing the exposed resist film to form a resist pattern, and a step of performing a plating treatment using the underlying silver pattern as a seed layer to form a metal pattern on the underlying silver pattern.