Patent classifications
G03C1/95
Photographic Paper
A photographic paper comprising a base layer having an average surface roughness (Sa) of at least 0.7pm and an outer-most layer comprising a hydrophilic colloid binder and colloidal silica, wherein: (i) the weight ratio of colloidal silica to hydrophilic colloid binder in the outer-most layer is 0.05: 1 to 0.28:1; and (ii) the amount of colloidal silica present in the outer-most layer is in the range of 8 mg/m2 to 280 mg/m2. The photographic paper is useful for preparing ‘non-noisy’ photobooks.
Photographic paper
A photographic paper comprising a base layer having an average surface roughness (Sa) of at least 0.7 pm and an outer-most layer comprising a hydrophilic colloid binder and colloidal silica, wherein: (i) the weight ratio of colloidal silica to hydrophilic colloid binder in the outer-most layer is 0.05:1 to 0.28:1; and (ii) the amount of colloidal silica present in the outer-most layer is in the range of 8 mg/m2 to 280 mg/m2. The photographic paper is useful for preparing non-noisy photobooks.
Method of manufacturing substrate and substrate and mask film
A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.
Method of manufacturing substrate and substrate and mask film
A method of manufacturing a substrate includes applying solder resist ink containing a mixing resin of epoxy-based resin and acrylic-based resin on at least one surface of a substrate body to form a solder resist layer, and irradiating a predetermined portion of the solder resist layer with ultraviolet rays and controlling an amount of irradiation of the ultraviolet rays irradiated to the predetermined of the solder resist layer to form the predetermined portion in transmissivity that transmits light.