Methods and apparatus utilizing indium-based precursors in semiconductor manufacturing are disclosed. An example apparatus includes a substrate layer, the substrate layer to be included an integrated circuit package, and a photoresist on the substrate layer, the photoresist including indium.

Methods and apparatus utilizing indium-based precursors in semiconductor manufacturing are disclosed. An example apparatus includes a substrate layer, the substrate layer to be included an integrated circuit package, and a photoresist on the substrate layer, the photoresist including indium.