G03C1/805

FILM ASSEMBLY
20220035233 · 2022-02-03 ·

A film assembly for transferring an image to a surface includes a base layer, an ink layer that is removably adhered to the base layer, a developer layer that develops the ink layer and a transfer layer that is removably adhered to the developer layer, the transfer layer including the image that is configured to be transferred onto the surface. The base layer and the rear layer can be adhered together to form a rear layer. A frame layer can be removably adhered to the transfer layer. The ink layer can contain a non-toxic ink. The transfer layer can be manufactured with resilient materials. The frame layer can be removed from the transfer layer. The rear layer can be removed from the developer layer. The film assembly can be within a film assembly array of a plurality of film assemblies and can be disposed within a film assembly housing.

FILM ASSEMBLY
20220035233 · 2022-02-03 ·

A film assembly for transferring an image to a surface includes a base layer, an ink layer that is removably adhered to the base layer, a developer layer that develops the ink layer and a transfer layer that is removably adhered to the developer layer, the transfer layer including the image that is configured to be transferred onto the surface. The base layer and the rear layer can be adhered together to form a rear layer. A frame layer can be removably adhered to the transfer layer. The ink layer can contain a non-toxic ink. The transfer layer can be manufactured with resilient materials. The frame layer can be removed from the transfer layer. The rear layer can be removed from the developer layer. The film assembly can be within a film assembly array of a plurality of film assemblies and can be disposed within a film assembly housing.

Photosensitive polyimide compositions

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

Photosensitive polyimide compositions

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

Photosensitive polyimide compositions

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

Photosensitive polyimide compositions

This disclosure relates to a dry film structure that includes a carrier substrate, and a polymeric layer supported by the carrier substrate. The polymeric layer includes at least one fully imidized polyimide polymer.

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.

PHOTOSENSITIVE POLYIMIDE COMPOSITIONS

This disclosure relates to a photosensitive composition that includes at least one fully imidized polyimide polymer having a weight average molecular weight in the range of about 20,000 Daltons to about 70,000 Daltons; at least one solubility switching compound; at least one photoinitiator; and at least one solvent. The composition is capable of forming a film or a dry film having a dissolution rate of greater than about 0.15 micron/second using cyclopentanone as a developer.